Presentation on theme: "Andy Blue: on behalf of the Glasgow ATLAS upgrade group."— Presentation transcript:
Andy Blue: on behalf of the Glasgow ATLAS upgrade group
Replacing all the Silicon in the SCT Presentation will focus on the Si Strip detectors (also work at Glasgow on the upgrade to the pixel detectors) Major changes previous modules More Asics (now 20) Will be reduced to 10 @130nmCMOS More Strips 20*128*2=5120/module However, no fan in/link between Si Hybrids now glued directly ON to the Si
Taken from “Parameters of the phase2 ITK Draft 27.5.2012” Layer 1: 28 staves (at r = 412) [Short @ 2.4cm] Layer 2: 40 staves (at r= 555) [Short @ 2.4cm] Layer 3: 48 staves (at r=698) [Long @ 4.8cm] Layer 4: 60 staves (at r=866) [Long @ 4.8cm] Layer 5: 72 staves (at r=996) [Long @ 4.8cm] =248 Staves in total The number of modules in stave = 26 6448 modules in 3 years (150 weeks) 42.986modules per week 8.597 modules per day for all module building groups Assumes 100% yield!
1) Glue ASICS on to a FR4 strip (‘Hybrid’) Wire bonds for ASIC-ASIC 2) Glue 2 Hybrids onto a Si sensor (‘Module’) Wire bond from ASIC to Si Strips
Goal is to accurately glue 20 Si CMOS chips on to a FR-4 based panel to make a Hybrid
Place ASICs in holder (Machined acetal with metal top)