1. Dummy and Pad Chips Needed for various activities (interconnection tests, mass tests, assembly,…) Production of masks, processing, thinning and dicing of wafers presumably takes about 2-3 months. Pad chips 15 mm x 30 mm 50 um thick Metal pads and traces on SiO 2 /Si Daisy chain connections Dummy chips 15 mm x 30 mm 50 um thick Blank silicon WP6 meeting 16/01/14 - P. Riedler

2. Component status Some chips left of each type, but not sufficient for the activities in 2014! Collect needs from the different activities and start producing dummy + pad chips – WP4,6,7,8,9 Next: Purchase wafers for dummy and pad chips Thin and dice wafers for dummy chips Pad chips: define layout and produce patterned wafers followed by thinning and dicing WP6 meeting 16/01/14 - P. Riedler

3. Pad chips – main parameters tbd Chip dimension: Approximately 15 mm x 30 mm (tbc) – Studies on stave arrangement and new beam-pipe ongoing – Study the possibility to use the full reticle length (32 mm) Number of pads: Assume 88 contacts (32 VDDD, 32 VDDA, 8 SUB, 8 DATA, 4 CLK, 4 Conf) – Feed-back from FPC design needed (e.g. distance of pads from the edge, etc.) Pad positions: Should be as close as possible to final layout (TDR version) File ready soon Pad form: Square or octagonal preferred over round pad form – Impact of the pad form on soldering needs to be evaluated on dummy chips Pad diameter: Has to take into account the alignment precision of the holes on the FPC Tentative diameters: 250, 300 and 350 um to be evaluated on dummy chips WP6 meeting 16/01/14 - P. Riedler

4. Question: How many components are needed for the activities in WP6: # of dummy chips # of pad chips needed WP6 meeting 16/01/14 - P. Riedler

5. WP4Laser solderingTab bondingPost-processingMass test EvaluationPad form Test of metallurgy and supplier PALPIDE-FS for contact tests Pad size ResultsEl. tests+ metallurgical analysis Single chip assemblies IB+OB HIC # chips needed WP6 meeting 16/01/14 - P. Riedler