1. NA62 GigaTracKer Working Group meeting Integration and GTK-carrier PCB design April 9, 2013 Michel Morel

2. April 9, 20132Giga Tracker Working Group meeting M. Morel Outline Integration of the GTK carrier in vessels CAEN 3009K low voltage power supply tests Simulations on GTK carrier 1.Q3D extractor 2.Power Distribution Network 3.Designer tool Conclusion Next steps

3. April 9, 2013Giga Tracker Working Group meeting M. Morel3

4. April 9, 2013Giga Tracker Working Group meeting M. Morel4 Integration of the GTK carrier in GTK3 mockup

5. April 9, 20135Giga Tracker Working Group meeting M. Morel CAEN 3009K low voltage power supply

6. April 9, 2013Giga Tracker Working Group meeting M. Morel6 CAEN 3009K First module delivered in February 12 channels Sense wires 0.5V to 2V 9A

7. April 9, 2013Giga Tracker Working Group meeting M. Morel7 Noisy channels: 4 and 7 No flag: channel #9

8. April 9, 2013Giga Tracker Working Group meeting M. Morel8 Active Load Filter EMI receiver Current probe Patch Panel Test setup and instruments CAEN 3009 Easy crate

9. April 9, 20139Giga Tracker Working Group meeting M. Morel

10. April 9, 2013Giga Tracker Working Group meeting M. Morel10 15m of 0.5mm² twisted cable (non shielded) Current: 280mA Voltage: 1.2V Voltage drop in the cable: 700mV VDDA conducted noise emissions Quasi-peak Average 1µA= 0 dBµA so 30dBµA=31.62µA

11. April 9, 2013Giga Tracker Working Group meeting M. Morel11 GTK carrier simulations using Ansys™ software

12. April 9, 2013Giga Tracker Working Group meeting M. Morel12 P1 P2 T1 T2 GND1 GND2 Glue:8µ 4350B:167µ 4350B:100µ P1-P2 Width=130µ Space=100µ Coverlay:12+12µ T1-T2 Width=100µ Space=90µ Coverlay:glue= 3 + cl= 12µ Less glue on top of wires Q3D extractor

13. April 9, 2013Giga Tracker Working Group meeting M. Morel13 Microstrip line (real shape) with glue + coverlay W= 130µ S= 100µ Coverlay: 12µ Glue: from 3 to 12µ Substrat: Rogers 4350B

14. April 9, 2013Giga Tracker Working Group meeting M. Morel14 Striplines (real shape) W= 100µ S= 90µ Substrat: Rogers 4350B

15. April 9, 2013Giga Tracker Working Group meeting M. Morel15 TEST_PULSE, RESET_GLOBAL and RESET_COARSE_FRAME_COUNT signals

16. April 9, 2013Giga Tracker Working Group meeting M. Morel16 CLK_DLL and CLK_dig

17. April 9, 2013Giga Tracker Working Group meeting M. Morel17 TDCpix chip symbol

18. April 9, 2013Giga Tracker Working Group meeting M. Morel18 Strip lines are routed in inner layer (yellow traces) Microstrip lines are routed on TOP layer (green traces)

19. April 9, 2013Giga Tracker Working Group meeting M. Morel19 The Power Distribution Network

20. April 9, 2013Giga Tracker Working Group meeting M. Morel20 Voltage drops on 1.2V Dig and 1.2V Analog planes The goal of PDN is to keep a low impedance from the chip to the Power Supplies

21. April 9, 2013Giga Tracker Working Group meeting M. Morel21 Voltage sources: 1.2V Dig and 1.2V Analog GND 1.2VDD 1.2VDDA VDD_S+ VDDA_S+

22. April 9, 2013Giga Tracker Working Group meeting M. Morel22 Sinks on the TDCpix20130320 chip VDD_dig: 940mA/13 bonds ~ 75mA (from 45 to 102mA / GND from 42 to 105mA) VDD_TDC: 567mA/9 bonds ~65mA (from 53 to 77mA / GND from 54 to 78mA) VDD_SLVS: 50mA/5 bonds ~10mA VDD_PLL: 88mA/ 2 bonds ~44mA VDD serial0_1: 150mA/ 6 bonds ~25mA VDD serial2_3: 150mA/6 bonds ~25mA VDD temp: 1mA / 1 bond ~1mA

23. April 9, 2013Giga Tracker Working Group meeting M. Morel23 1.166V: 34mV 1.188V: 12mV 1.2VDD 1.2VDDA GND Voltage drops on 1.2V Dig and 1.2V Analog

24. April 9, 2013Giga Tracker Working Group meeting M. Morel24 Voltage drops in the bonding wires 1.166V 1.152V 14mV VDD 1..188V 1.185V 3mV on VDDA 3~7mV on GND

25. April 9, 2013Giga Tracker Working Group meeting M. Morel25 Current density in the power planes and bonding wires

26. April 9, 2013Giga Tracker Working Group meeting M. Morel26 1.192E8 A/m² = 119.2µA/µ² 4.45E-5 A/m² 4.856E7 A/m² 183µA/µ² Current density in the bonding wires

27. April 9, 2013Giga Tracker Working Group meeting M. Morel27

28. April 9, 2013Giga Tracker Working Group meeting M. Morel28 Impedance response of VDDA4 and VDD4 on TDCpix U5 (bare Board) VDD4@1.945A VDDA4@0.272A

29. April 9, 2013Giga Tracker Working Group meeting M. Morel29 20mm sensor TDCpix GTK carrier Restrained space on top layer due to signals connectivity. Inaccessible area on bottom side due the cooling plate dimensions. Cooling plate GTK carrier cross section

30. April 9, 2013Giga Tracker Working Group meeting M. Morel30 Designer tool

31. April 9, 2013Giga Tracker Working Group meeting M. Morel31 Serial_out43 AMI simulations @ 3.2Gb/s

32. April 9, 2013Giga Tracker Working Group meeting M. Morel32 Serial_out43 Diff S parameters Input reflection(S11) Transfer response (S21)

33. April 9, 2013Giga Tracker Working Group meeting M. Morel33 Stub to stub reflection at 2*tpd Impulse response

34. April 9, 2013Giga Tracker Working Group meeting M. Morel34 Rise time Fall time Voltage Bathtub Quick Eye Analysis

35. April 9, 2013Giga Tracker Working Group meeting M. Morel35 The GTK carrier could be integrate in the GTK3 without modification of the board. Tests on the 3009K module brought to the fore problems on few channels Simulations of the GTK carrier show the feasibility of the board Conclusion

36. April 9, 2013Giga Tracker Working Group meeting M. Morel36 Next steps Integrate the new GTK carrier with the flange in the vessel. Continue the tests on the 3009K power supply as soon it will be back. Continue the simulations of the GTK carrier (decoupling and filtering) Test the functionality of the miniPOD at low signal rate.

37. April 9, 2013Giga Tracker Working Group meeting M. Morel37 Spare slides

38. April 9, 2013Giga Tracker Working Group meeting M. Morel38 15m of 2.5mm² twisted cable (non shielded) Current: 280mA Voltage: 1.2V Voltage drop in the cable: 100mV VDDA conducted noise emissions

39. April 9, 2013Giga Tracker Working Group meeting M. Morel39 15m of 2.5mm² Current: 2A Voltage: 1.2V Cable unrolled Voltage drop in the cable: 520mV VDD conducted noise emissions

40. April 9, 2013Giga Tracker Working Group meeting M. Morel40 SNAP12 (TYCO)MiniPOD (AVAGO) Cost:~ 400$~ 200€ and 287€ + ribbon cable 85$ Max Signal rate: Min: 12 x 3.125 Gbps 1 Gbps 12 x 10.31 Gbps 1.25 Gbps AC coupling: 100nF recommended33pF Embedded in Tx Surface:810mm²410mm² Fiber:Up to 200m @3.125GbpsUp to 100m @ 10Gbps* Optical interface:Standard MPO/MPT ribbon fiber connector -1x12 ribbon cable connector -Round cable Test with 300m MMOK with OM3 Power consumption:1.5W2W Power supplies:VCC33:450mAVCC25: 450mA, VCC33: 500mA EQ setting (8 possibilities) SNAP12 versus MiniPOD https://edms.cern.ch/file/1184765/1/NA62_MiniPOD_test_report_v4_CSoos.pdf *

41. April 9, 2013Giga Tracker Working Group meeting M. Morel41 Current density in the bonding wires