1. Sugon I840-G25 Server Pre-sale training v1.0 Product Center 2014.09 Computing creates future.

2. 2 Contents 1 Introduction of product specifications 2 Introduction of product technology architecture 3 Introduction of product external interface 4 Introduction of hardware compatibility

3. Introduction of product specifications Processor Intel E7-4800V2/8800V2 Series processor Number of processor2 or 4 ChipsetIntel C602J Buffer memory controller Intel Jordan Creek C104 RAM 8 Memory Board, Maximum Supporting 96 DIMMs Maximum 6TB DDR3-1600/1333/1066 RDIMM/LRDIMM NIC Embedded 2*10000M RJ-45 (Intel X540) PCI I/O expansion slot Maximum supporting 11 PCI-E slots 4 PCI-E3.0 x16 slots 7 PCI-E3.0 x8 slots When configuring 4 CPUs and installing 1 to 4 memory boards, it can maximum support 11 PCI-E devices. When configuring 4 CPUs and installing 8 memory boards, it can maximum support 8 PCI-E devices. When configuring 2 CPUs, it can maximum support 5 PCI-E devices. For the detailed configuration, please refer to appendix A. Storage Support at most 24 2.5-inch SATA/SAS/SSD BackplanesSAS 12G Backplane Other ports 1 x VGA (ASPEED 2400) 2 x USB2.0 (rear) + 1 x USB2.0 (inside) 2 x 10000M RJ-45 1 x COM (rear) 1 x 100M IPMI Mgmt

4. Continued table GPU computer card Maximum supporting 4 whole high double wide GPU card (Only can configure the GPUs which have the backend power connector.) (Nvidia Tesla/ Intel PHi) Note ： When configuring GPU ， there will be additional cooling fan For the detailed configuration condition, please refer to appendix A. VGA TV coder Supporting 1 VGA TV coder (Only can configure the VGA card which have the backend power connector.) RAID supporting RAID 0/1/5/6/10/50/60 ( supporting configuration super capacitor) DVD ROM Nonsupporting embedded CD ROM, can configure the external USB DVD ROM. Power Supply Maximum supporting 4 power supplies with 1620W/920W Support N + N or N + 1 redundancy. Platinum level power supply, 94% conversion efficiency. Note ： The current module can only support AC input. BMC management Supporting iKVM /IPMI protocol Supporting SNMP V2/SMTP Monitoring CPUs/MEM/Fans/Mainboard/Power Supplies, etc. Supporting chassis intrusion alarm. Supporting remote upgrading BIOS by BMC. For the monitoring contents, please refer to appendix B. HDD Expender nonsupport Monitoring screen nonsupport Others Support TPM Introduction of product specifications Continued table L,W & H 795mm x 437mm x 178 mm Net weight 68kg Operating ambient temperature 10°C to 35°C Non-operating environment temperature -40°C to 70°C Operating Relative Humidity 8% to 90% (no clotted) Non-operating environmental humidity 5% to 95% (no clotted)

5. 5 Contents 1 Introduction of product specifications 2 Introduction of product technology architecture 3 Introduction of product external interface 4 Introduction of hardware compatibility

6. Introduction of product technology framework ---Main Board architecture Bus nameParameters QPIUp to 8.0 GT/s SMI2Up to 2.66GT/s PCIE Gen38.0 GT/s USB 2.0480Mbps

7. Introduction of product technology architecture--- Processor number and interconnection Each CPU has 3 QPI with pair-wise connectivity. The fastest connection speed for each QPI is 8.0 GT/s. Each CPU has 4 SMI2 for connecting Jordan Creek. The fastest transmission speed for each SMI2 is 2.66 GT/s. Processor Number E7-4890V2E7-4880V2E7-4870V2E7-4860V2E7-4850V2E7-4830V2E7-4820V2E7-4809V2 # of Cores15 12 1086 Clock Speed2.8 GHz2.5 GHz2.3 GHz2.6 GHz2.3 GHz2.2 GHz2 GHz1.9 GHz Cache37.5 MB 30 MB 24 MB20 MB16 MB12 MB System Bus8 GT/s7.2 GT/s6.4 GT/s Memory TypesDDR3-1066/1333/1600 DDR3- 1066/1333

8. Introduction of product technology architecture —memory control unit Each CPU supports 8 DDR3 channels Each CPU maximum supports 24 DDR3 DIMMs. Intel SMI Gen2 maximum broadband 2.66 GT/s Memory controller supports two modes ： Performance Mode (High I/O, B/W) Lockstep Mode (Highest DDR3 Speed)

9. Introduction of product technology architecture ---- memory configuration and working frequency Terms explanation ： SR ： Single Rank DR ： Dual Rank QR ： Quad Rank SG ： Stretch Goals DDR3 RDIMM Support on Ivy Bridge-EX/Jordan Creek - 3SPC (Performance Mode) Slot0Slot1Slot2Frequency @1.5V drams (MT/s)Frequency @1.35V drams (MT/s) SRempty 1333 DRempty 1333 QRempty 1066 SR empty13331066 DR empty13331066 SR 1066 DR 1066 DDR3 RDIMM Support on Ivy Bridge-EX/Jordan Creek - 3SPC (Lockstep Mode) Slot0Slot1Slot2Frequency @1.5V drams (MT/s)Frequency @1.35V drams (MT/s) SRempty 1333 DRempty 1333 QRempty 1066 SR empty13331066 DR empty13331066 SR 1066 DR 1066 The memory actual working frequency is related with the below parameters. Memory Rank quantity Memory working voltage Memory Location on the memory board Note ： The memory working voltage of current mainstream is 1.35 V.

10. Introduction of product technology architecture --- The installation of the memory board and memory. The system can maximum support 8 memory boards and 96 DDR3 DIMMs. Memory board specifications ： Including 2 Jordan Creek C104 chip Maximum supporting 12 DIMMs 4 memory channels Memory installation order ： Blue slot is priority (DIMMA1  DIMMB1  DIMMC1  DIMMD1)

11. Introduction of product technology architecture --- The corresponding relation of memory and CPU CPU#Corresponding DIMM Modules No. of card(s) for Each CPU One(1) Memory Card for each CPU Installed on the baseboard Two(2) Memory Cards for each CPU Installed on the baseboard CPU1SMI Slot P1M2SMI Slot P1M1 + SMI Slot P1M2 CPU2SMI Slot P2M1SMI Slot P2M1 + SMI Slot P2M2 CPU3SMI Slot P3M2SMI Slot P3M1 + SMI Slot P3M2 CPU4SMI Slot P4M1SMI Slot P4M1 + SMI Slot P4M2 When configuring 4 CPUs and 4 memory boards ， recommend using P1M2/P2M1/P3M2/P4M1 (Maximum IO utilization) (supporting 11 PCIe Slot) Each CPU supports 2 memory boards ， 4 Jordan Creek, 8 Channel and 24 DDR3 DIMMs.

12. Introduction of product technology architecture - -- The corresponding relation of PCIE Slot and CPU PCI-E Expansion Slots CPU1 supports Slot1 PCI-E 3.0x8, and Slot2 PCI-E 3.0x16 CPU2 supports Slot3 PCI-E 3.0 x8, Slot4 PCI-E 3.0 x16, and Slot5 PCI-E 3.0 x8 CPU3 supports Slot6 PCI-E 3.0 x8, Slot7 PCI-E 3.0 x8, and Slot9 PCI-E 3.0 x16 CPU4 supports Slot8 PCI-E 3.0 x8, Slot10 PCI-E 3.0 x8, and Slot11 PCI-E 3.0 x16 Note ： Please pay special attention to SLot5, Slot6 and Slot7. Because the three slots have relations with the memory board quantity. For the detailed configuration, please refer to appendix A.

13. Introduction of product technology architecture - IO module backpanel specifications LocationConnectorDescription AJVGA1VGA Port1 BJLAN2LAN Port2 CJLAN1LAN Port1 DJLAN3(BMC) IPMI_LAN ESW1UID Switch FJVGA2VGA Port2 GJCOM1Debug

14. 14 Contents 1 Introduction of product specifications 2 Introduction of product technology architecture 3 Introduction of product external interface 4 Introduction of hardware compatibility

15. Introduction of product external interface----- Front panel functions 24 x 2.5” SAS/SATA HDDs Front panel Front panel iconsIntroductions Power button Reset button Power LED Onboard HDDs Activity LED LAN1 status LED LAN2 status LED Power/Fan/tempe rature Fault LED HDD Stents icons Introductions HDD Fault LED Location/Activity LED

16. Introduction of product external interface----Back panel functions 4 PSU modules,available 920W/1620Wp ower supply, supporting 2+2 redundancy 2 x USB Port + 1 x COM port 1 x VGA+ 2 x 10G RJ-45 NIC Port + 1 x IPMI LAN + 1 x UID Installation position of GPU cooling fan. When configuring GPU, it can make additional cooling fans. 11 x PCI-E Slot, 3 external fan modules can be removed.

17. 17 Contents 1 Introduction of product specifications 2 Introduction of product technology architecture 3 Introduction of product external interface 4 Introduction of hardware compatibility

18. ADDRESS ： Sugon Building, No. 36 Zhongguancun Software Park, No.8 Dongbeiwang West Road Haidian District, 100094, Beijing, P.R.China TELEPHONE ： 86-10-56308000 Weibo ： http://weibo.com/zksugon WWW ： http://www.sugon.com

19. Introduction of hardware compatibility PartsSpecifications CPUE7-4800 V2/ E7-8800 V2 MemoryDDR3 8GB/16GB/32GB 1333MHz/1600MHz HDD 10K 2.5 ” 300G/450G/600G/900G SAS 6Gb HDD 7.2K 2.5 ” 500G/1T SAS 6Gb HDD 15K 2.5 ” 146G/300G SAS 6Gb HDD 7.2K 2.5 ” 500G/1T SATA 6Gb HDD SSD 2.5 ” 160G/240G/300G/480G HDD RAID card LSI 9270 8i TE 1GB SAS 6G RAID with battery 8 port 1GB SAS 6Gb RAID card SL8-US T 1GB SAS 6G RAID （ 8PD) with capacitance LSI 9271 8i SE 1GB SAS 6G RAID+backup battery VGA Card Nvidia Quadro K2000/K4000/K5000/K6000 PartsSpecifications NIC2 x 1000M PCIE RJ45 NIC 2 x 1000M PCIE Fiber NIC PCI-E single/double ports10G multimode Fiber NIC PCI-E 4 x 1000M RJ45 NIC 1 x 1000M multimode Fiber NIC PCI-E single/double ports 10G RJ45 NIC FC HBAsingle/double ports 8Gb PCI-E Fiber HBA card single/double ports 4Gb PCI-E Fiber HBA card HCA card40Gb/s ConnectX-2 QDR single/double ports - E X8 HCA QDR single/double ports FDR PCIe3.0 x8 HCA card SAS cardAOC-S2308L-L8i 8 ports -E 6Gb SAS card GPUNvidia TESLA K20/K20C/K20X/K40 Intel Xeon Phi Coprocessor 5110p

20. Appendix A: Memory board/maximum memory number GPU NumberSurplus available PCIe Slot specification (2 CPUs) Surplus available PCIe Slot specification (4 CPUs) 1/1202 PCIe x16 + 3 PCIe x84 PCIe x16 + 7 PCIe x8 11 PCIe x16 + 2 PCIe x83 PCIe x16 + 6 PCIe x8 20 PCIe x16 + 1 PCIe x82 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 3 PCIe x8 2/2402 PCIe x16 + 3 PCIe x84 PCIe x16 + 7 PCIe x8 11 PCIe x16 + 2 PCIe x83 PCIe x16 + 6 PCIe x8 20 PCIe x16 + 1 PCIe x82 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 3 PCIe x8 3/3602 PCIe x16 + 3 PCIe x84 PCIe x16 + 7 PCIe x8 11 PCIe x16 + 2 PCIe x83 PCIe x16 + 6 PCIe x8 2NA(no supporting 2 GPU configuration ) 2 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 3 PCIe x8

21. Continued table: Memory board/maximum memory number GPU NumberSurplus available PCIe Slot specification (2 CPUs) Surplus available PCIe Slot specification (4 CPUs) 4/4802 PCIe x16 + 3 PCIe x84 PCIe x16 + 7 PCIe x8 1NA(no supporting 1 GPU configuration ) 3 PCIe x16 + 6 PCIe x8 2NA(no supporting 2 GPU configuration ) 2 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 3 PCIe x8 5/600NA4 PCIe x16 + 7 PCIe x8 1NA3 PCIe x16 + 6 PCIe x8 2NA2 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 4 PCIe x8 4NA0 PCIe x16 + 2 PCIe x8 6/720NA4 PCIe x16 + 7 PCIe x8 1NA3 PCIe x16 + 6 PCIe x8 2NA2 PCIe x16 + 5 PCIe x8 3NA1 PCIe x16 + 3 PCIe x8 4NA0 PCIe x16 + 0 PCIe x8

22. Continued table: Memory board/maximum memory number GPU NumberSurplus available PCIe Slot specification (2 CPUs) Surplus available PCIe Slot specification (4 CPUs) 7/840NA4 PCIe x16 + 6 PCIe x8 1NA3 PCIe x16 + 5 PCIe x8 2NA2 PCIe x16 + 4 PCIe x8 3NA1 PCIe x16 + 1 PCIe x8 4NANA(no supporting 4GPU configuration ) 8/960NA4 PCIe x16 + 4 PCIe x8 1NA3 PCIe x16 + 3 PCIe x8 2NA2 PCIe x16 + 2 PCIe x8 3NANA(no supporting 3GPU configuration ) 4NANA(no supporting 4 GPU configuration )

23. Appendix B:BMC Event Log Event log order Log record time Alarm device name Alarm equipment category Log detailed information description BMC Event Log Information format decomposition

24. Appendix B: BMC Sensor Reading Health status for devices Devices name Monitoring equipment failure description monitored equipment operation data Intrusion alarm reset button BMC Sensor Reading Information format decomposition

25. Appendix B:BMC Power Consumption Power consumption monitoring ， collecting power consumption status under three conditions. last hour Last week Last day

26. Appendix:BMC Power Supplies Monitoring parameters of power supplies parameter name of power supply status Power Supply working status overview AC input voltage/current DC output voltage/current Power Supply module temperature monitoring Power Supply fan speed DC output power consumption AC output power consumption Power supply SN No. data of power supply status