1. Welcome to the Aerospace Instrumentation and Controls Collaboration Forum Ohio Aerospace Institute, 22800 Cedar Point Road, Cleveland, OH 44142 For The Building Blocks of Smart Sensors and other Technologies for Distributed High Temperature Intelligent Integrated Controls Networks for Aerospace Applications 25 August, 2011 Smart Sensors for Distributed Controls Mr. Dewey Benson Honeywell International

2. DECWG plans DECWG plans Possible Areas of Collaboration Possible Areas of Collaboration Topics – For This Section

3. Develop requirements for: Engine-level architecture  Open, scalable –Allow any engine manufacturer to design an engine-level distributed system Node-level  Flexible, scalable node design –Allow anyone making high temperature electronic parts or assemblies to be able to plug into the engine-level system Develop high temperature electronics to enable distributed controls Scalable, flexible to accommodate several network configurations Demonstrate a complete system In a Hardware-In-The-Loop environment On an engine Develop industry base of suppliers and users of high temp electronics Sustainable, supports decades long aero applications What Does The DECWG Want To Do?

4. The Evolution of Engine Control Architecture F EDERATED D ISTRIBUTED COLD HOT M ORE D ISTRIBUTED N ETWORK A NALOG L OWER W EIGHT L EGACY E FFECTORS S MART E FFECTORS A NALOG FADEC C ORE -M OUNTED W ITH A CTIVE C OOLING M ORE E MBEDDED, M ORE M ODULAR C ONTROL L AW P ROCESSOR O FF E NGINE D ATA C ONCENTRATOR C ORE -M OUNTED, U NCOOLED N ETWORK FADEC BECOMES CARD IN AVIONICS What is Distributed Engine Control Architecture?

5. Requirements for Distributed Controls Thermal Environment Generic Physical/Functional Interface Rapid Reconfiguration / Upgradability Certification Integration Testing Cost targets that allow commercial viability Focus on Near-Term Objectives Leverage commercial applications with production volumes Design for flexibility on multiple applications

6. Considerations for Certifying a Distributed Engine Control Architecture Different from the Norm –Failure Modes Loss of Power Single Point/Multi Point Failures Software –Unintended Interactions Latency Data Integrity –Increased Connections Reliability –Potential Harsher Environment Smart nodes in hot section –Communications Protocol(s) Coordination of multiple protocols? –EMI/HIRF/Lightning Susceptibility –Software Validation (DO-178B) –Dispatchable failures? Must Be As Good As Current Architecture

7. Same set of SOI parts scaled from smart sensors to single loop module to complete core data concentrator Leverage commonality & quantity to drive down cost Common Set of High Temp Parts Allows Scalable Hi-T Controls DECWG Objective – Leverage a Common Set of Parts To be handled by FC power supply Data Concentrator Node Signal Cond. MUX A-to-D D- -A Processor Power Supply A BA P3,T3 DP N2 LVDT Fuel Temp Fuel Press Torque Motor Overspeed Signal Cond. Signal Cond. Gate Array

8. Sensor I/O needs Electronic HW needs Wireless radio Programmability needs Smart sensors Collaboration Opportunities DECWG PIWG + Other “wigs” System/Node Specs Comm/Network Stds Power Stds Electronic parts Host for System Demo

9. Fan HPC HPT LPT LPC Fan HPC HPT Power Pre-cond A Comm Hub A Power Pre-cond B Comm Hub B Aircraft Computing Resource Aircraft Computing Resource Node-1 A Node-1 B Node-2 A Node-2 B Node-3 A Node-3 B Is there a preferred network architecture? Example: Redundant linear bus One transceiver per node Supports Command and respond TDMA round Other Physical Layer LVDS RS-485 1394 Plus others below Possible protocols 429, Flexray Simplified TTP Simplified TT-Ethernet Simplicity versus fault tolerance No single point failure recovery

10. Fan HPC HPT LPT LPC Fan HPC HPT Power Pre-cond A Power Pre-cond B Comm Hub B Aircraft Computing Resource Aircraft Computing Resource Node-1 A Do we need mixed network capability? Example: Braided Ring + Comm-Over-Power + Wireless Node-3 A Can high temp digital electronics enable a 2-wire interface? Wireless interfaces? Which architecture provides best availability? Node-4 B Node-4 A Node-3 B Node-2 B Node-2 A Node-1 B Comm Hub A Sensor Comm over Power for smart sensors 2 wire comm + power network Wireless Sensors And Hub

11. Comparison of Different Physical Layers Example: RS-485 vs LVDS – Speed/Low Power vs Robustness

12. Comparison of Signal Levels Can smart sensors be accommodated using ‘power over comm’? Allows two wire sensor solution. Large DC offset already built into several standards

13. QUESTIONS? QUESTIONS?