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ABC130 Hybrid/module and HCC Bond Detail... 1. ABC130 Left & Right Handed Hybrid and Module Topology 27.73 Original proposal – same flavour hybrids Hybrid-module.

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Presentation on theme: "ABC130 Hybrid/module and HCC Bond Detail... 1. ABC130 Left & Right Handed Hybrid and Module Topology 27.73 Original proposal – same flavour hybrids Hybrid-module."— Presentation transcript:

1 ABC130 Hybrid/module and HCC Bond Detail... 1

2 ABC130 Left & Right Handed Hybrid and Module Topology 27.73 Original proposal – same flavour hybrids Hybrid-module topology is asymmetrical Revised proposal – Left & Right handed hybrids Hybrid-module topology is symmetrical Sensor outline (97.54 x 97.54) shown in purple, 42.73 12.08 27.73 42.73 32.88 All dimensions in mm (note geometry has been updated to take into account front-end wire bonding access 27.73 21.93 Symmetrical module topology brings hybrids closer together – results in lower impedance (inductance) reference tie between hybrids Power Entry Digital I/O 2

3 Target size for ABC130 is 7.9mm x 6.0mm ASICs are placed with 1.636mm gap between them (Front-end decoupling moved to the back of asic) Target size for HCC is 3.5mm x 3.5mm Bond pad detail aimed to match either flavour of hybrid ABC130 Left & Right Handed Hybrid - Detail HCC orientation on hybrids is the same (no rotation) – for both hybrid flavours bus connection detail is identical 3 Left-Handed Hybrid “New” Right-Handed Hybrid Capacitor arrays used throughout for power supply decoupling and AC-coupling of stave-side signalling Supply decoupling 0508 100nF,10V Stave-side signalling 0508 & 0504 220pF, 50V HCC

4 ABC130 Common Bus Routing ABC130s rotated 180° on right-handed hybrid HCC orientation is the same for both hybrids Bus tape connection is identical for both hybrids ‘My’ Preferred direction of Bus signal flow shown in blue Ease of routing with linear layout Minimises stub length connection to asics Results in ‘long’ trace length (~200mm) Increased capacitive load to HCC drivers ~40pF from trace alone (cf ~2pF/cm) Left-Handed hybrid has half the load (Could be) Problematic for HCC ‘fast’ data clock Looking at ways of reducing Z0 Differing termination techniques Or Route as an asymmetric T (shown red) Reduced trace length (and capacitance) End termination now moved to opposite end Consider Have receivers available on both sides of ABC130 Bus topology becomes as left-handed hybrid ABC130 Bus End Termination embedded within final ABC130 Left-Handed Hybrid Right-Handed Hybrid ABC130 Bus 4

5 HCC Kick off “Bond Detail” Targeting 3.5mm x 3.5mm die size Wire bondable on all 4 sides Should match up to either Left/Right Handed hybrids This flexibility should tie in with Petals Proposed bond pad orientation shown to right Stave-side Coms towards top centre of asic Pad detail is ‘fixed’ (due to use of AC-coupled Receivers) Hybrid side Coms towards top sides of asic ABC130 common bus ABC130 Data loops on bottom side Auxilliary Connections – Power, Sense, etc. on sides Pad detail ‘fixed’ as shown HCC ID set by fuse Would like.... A programmable logic switch to ‘steer’ Hybrid side Coms Makes hybrid side I/O floating i.e. not tied to dedicated bond pads On board termination Hybrid Side Coms Stave Side Coms Hybrid Side ABC130 Data Loops PowerPower HCC ID (Fuse) Sense/Band Gap Logic Switch Steers Hybrid Side Communication (ABC130 Common Bus) Hybrid Stave Hybrid 5

6 HCC Hypothetical Bond Detail Bond Pads not needed? Make use of Fuse ID Die size: 3.5mm x 3.5mm Power /GND 6

7 7 Summary First pass of ‘realistic’ hybrid topology for ABC130 has been done Assumptions for target sizes for both ABC130 and HCC seem ok Assume 3-layer build for hybrid – no showstoppers yet identified Request for 2 different flavoured hybrids taken on board - Left-handed and Right-handed Gives us the option of making 2 different module topologies 1.Use of both flavours of hybrids results in a symmetrical hybrid-module topology Advantage of reducing distance between hybrids (lower impedance reference tie) Could introduce problems during production... 2.Single flavoured hybrids results in an asymmetrical hybrid-module topology Distance between hybrids much greater (compared to above) – risk of compromising electrical performance Advantageous for production Dialogue has now started with ASIC designers regarding possible HCC bond pad layout Very early days! Bond pad detail, pad count and their location still not defined Primarily used as a ‘kick off’ to show our thoughts Target is for a bond pad layout that can be used for both flavoured hybrids Should work for Petals as well...


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