Presentation is loading. Please wait.

Presentation is loading. Please wait.

RO400FC Forced convection hot air reflow oven. In a flexible production, what do you need for soldering of  Complex PCB’s  Soldering of fine pitch on.

Similar presentations


Presentation on theme: "RO400FC Forced convection hot air reflow oven. In a flexible production, what do you need for soldering of  Complex PCB’s  Soldering of fine pitch on."— Presentation transcript:

1 RO400FC Forced convection hot air reflow oven

2 In a flexible production, what do you need for soldering of  Complex PCB’s  Soldering of fine pitch on BGA components  Lead free soldering  High quality soldering results  Efficient heat transfer technology  Low delta T values  Even temperature distribution  Short and easy setup and change over  Precise temperature profiles  Controlled and repeatable process conditions

3 Requirements  In a flexible production, what do you need for soldering of  Complex PCB’s  Soldering of fine pitch on BGA components  Lead free soldering  High quality soldering results  Requirments:  Efficient heat transfer technology  Low delta T values  Even temperature distribution  Short and easy setup and change over  Precise temperature profiles  Controlled and repeatable process conditions

4 RO400FC hot air full convection reflow oven  Real convection reflow technology  For standard or lead free soldering  Efficient heat transfer  Low thermal stress  Microprocessor control  Integrated temperature profiling  Windows profiling software  SMEMA interface  Small footprint  Easy profile selection and programming  Mesh belt, chain or double chain conveyor

5 Real convection reflow technology  No visual contact between heat  Emitter and substrate  Even temperature distribution  Maximum temperature is  Air temperature  No hot spots, no heat shadows  Heating independent of component color  Suitable also for complex boards

6 Vertical laminar flow  Efficient heat transfer allows standard or lead free soldering  High volume / low temperature technology  Unique hole pattern ensures even air flow  Low thermal stress on components  No component shifting even for smallest components  High throughput on small footprint 0,4-0,6m/min 

7 5 zone reflow profile  4 top zones, 1 additional bottom convection module in the reflow zone  Each module individually controlled  Each module with high volume blower  Bottom heat module can be turned off for 2nd side soldering  Heated length 1680mm  Double fan cooling zone  Cooling length 640mm

8 Integrated microprocessor control  20 preset profiles for soldering, lead free soldering and curing  8 free programmable profiles for special applications  Easy profile selection for fast setup and change over  Easy programming  Precise temperature regulation  Closed loop controlled DC motor drive for conveyor  Actual and set process parameters displayed on LCD

9 Temperature regulation on substrate level  Temperature of each zone measured at PCB level  Control of PCB heat load  Repeatable soldering conditions  No risk of burned PCB’s  Tight temperature regulation within +/- 3°C

10 Mesh belt conveyor  Universal mesh belt conveyor for highest flexibility  Sinus type support rails for low wear on mesh belt  Self tensioning system for belt  PCB width up to 400mm

11 Chain conveyor  Small-radius chain conveyor for inline applications  Ideal for single and double sided PCB’s  Motorized width adjustment with scale  Adjustable middle support rail  Support rail can be lowered if not required  Chain oilers for long life time  Double chain system available for parallel production of 2 PCB’s (e.g. prototype on the second line)  SMEMA interface available for inline connection

12 Security system  Emergency stop on both ends of the oven  Security switch within hood turns off heaters if cover is open  Overheat security switches in all heating zones

13 Other features  All electronics accessible from the front  Gas spring supported hood  Two integrated exhaust connections  Slide out unit for soldered PCBs

14 Flying thermocouples  Temperature recording without additional measuring device  Monitoring of measured temperatures directly on LCD display  Temperatures together wit zone temperatures can be monitored with ROSOFT profiling software

15 Ro-soft profiling software  RS-232 connection  Online temperature profiling  Storage of measured temperatures  Documentation of process conditions  Profile comparison

16 Additional options  Three color signal tower for status indication  Monitor and keyboard stand  Counting sensor  Entry and exit sensor for SMEMA connections  Slide out plate for finished boards

17 Complete SMT production line from one source  Select one partner for all SMD production line equipment  Profit from a worldwide service and support network  Benefit from our large process know how in SMT assembly  Win a partner for your complete SMT production Pick+Place Printer Dispenser Reflow Oven Handling Systems Planning Systems Contact us! www.essemtec.com


Download ppt "RO400FC Forced convection hot air reflow oven. In a flexible production, what do you need for soldering of  Complex PCB’s  Soldering of fine pitch on."

Similar presentations


Ads by Google