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FPC1011F Introduction of a new sensor package. Summary: FPC has invested + 1 000 KUSD High quality design Electrically compatible with FPC1011C Available.

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Presentation on theme: "FPC1011F Introduction of a new sensor package. Summary: FPC has invested + 1 000 KUSD High quality design Electrically compatible with FPC1011C Available."— Presentation transcript:

1 FPC1011F Introduction of a new sensor package

2 Summary: FPC has invested KUSD High quality design Electrically compatible with FPC1011C Available as solderable component New high quality supplier chain Production start June 2008 FPC1011F

3 Product improvements: BT substrate + High quality FR4 + No silver migration or oxide - May need mechanical support from underneath FPC1011F

4 Product improvements: BT substrate Film Assisted Moulding + Standard mould method + Embedded passives + Protects silicon edges FPC1011F

5 Product improvements: BT substrate Film Assisted Moulding Flex film contact + Custom design of flex film (length etc.) - Sourced by customer FPC1011F

6 Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA + Enables automated assembly process + Low cost FPC1011F

7 Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA New hard coating + Mass production process, applied on wafer + Not sensitive to scratches, - May give ESD footprint under extreme conditions FPC1011F

8 Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA New hard coating - May give ESD footprint under extreme conditions: FPC1011F Strong ESD discharge from test electrode (>7.5KV) => Coating surface may be affected by oxygen plasma reaction => May be detected in image from extremely wet fingers. Disappears over time (typically by 30% after 3 days) Conditions for possible appearance: & Low humidity, typically northern China (may bring high voltage ESD discharges), & High humidity, typically southern China (may bring wet skin properties), & Electrode approach from top & discharge via sensor surface. Not observed by live finger discharge.

9 Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA New hard coating Metal frame + More robust versus plastic frame in FPC1011C + Available in different forms + Colour and surface conditions (default Satine finish metal colour) - Needs minimum order quantity FPC1011F

10 Product improvements: BT substrate Film Assisted Moulding Flex film contact Available for soldering with BGA New hard coating Metal frame available in different forms FPC1011F

11 Production improvements: Assembly managed by Amkor + No. one package supplier world wide Full automated production process + High volume capacity + Repeatable high quality process Well defined qualification process + High product quality - Longer product change time New Supplier chain

12 Production process: Silicon production New Supplier chain

13 Production process: Silicon production Coating New Supplier chain Spin coating process

14 Production process: Silicon production Coating Packaging New Supplier chain Wafer dicing Die attach Wire bonding Passives FIM mould Frame assembly Flex contact assembly Test & outgoing inspection

15 Customer feedback: Questions? Acceptable product? Thank you for your attention ! FPC1011F


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