Presentation is loading. Please wait.

Presentation is loading. Please wait.

Andy Blue: on behalf of the Glasgow ATLAS upgrade group.

Similar presentations

Presentation on theme: "Andy Blue: on behalf of the Glasgow ATLAS upgrade group."— Presentation transcript:

1 Andy Blue: on behalf of the Glasgow ATLAS upgrade group

2 Replacing all the Silicon in the SCT Presentation will focus on the Si Strip detectors (also work at Glasgow on the upgrade to the pixel detectors) Major changes previous modules More Asics (now 20) Will be reduced to 10 @130nmCMOS More Strips 20*128*2=5120/module However, no fan in/link between Si Hybrids now glued directly ON to the Si

3 Taken from “Parameters of the phase2 ITK Draft 27.5.2012” Layer 1: 28 staves (at r = 412) [Short @ 2.4cm] Layer 2: 40 staves (at r= 555) [Short @ 2.4cm] Layer 3: 48 staves (at r=698) [Long @ 4.8cm] Layer 4: 60 staves (at r=866) [Long @ 4.8cm] Layer 5: 72 staves (at r=996) [Long @ 4.8cm] =248 Staves in total The number of modules in stave = 26 6448 modules in 3 years (150 weeks) 42.986modules per week 8.597 modules per day for all module building groups Assumes 100% yield!

4 1) Glue ASICS on to a FR4 strip (‘Hybrid’) Wire bonds for ASIC-ASIC 2) Glue 2 Hybrids onto a Si sensor (‘Module’) Wire bond from ASIC to Si Strips

5 Goal is to accurately glue 20 Si CMOS chips on to a FR-4 based panel to make a Hybrid

6 Place ASICs in holder (Machined acetal with metal top)

7 Attach a vacuum jig to the holder

8 Apply a stencil and spread glue evenly on back to leave 5 spots per asic

9 Place vacuum jig on to FR4 board and apply a brass weight to cure the glue

10 Goal is to glue to Hybrids (shown before) to a Silicon sensor

11 Frame is placed on a jig, then Silicon sensor placed in frame (held by small lip round edge of frame)

12 A cardboard stencil is placed on top of the Si sensor and glue is spread Glue used is an epolite epoxy

13 2 hybrid pick up tools are then attached to the module jig

14 Hybrid Building Wire Bonding Readout


16 Bonding Purchased and installed Bondjet 820 Fully wire bonded our first hybrid panel Wire bonded 1 st half of module Successfully bonded trial of new pitch for modified module design

17 HSIO FPGA development board Runs SCTDAQ software Can test Hybrids Modules Stavelets (multiple modules)

18 Testing both hybrids and modules now at Glasgow



21 Test hybrids bonded at Glasgow Begin construction of Modules Test Begin QA and full assembly structure Get ready for pre production

Download ppt "Andy Blue: on behalf of the Glasgow ATLAS upgrade group."

Similar presentations

Ads by Google