1. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 1 TMB and RAT Status Report Outline: Current status of TMB and RAT boards Noise measurements Design and layout changes Production plan

2. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 2 TMB and RAT Current Status Parts for full production of 516 boards are in hand Made 29 working sets (TMB-base, RAT) Made 40 X2V4000 mezzanine cards Noise problems in ALCT data transmission through RAT found at test beam and in bench tests: Too few grounds for 80 MHz RAT  TMB data transmission Cross-talk between signals on RAT and perhaps TMB as well (M. Johnson) Prototype of revised RAT board and testing backplane done, noise greatly reduced Layout of revised TMB board well underway

3. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 3 Recall: TMB2004 Logic 1 on RAT2004 Logic 1 Clock off Logic 1 Clock ON Logic 1 Clock ON & ALCT 1 MHz !

4. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 4 LVTTL (from +3.3v) Logic Levels Typical outputs 0.4v low, 2.4v high, transition ~1.5v Worst case output supposed to be 0.8v low, 2.0v high Measurements showed violation of that:

5. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 5 Remedies Make the grounding for RAT like any other board in the peripheral crate: Add one ground pin on every row of RAT pins. 6  51 ground pins. Add backplane ground connections Requires more total pins: Replace 55-pin X3 and 125-pin X18 connectors by two 110- pin Type-A connectors 40 more pins, all “C” column pins used for grounding Also more robust alignment pins (noticed RAT alignment pins already broken before Sept beam test) Reduce crosstalk between long traces: Space them further apart Change order of board layers to put traces next to ground plane

6. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 6 “Halfway Test” of Noise Reduction RAT2005 board layout and new test backplane Many ground connections to backplane, but uses existing TMB2004 board Eliminates large inductive loops on RAT side and greatly reduces cross-talk between traces on RAT side. Doesn’t eliminate large inductive loops or reduce cross- talk between traces on TMB side. Naïve expectation: reduce noise level up to ~factor 4: –x2 due to inductive loops –maybe x2 more if cross-talk on RAT is also important

7. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 7 RAT2005 Changes RAT2005 design changes: On-board 1.8v regulator for Spartan-3 core voltage: –Previously on TMB, this eliminates transmission noise Change buffer ICs from high-drive to balanced light-drive devices: –Reduces ground bounce from signal transitions –Reduces inductive effects with slower edge speeds Additional filter capacitors RAT2005 layout changes: New connector layout Increase trace-to-trace separation for 80 MHz buses

8. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 8 “Half-way Test” Peak-to-Peak Noise RAT2004 Mean=434 mV RAT2005 Mean=124 mV (Reduction factor 3.5) Little correlation (signal positions have changed)

9. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 9 TMB2005 Changes TMB2005 design changes (done): Change buffer ICs from high-drive to balanced light-drive devices Delete legacy ALCT cable receiver ICs (removes “T” structures on circuit traces) +3.3v for RAT comes from TMB power plane instead of a separate circuit. Additional filter capacitors by driver ICs Replace 1.5v regulator with more stable type ALCT clock continues during hard reset (bug fix) TMB2005 layout changes: New connector layout Increase trace-to-trace separation for 80 MHz buses

10. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 10 Current Layout Screen-Cap

11. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 11 Status of TMB2005 Layout Over last 5 weeks: Creation of footprints done Component placement done Routing done for most major sections Expect 5 more weeks of layout SectionDoneNot Done CFEB √ DMB √ ALCT √ CCB ~√ MPC √ RPC √ VME √ JTAG √ Clock √ Power √ Mezz. conn. √ Test points √

12. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 12 TMB/RAT Production Plan 468+10%=515 boards each type Agreed delivery schedule (Dec. 17): 10 pairs in May (preproduction) 30 (total) by end of July 150 by end of August 270 by end of September 390 by end of October 510 by end of November 540 by end of December Requirements: Layout done by April 1 (10) Proto. boards by April 21 3 or 4 weeks for testing 10 pairs Then place large PCB and assembly orders to companies Summer mass testing will need lots of students

13. Endcap Muon meeting: UC Davis, Feb. 25-26, 2005 J. Hauser UCLA 13 Virtex-2 Mezz Cards Principle: keep well ahead of TMB schedule All parts in hand First 100: 40 cards already assembled (no changes) +60 cards being assembled, arrive April 1 Thereafter 3 cycles: 1 month for assembly and 1 month for testing +120 arrive June 1 (total 220) +120 arrive Aug. 1 (total 340) +180 arrive Oct. 1 (total 520)