1. Spring semester (4/2009) High Speed Signal Processing Board Design By: Nir Malka, Lior Rom Instructor: Mike Sumszyk הטכניון - מכון טכנולוגי לישראל הפקולטה להנדסת חשמל המעבדה למערכות ספרתיות מהירות Characterization report

2. Table of contents  Project Goals  Part A Goals  High speed  Current High Speed Technology  Altera DE3  Block Diagram  A/D & D/A  Signal Integrity  Time table Spring semester (4/2009)

3. Project goals  Design, implement and debug a high speed analog to digital daughter board which interfaces to Altera DE3.  Part A: implement a daughter board  that can sample at high speed an analog signal and transfer it to the DE3  that can receive a wide band digital signal from the DE3 and convert it an analog signal  Part B Implement a real time signal processing algorithm on the FPGA, which will process an analog input from the daughter board. Spring semester (4/2009)

4. Part A Goals  Study the architecture of Altera DE3.  Study the components and interfaces of the daughter board.  Orcad Design.  Layer Design of the PCB.  Validation of the daughter board. Spring semester (7/2008)

5. High Speed Spring semester (7/2008) Bit rate examples- Audio 8 kbit/s – telephone quality 8 kbit/s – telephone quality 32 kbit/s – AM quality 32 kbit/s – AM quality 96 kbit/s – FM quality 96 kbit/s – FM quality 224–320 kbit/s –CD quality. 224–320 kbit/s –CD quality.Video  1.25 Mbit/s – VCD quality  5 Mbit/s – DVD quality  15 Mbit/s – HDTV quality  36 Mbit/s – HD DVD quality  54 Mbit/s – Blu-ray Disc quality Video camera  530 Mbit/s – Pixel size- 1280*720 with 30fps framerate. (RGB)

6. Current High Speed Technology  LVDS - Low-voltage differential signaling, is an electrical signaling system that can run at very high speeds over inexpensive twisted pair copper cables  CML- Current mode logic is a differential digital logic family intended to transmit data at speeds between 312.5 Mbit/s and 3.125 Gbit/s over a standard printed circuit board.  LVPECL- Low-voltage positive emitter-coupled logic is a power optimized version of the positive emitter – coupled logic (PECL) technology, requiring a positive 3.3V instead of 5V supply. LVPECL is a differential signaling system and mainly used in high speed and clock distribution circuits. Spring semester (7/2008)

7. Current High Speed Technology Spring semester (7/2008) We will use the LVDS technology for it’s low power consumption and The compatible Altera DE3 interface

8. Altera DE3 Spring semester (4/2009) The following hardware is implemented on the DE3 board: Altera Stratix® III FPGA device (3SL150.........) with 142,000 logical elements. the highest speed I/O transmission reaches 1.25…..1.6 G bps (top limitation of Stratix III). High speed expansion Interface: 8 HSTC connectors Two 40-pin Expansion Headers Memory Interface DDR2 SO-DIMM socket – (up to 4 GB) SD Card socket – 512MB

9. True and Emulated LVDS

10. HSTC Connectors Spring semester (4/2009) Technologies. (J1 ~ J8), which can be used to connect the Stratix III FPGA with daughter boards. Bank 1 supports True LVDS on both RX and TX. Bank 2 and 3 supports True LVDS on RX. The High Speed Terasic Connector (HSTC) is a high speed expansion interface defined by Terasic The DE3 board is equipped with 8 HSTC connectors There are three banks on a HSTC connector

11. Critical questions   Can we use emulated LVDS pins?   Can we use at the same time true and emulated LVDS pins? Can this involve synchronization problems?   In case we use several HSTC connectors, how can we handle the synchronization problems?

12. Highspeed A/D and D/A Daughter Board   Dual AD channels with 14-bit resolution and data rate up to 65 MSPS.   Dual DA channels with 14-bit resolution and data rate up to 125 MSPS.   Dual interfaces include HSMC and GPIO, which are fully compatible with Cyclone III Starter Kit and DE1/DE2/DE3, respectively   Made by Terasic, price 219$.

13. Block diagram High Speed signal processing Board Analog Input Circuit ADC Analog Output Circuit DAC DE3 (Digital Processing) Analog signal Digital signal Analog Input Analog Output HSTC

14. AD9211- 10-Bit, 300 MSPS Main Features: LVDS at 300 MSPS. 700 MHz full power analog bandwidth. Input Voltage range- 1v- 1.5V, nominal 1.25v. 1.8V analog and digital supply operation.

15. AD9780- 12-Bit, 500 MSPS Main Features: LVDS inputs with dual- port Sample rates of up to 500 MSPS Operates from 1.8 V and 3.3 V supplies. Input Voltage range 0.8V-1.6V

16. SiI 1161 Receiver   The SiI 1161 receiver uses PanelLink Digital technology to support high-resolution displays up to UXGA (25- 165MHz). This receiver supports up to true color panels (24 bits per pixel, 16M colors) with both one and two pixels per clock.   3.3V operation

17. SiI 1162 Transmitter   The SiI 1162 transmitter uses PanelLink® Digital technology to support displays ranging from VGA to UXGA resolutions in a single link interface. The SiI 1162 transmitter uses a 12-bit interface, taking in one half-pixel per clock edge.   Low Voltage Interface: 3.0V to 3.6V range and 1.0 to 1.9V range.   Scaleable Bandwidth: 25 - 165 Mps

18. Signal Integrity Spring semester (7/2008) Some of the main issues of concern for signal integrity are: Overshoot Overshoot Jitter Jitter Cross-talk Cross-talk Ringing Ringing Ground bounce Ground bounce

19. Time Table Spring semester (4/2009) Due DateStatus Study Signal integrity, similar project’s, LVDS, DE3. Done Study the components and interfaces of the daughter board. (2 weeks) and LVDS connections on Stratix III 25.5.09In progress Orcad Design:  Analog input & output (1 week)  A/D & D/Aconvertors Voltage supply (1 weeks)  HSTC connector (3 week)  2.6.09  16.6.09  23.6.09

20. Time Table Study Signal integrity, similar project’s, LVDS, DE3. Study Signal integrity, similar project’s, LVDS, DE3.  Study the components and interfaces of the daughter board. (2 weeks)  Orcad Design:  Analog input & output (1 week)  A/D & D/A convertors (2 weeks)  HSTC connector (1/2 week)  Voltage supply (1/2 week) Spring semester (4/2009)

21. Project Overview Sample Real Time Digital Processing (DE3) Reconstruction Analog Input Analog Output Spring semester (4/2009)

22. Technical Requirements  Analog Input-  Sampling frequency - 250 Mhz  Voltage- TBD  Analog Output-  Voltage- TBD  External Clock-  Frequency - TBD  Voltage- TBD  Self Test  D/A & A/D Spring semester (4/2009)

23. Altera DE3 Block Diagram Altera DE3 Block Diagram Spring semester (4/2009)