Presentation on theme: "Wafer World History TIME-LINE -1996-Wafer World Inc. was founded as a tightly held private company by Sean Quinn. -1997- Wafer World acquired the assets."— Presentation transcript:
Wafer World History TIME-LINE -1996-Wafer World Inc. was founded as a tightly held private company by Sean Quinn. -1997- Wafer World acquired the assets of Micron Surface Engineering (West Palm Beach, FL). -1998- Silicon CZ and FZ 25.4 mm-150.0 mm In-House wafer polishing -1999- GaAs Reclaim 25.4 mm-150.0 mm In-House wafer polishing -2000-Germanium 25.4 mm-150.0 mm In-House wafer polishing -2001- Sapphire and Quartz 25.4 mm-150.0 mm In-House wafer polishing -2002- Wafer World Inc. became an exclusive distributor for ePAK Clean Room Packaging 50.8- 150.0mm -2003- Thin Silicon Wafers (MEMS) 25.4 mm-150.0 mm x 10-100 micron production line started -2004- On Line 24-7 Shopping Cart Purchase wafers from our stock list -2005- Wafer World expands facility, Doubles Production Area and Employees -2006- Wafer World was chosen as key supplier of the year by Raytheon. -2007- Wafer World opens first outside sales office in Boston, MA -2008- Wafer World qualifies as a Ge wafer supplier worldwide for European Ge Solar Cells -2009- Wafer World becomes ISO9001-AS9100 certified -2010- InP 25.4 mm-150.0 mm In-House wafer polishing
Wafer World, Inc. will consistently provide products that meet or exceed the requirements and expectations of our customers. We will actively pursue ever- improving quality through programs that enable each employee to do their job right the first time and every time.
MISSION STATEMENT Wafer World, Inc. is a custom materials manufacturing company which focuses on understanding and satisfying the needs and expectations of its customers through aggressive marketing and superb sales management. We, at Wafer World, Inc. are committed to meeting and exceeding our customer’s specifications through sound environmental management practices and strict adherence to industry-recognized quality assurance procedures and documentation. By establishing mutually beneficial relationships with our customers, Wafer World, Inc. is dedicated to becoming the most diversified substrate manufacturer in the world.
789 North Dixboro Road, Ann Arbor, Michigan 48105 (888) NSF-9000 Certificate of Registration This certifies that the Quality Management System of WAFER WORLD INC. 1100 Technology Place Suite 104 West Palm Beach, Florida, 33487, United States has been assessed by NSF-ISR and found to be in conformance to the following standard(s): ISO 9001:2008 Scope of Registration: The provision of lapping, polishing and cleaning of semiconductors and optical products. Exclusions: 7.3 Industrial Classification: SIC: 367 NACE: DL 32.1 IAF - QMS: 19 Certificate Number: C0041418-IS1 Certificate Issue Date: 22-DEC-2009 Registration Date: 04-DEC-2009 Expiration Date *: 03-DEC-2012 Christian B. Lupo, General Manager NSF-ISR, Ltd.
789 North Dixboro Road, Ann Arbor, Michigan 48105 (888) NSF-9000 Certificate of Registration This certifies that the Quality Management System of WAFER WORLD INC. 1100 Technology Place Suite 104 West Palm Beach, Florida, 33487, United States has been assessed by NSF-ISR and found to be in conformance to the following standard(s): AS9100:2004* *Audited in accordance with AS9104:2005 Requirements for Certification/Registration of AQMS. NSF-ISR is accredited under the Americas aerospace RMC. Scope of Registration: Provide lapping, polishing and cleaning of semiconductors and optical products. Exclusions: Design 7.3 and Service 126.96.36.199 Industrial Classification: SIC: 367 NACE: DL 32.1 IAF - QMS: 19 Christian B. Lupo, General Manager NSF-ISR, Ltd. Certificate Number: C0041418-AS1 Certificate Issue Date: 06-DEC-2009 Registration Date: 04-DEC-2009 Expiration Date *: 03-DEC-2012 Authorized Registration and /or Accreditation Marks. This certificate is property of NSF-ISR and must be returned upon request. *Company is audited for conformance at regular intervals. To verify registrations call (888) NSF-9000 or visit our web site at www.nsf-isr.org
Reclamation of GaAs Wafers by Chemical Stripping & Polishing Harvey Kitzmiller, Process Engineer & Sean Quinn, CEO Wafer World, Inc., West Palm Beach, Florida, USA Abstract Gallium Arsenide (GaAs) is one of the most important compound semiconductor materials in the world, and it has wide applications in wireless, opto-electronics, and Solar Cells. As a cost-savings measure, companies are forced to re-use substrates when feasible. Most of the major GaAs companies in the Unites States have reclaimed 4” and 6” GaAs wafers for many years. Diameters of 2”, 3”, 4”, 5”and 6” wafers can be processed and re-polished. Process Monitor wafers or Production-Rejects can be reclaimed 2-3 times and used as Test Grade material. Wafers with layers consisting of epitaxy, photo-resist, metal coating, dielectrics, etc. can be reclaimed 2-3 times as well! The process flow chart for reclaim wafers at Wafer World, Inc. is presented. The economical benefits for reclamation of GaAs wafers are discussed in this paper as well.
GaAs device demand will continue to see growth through 2014 Compound Semiconductor October 2010, vol. 16, number 7, pg 8 The GaAs market staged a strong recovery toward the end of a tumultuous 2009 as a result of positive trends in wireless markets. The Strategy Analytics GaAs and Semiconductor Technologies (GaAs) service report, “GaAs Industry Forecast 2009-2014,” calculates that despite a recession, GaAs industry revenues managed to escape a drop in 2009, with a strong performance in the second half of the year translating to year-on-year revenues remaining flat at $3.7 billion. GaAs technology will maintain its position as the enabling technology for next generation cellular handsets. The smartphone category of the handset market, in particular, provided a vital lifeline in 2009, boasting stronger than average annual growth in terminal volumes. With an increasing average number of GaAs power amplifiers per terminal as well as increasing switch complexity in this sector, GaAs device demand from next generation handsets will grow faster than overall industry revenue growth. “Our analysis incorporates individual wireless, consumer, infrastructure and defense market forecasts- taking into account technology trends,” noted Asif Anwar at Strategy Analytics. “There is no question that the improving capabilities of silicon and silicon germanium technologies, as well as emerging technologies such as gallium nitride, will provide increasing competition for GaAs technologies.” “Despite this competition, GaAs device demand will continue to see continued growth through 2014. The market will grow at a compound annual growth rate of 5% to be worth over $4.7 billion,” concluded Anwar. Reclaiming GaAs Wafers As GaAs wafer usage continues to rise, GaAs reclaim becomes an even more important cost savings tool – allowing your company to decrease prime wafer purchases.