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Silicon Solutions for the Real World RoHS Compliant & Green Components.

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Presentation on theme: "Silicon Solutions for the Real World RoHS Compliant & Green Components."— Presentation transcript:

1 Silicon Solutions for the Real World RoHS Compliant & Green Components

2 Silicon Solutions for the Real World Content Environmentally Friendly Materials Drivers Legislation AMIS RoHS & Green Component Definition Hazardous Substances in Current Components Re-Flow Profile for Moisture Sensitivity Assessment Impact Pb-Free Solder on Package Construction AMIS Changes in Bill of Assembly Materials Qualification Stress Test Conditions Product Marking and Labeling AMIS RoHS-Green Qualification Status

3 Silicon Solutions for the Real World Environmentally Friendly Materials Drivers RoHS Directive 2002/95/EC Effective July, 2006 LeadPb< 1000 ppm MercuryHg< 1000 ppm CadmiumCd< 100 ppm Hexavalent ChromiumCr+6< 1000 ppm Polybrominated BiphenylPBB< 1000 ppm Polybrominated Diphenyl EtherPBDE< 1000 ppm Market Pressure Japanese Consumers Demand Green Components New Designs for Consumer Products are all Green High Temperature Applications Solders Required for Harsh Environments Automotive Avionics High Ambient Temperature Applications for well Defined Duration

4 Silicon Solutions for the Real World Worldwide Legislation RoHS (Restriction of Hazardous Substances) Pb, Hg, Cd, Cr+6 PBB & PBDE JGPSSI (Japan Green Procurement Survey Standard Initiative) Pb, Hg, Cd, Cr+6 PBB, PBDE, TBBP-A-bis Chlorinated Organic Compound PCB, PCN, CP, Mirex Organic Sn Compound Asbestos Azo Formaldehyde PVC & PVC Blends Situation of Banned Substances in the World Different Definitions & Thresholds are being Debated in EU, Japan & US Whether all Worldwide Brominated Substances or only Specified Types will be Banned is still Unclear

5 Silicon Solutions for the Real World Japanese Legislation Japanese The Japanese Ministry of Trade (MITI) Passed a Recycling Law for Electrical Appliances with Effect from April 2001 This Suggests but does not Include Lead Phase-out Timetable OEM's are Removing Lead from Electronics Mainly due to Market Pressures The JGPSSI (Japan Green Procurement Survey Standard Initiative) is Followed by many OEMs

6 Silicon Solutions for the Real World Directive 2002/95/EC (RoHS) Proposal for an Directive on Eco-Design of End-Use Equipment (EUP) that will have some Regard to Hazardous Materials in Equipment EU Legislation Applicable for : Large Household Appliances Small Household Appliances IT & Telecom Equipment Consumer Equipment Lighting Equipment Electrical & Electronic Tools Toys, Leisure & Sports Equipment Medical Equipment Systems Monitoring & Control Instruments Automatic Dispensers Who is Exempt: Medical Implanted & Injected Products Pb in Servers, Storage & Storage Systems until 2010 Large Stationary Industrial Tools Pb in High-End Manufacturing & Telecommunications Products Automotive, Aerospace, Military

7 Silicon Solutions for the Real World United States Legislation United States Although a Number of States are Heading Towards Lead-Free and/or Recycling Regulation There is not yet a Published Federal Position In September 2003 California Enacted an E-Waste Recycling Bill The EPA (Environmental Protection Administration) has Proposed a Crack-down on Lead Emissions from Plants that may Impact the Soldering Industry

8 Silicon Solutions for the Real World AMIS RoHS & Green Definition RoHS Compliant = AMIS Pb-Free Pb< 1000 ppm Hg< 1000 ppm Cd< 100 ppm Cr+6< 1000 ppm Polybrominated Biphenyl< 1000 ppm Polybrominated Diphenyl Ether< 1000 ppm Full Green = AMIS Green All of the Above Requirements Plus Bromine< 900 ppm Chlorine< 900 ppm Antimony< 900 ppm Tributyltin OxideNot Used PhosphorusNot Used

9 Silicon Solutions for the Real World Hazardous Substances in Current Compounds Pb as Solder Plated Leads or Balls of Packages Pb Content Solder Plated Leads: 0.1 – 0.3% by Weight Pb Content Solder Balls of BGA Packages: 4.9% by Weight Bromide &/or Antimonated Flame Retardant of Epoxy Molding Compound Bromide Content: 0.2 – 1.8% by Weight Antimony Content: 0.3 – 0.7% by Weight DIE Laminated Package Solder Lead Finish Leaded Package Solder Balls

10 Silicon Solutions for the Real World Re-Flow Profile for Moisture Sensitivity Assessment AMIS Solder Peak Temperature for Pb-Free is /-5°C Large BodySmall BodyLarge BodySmall BodyLarge BodySmall BodyLarge BodySmall Body Average ramp-up rate (T L to T p ) Peak Temperature (Tp) seconds seconds10-30 seconds seconds Ramp-down Rate 6 Minutes Max.8 Minutes Max. IPC/JEDEC J-STD-020BAMIS Sn-Pb Eutectic Assembly 6 Minutes Max.8 Minutes Max. Pb-Free Assembly Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat Temperature Min. (Tsmin) Temperature Max. (Tsmax) Time (Min. to Max.)(ts) Tsmax to T L Ramp-up Rate Time Maintained Above: Temperature (T L ) Time (t L ) 3ºC/second Max. Time Within 5ºC of Actual Peak Temp. (tp) Time 25ºC to Peak Temp. 100ºC 150ºC Seconds 150ºC 200ºC Seconds 100ºC 150ºC Seconds 150ºC 200ºC Seconds 183ºC Seconds 217ºC Seconds 183ºC Seconds 217ºC Seconds /-5ºC240 +0/-5ºC245 +0/-5ºC250 +0/-5ºC225 +0/-5ºC240 +0/-5ºC260 +0/-5ºC 3ºC/second Max.1-2ºC/second Max ºC/second Max. 6ºC/second Max.

11 Silicon Solutions for the Real World Re-Flow Profile for Moisture Sensitivity Assessment AMIS Solder Peak Temperature for Pb-Free is /-5°C

12 Silicon Solutions for the Real World Impact Pb-Free Solder on Package Construction Exposure to Higher Solder Temperatures The Impact from 220 to 240 or 260°C Solder Temperatures Solderability The Interaction Between the Pb-free Component Finish & Solder Paste Interface Adhesion Between Materials The Higher Probability that Interfaces will Separate as they are Exposed to the High Solder Temperature Thermal Stability in Compound/Die Attach/Substrate Electrical Contact Resistance DIE Laminated Package Solder Balls DIE Solder Lead Finish Leaded Package

13 Silicon Solutions for the Real World Changes in Bill of Assembly Materials Lead Frame Packages = AMIS goes Green New Materials for Die Attach & Mold Materials that Withstand 260°C Halogen Free Materials Lead Finish Pure Sn Plating is Selected as Solution Pure Sn is the most Mainstream Solution Post plate bake is part of the AMIS process flow and demonstrated good results as whisker mitigation process NiPdAu is available as an alterative finish option

14 Silicon Solutions for the Real World Changes in Bill of Assembly Materials Laminate Packages = AMIS goes RoHS Compliant Existing Substrates are RoHS Compliant & Qualified Green Substrates are Available but more Expensive & not yet Qualified New Materials for Die Attach & Mold Materials that Withstand 260°C Halogen Free Materials Lead Finish Sn- 4.0Ag- 0.5Cu has been Selected (most std at Subs)

15 Silicon Solutions for the Real World Qualified Stress Test Conditions - 65/150°C, 500x - 65/150°C, 1000x - 65/175°C, 500x - 65/175°C, 1000x - 50/150°C, 500x - 50/125°C, 1000x - 65/150°C, 500x - 50/150°C, 1000x - 65/175°C, 500x - 50/175°C, 1000x - 50/150°C, 2000x Temp Cycle Per J-STD-020 for SMD components Preconditioning 175°C, 1000 hrs 175°C, 2000 hrs 150°C, 1000 hrs 175°C, 500 hrs 175°C, 1000 hrs 150°C, 2000 hrs High Temp Storage Life (plastic pkg) 121°C / 100% – 96 hrs HAST 130°C / 85% – 96 hrs Autoclave or unbiased HAST 85°C / 85% / Bias – 1000 hrsTHB or HAST - 40/125°C, 1000x- 40/150°C, 1000x- 40/105°C, 1000x- 40/125°C, 1000x- 40/150°C, 1000x Power Temp Cycle Grade 2 (- 40 / 105°C) Grade 1 (- 40 / 125°C) Grade 0 (- 40 / 150°C) Part Operating Temperature Grades Per J-STD-020 Minimum Level 2 260ºC max. Re-Flow Temperature HAST 130°C / 85% / Bias – 96 hrs For Product Qualifications 121°C / 100% – 96 hrs For Package Qualifications AEC – Q100 REV-FAMIS 150°C, 1000 hrs 150°C, 2000 hrs 125°C, 1000 hrs 150°C, 500 hrs Grade 0 (- 40 / 150°C) Grade 1 (- 40 / 125°C)

16 Silicon Solutions for the Real World AMIS RoHS-Green Qualification Status

17 Silicon Solutions for the Real World Product Marking & Labeling In Alignment with JESD97 Components Contain Pb-Free Category Code Labels Contain Pb Free Category Code Safe Maximum Temperature Moisture Sensitivity Level

18 Silicon Solutions for the Real World AMIS RoHS-Green Project Status The Majority of the Packages Offered by AMIS are Green or RoHS Qualified AMIS will Continue to Provide Non-RoHS & Non- Green Products unless Requested Differently Green & RoHS Compliant Product is Available Upon Request Contact AMIS Sales for more Information AMIS Operational Systems have been Adjusted to Recognize & Distinguish Green & RoHS Compliant Product from the Existing Production


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