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Furnaces and Wet bench area Savitha P. Wet bench Currently has two wet benches – one exclusively for CMOS processes Two hours slots TMAH and KOH etching.

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Presentation on theme: "Furnaces and Wet bench area Savitha P. Wet bench Currently has two wet benches – one exclusively for CMOS processes Two hours slots TMAH and KOH etching."— Presentation transcript:

1 Furnaces and Wet bench area Savitha P

2 Wet bench Currently has two wet benches – one exclusively for CMOS processes Two hours slots TMAH and KOH etching slots longer Booking for electrodeposition needs wet benches CeNSe booking includes lab courses, hands-on training sessions, Electrodeposition slots Also, slots for users unable to book themselves/multiple users Total usage = 15%

3 Wet bench - Maintenance Weekly one slot for cleaning Process run sheets for monthly monitoring of – Silicon etches – TMAH & KOH – Oxide etching – Electrodeposition

4 Furnaces Dry & Wet oxidation Metal and Polymer annealing Phosphorus & Boron diffusion Wet oxidation is the most heavily used Total usage Wet oxidation: 26% Dry oxidation: 20% Boron diffusion: 25% Phosphorus diffusion:16%

5 Furnace optimization All oxide thickness/doping levels Vs different temp profiles measured once in 6 months (Eg.Dry oxdn) Process run sheets for monthly monitoring of process Thickness (Ao)

6 Issues Needs urgent maintenance – Annealing N2 contains water – Exhaust problem for POCl3 process Buy Phosphorus doping discs – Boron/ wet oxidation Problems with temperature control – Dry oxidation Unable to attain 1000deg C – Metal annealing furnace Needs better control on usage

7 Dektak and 4-probe measurement Dektak heavily used – Multiple layer etching – Silicon etching – Thick deposition layer thickness – Surface roughness 4-probe measurements – Used mainly after “p & n” doping

8 Issues Dektak – Old model: no servicing available – No provision for copying the data Needs floppy disks Urgent need for a new one (Dektak XT -2011) Need to monitor the samples being measured – Rough handling by outsiders – Regulate users?

9 Dektak XT-2011 Capability of evaluation depths from 10nm to 1mm Self-aligning styli enables effortless tip exchange (Stylus radius options from 50nm to 25microm) True-color HD optical camera Fast – can measure 3D scans and stress levels of films


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