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7 Novemeber 2014 Name 1 This report was submitted in compliance with the UNCC Code of Student Academic Integrity (2003-05 UNCC Catalog, p 276) AB OP.

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Presentation on theme: "7 Novemeber 2014 Name 1 This report was submitted in compliance with the UNCC Code of Student Academic Integrity (2003-05 UNCC Catalog, p 276) AB OP."— Presentation transcript:

1 7 Novemeber 2014 Name 1 This report was submitted in compliance with the UNCC Code of Student Academic Integrity (2003-05 UNCC Catalog, p 276) AB OP

2  A solar cell uses the photovoltaic effect to convert sun light into usable electricity.  The goal in this class was to fabricate a silicon solar cell in the Cameron clean room using existing equipment and processes. 2

3 3 As fabricated the Cameron clean room (Al)

4  A safety test must be completed and passed before entering the clean room.  Chemical gloves are worn when handling any chemical.  Chemicals are disposed of properly and in the correct containers.  Material Safety Data Sheets are placed in each room with harmful chemicals.  Safety shower and eye wash are placed in case of a chemical spill on a person. 4

5  Different tweezers are placed in each station.  Special garments are worn at all times while inside the clean room.  Clean room is kept filtered to keep as much dust out as possible.  Sticky floor mats are placed at all entrances to the clean room to get dirt off of shoes. 5

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7 7 4 Point Probe Chemical Cleaning PECVD – Backside SiO2

8 8 4 Point Probe Photolithography Front Side Conductor Deposition Diffusion in Furnace

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10 10 Annealing Furnace – 450C Wafer Dicing Sputtering Tool – Backside Deposition PECVD - Antireflective SiO2

11 11 Cell placed on test plate with probe on center bus Cell is illuminated by the test lamp – Original test was done at 0.93 sun Second test was done at.88 sun Air mass filter was 1.5 for both tests Test results appear as an IV plot on the computer Small cell in testing Large cell in testing

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14 Large Cell Voc0.6 V Isc140 mA Vmp0.25 V Imp75 mA Max current150 mA Size6.0588 cm^2 Fill factor0.223 Jsc23.107 mA/cm^2 Efficiency3.33% 14

15  One wafer was broken while being removed from the furnace.  One wafer exhibited signs of a leaky diode – possibly from spinning dopant multiple times due to dust appearing on wafer.  One wafer tested normal. 15


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