1. Design Automation and Test Challenge for Flexible Hybrid Electronics (FHE)
T.-C. Jim Huang1 and K.-T. Tim Cheng2
1 Hewlett-Packard Laboratories, Palo Alto
2 University of California Santa Barbara

2. What is Flexible Electronics
Thin-film, light-weight, and low-cost
Bendable, durable, and large-area
Flexible substrates
Plastics and metal foils
Non-photolithography manufacturing
Ink-jet printing
Roll-to-roll imprinting
[1] Roll-to-roll process, PolyIC;
[2] Ink-jet printed electronics, Phillips
Flexible electronics has recently attracted much attention because of their potential in providing cost-efficient solutions to large-area applications such rollable displays and TVs, e-paper, smart sensors and transparent RFIDs. The key advantages of flexible electronics, compared with current silicon technologies, are low-cost manufacturing (e.g. ink-jet printing and roll-to-roll imprinting) and inexpensive flexible substrates (e.g. plastics). These advantages make flexible electronics an attractive candidate for next-generation consumer products which require lightweight, bendable, portable, and low-cost electronics.
[1]
[2]

3. Flexible Hybrid Electronics – Fusion of Flex/Rigid CMOS
Fujifilm
American
Semiconductor
MC1 0
Univ. Tokyo
LG Display
Opportunity
Create unique industrial designs from biomedical, consumer electronics, to internet of things (IoT)
Challenge
1.Heterogeneous integration
2.Additive manufacturing
3.Multi-physics simulation
4.Reliabillty under bending
5.Robust design and test
6.Physical design and verify
BioMedical
Healthcare
Consumer
Flex silicon-on-polymer/plastics technology by American semiconductor
Functional ink-jet printer by Fujifilm Dimatix material printer
MC10  vital sign monitor for babies
Univ. Tokyo  insole pedometer with piezoelectric energy harverster
LG Display  flexible display for mobile phones

4. * Source: DoD presentation on Proposers’ Day, Feb. 19, 2015

6. DA and Test for FHE - Opportunities
Compact modeling: validated, computationally efficient models that can capture process-dependent variations and time-dependent degradations
Process design kits (PDK): for various printing processes that are compatible with CMOS EDA tools to facilitate CMOS-FHE co-simulations
Physical design and verification: tools for FHE additive manufacturing including DRC/LVS/DFM
Robust design and design for manufacturability (DFM): robust design library and DFM for high production yields
Design for reliability: methodologies to evaluate system reliability under repeated bending with various bending radii
Design toolset integration: integrated interdisciplinary design, simulation, and analysis toolsets for designs with hybrid components