1. Quarterly Flexible, Printed Electronics Workshop October 22, 2009 Hosted by SEMI

2. Workshop Goals and Objectives Flexible, Printed Electronics Market Outlook –Flexible Substrate Requirements for the Market Substrate Requirements: Approaches & Challenges –WVP Testing & Barriers, Sensors & Medical Applications, Solar & Photovoltaics Breakout Groups: Opportunities & Challenges for Successful Commercialization –Next generation materials, structures, processes, and equipment for low cost manufacturing of barriers and encapsulation –Advancing the understanding of failure mechanisms for OLEDs, TFPV, printed electronics on flex substrates –Real-time, on-line permeability measurements

3. Flexible, Printed Electronics Market Outlook: NanoMarkets Even under current conditions, the market can still support commercialization and growth of innovative ideas –Flexible substrates will be of growing importance, starting with metal foils –Development of robust encapsulation is an enabling technology for long-lived organic (and some inorganic) flexible products –Commercialization is just beginning in some sectors

4. Flexible Substrate Requirements: Approaches & Needs Roadmap of Substrate Requirements for Large Area Electronics –Industry Technology Development Efforts Higher Ink Performance Finer Printed Channels Increased Circuit Density But What About Substrates?? –Substrate Cost Represents Significant Percentage –Substrate must be compatible to fabrication process – temperature, materials, process environment, handling, etc. –Substrate Properties Determine Final Structure Features and Performance –Substrate Performs the Heavy Lifting

5. Opportunities & Challenges for Successful Commercialization Permation Methods for High Barrier Materials –Why Study Permeation? All Polymers are Permeable!!! –Permeation rates are often a key measure of how well components and seals maintain a products shelf- life Key Factors that Affect OLED Shelf-life –Oxygen- Commonly accepted to be 0.001 cc/(m2x day) or lower –Water Vapor- Commonly accepted to be 1e-6g/(m2 x day) or lower How is High Barrier Permeation Measured –Water Vapor –Calcium Test –Tritium (Radio Active) in the form of HTO –Mass Spectrometry –Coulometric Sensor

6. Opportunities & Challenges for Successful Commercialization Flexible Sensors, Substrates for Medical Applications –Ideal Electronics for Biology & Medicine Geometric conformability: direct biological interaction Biocompatibility: mechanical; surface chemistry Scalability: micro to human size On-board electronic: -rapid detection & analysis; communication alarms;on- board & remote decision making Low cost: ubiquitous application; disposable –Types of Biomedical Devices External: remote sensing or skin contact Biological sample: clinical chemistry; body fluids; cell or tissue Direct Tissue Contact: sensors; bandages; implants –Challenges for Application of FlexE Surface Biocompatibility:non-denaturing of Biomolecules; hydration; non- absorbing surfaces Bulk Biocompatibilit: density & stiffness ~ that of biological tissues; minimize micromotion; complete integration into tissue Implementation of FlexE Technology: engineering is basically available; stretchable electronics

7. Opportunities & Challenges for Successful Commercialization Reliability and Lifetime of Flexible Organic Electronics –Purpose: develop low cost, scalable PV manufacturing process; understanding how to encapsulate for environmental stability Applications for Flexible Organic Photovoltaics –Thin, lightweight Organic Photovoltaics (OPV) on flexible substrates –Roll-to-Roll processing for high throughput –Portable applications, awnings, tents, marine Required Performance, Stability Lifetime & Cost –3 to 5 years -flex encapsulate; 10 to 15 yrs -glass encapsulate –$50/meter achievable by 2010; Translates to $1 watt @ 5% eff. Encapsulation with Flexible Barriers –WVTR & OTR of Flexible Films; materials developed for OLED; std module size is approx. 164 cm2 Adhesion Between Barrier Film, OPV Module –Important Considerations: adhesion at barrier film/adhesive interface, at adhesive/flexible substrate interface, at printed Ag/adhesive interface; chemical compatibility; physical compatibility; weathering Summary -Further Down the Roadmap –Improved Stability: evaluation of higher quality barrier films; further improvements to encapsulation design –Improved Efficiency: new organic materials that; absorb over larger region of solar spectrum –Relatively Low Cost : improved processing & development for larger area modules

8. FlexTech Alliance Technical Projects & Events Current Projects: 28 Technical Development projects = $4.961 MCurrent Projects: 28 Technical Development projects = $4.961 M –Materials & Components - 52% –Flex Substrate Tools & Manufacturing Technology - 28% –Military User Group (MAUG) Related -11% –Industry Data & Studies - 9% Current Events 2010 –Feb. 1-4: 9th Annual Flexible Electronics & Displays Conference, Phoenix, Ariz –March: Flexible Display Center, Phoenix, Ariz –June: –September: –November: FlexTech Alliance HQ, San Jose, CA