1. Detector Development with Industry Jan Visschers Nationaal Instituut voor Kernfysica en Hoge-Energie Fysica NIKHEF Amsterdam, The Netherlands email: janv@nikhef.nl

2. © NIKHEF 2005 SAC NIKHEF 21 May 2005 2 Silicon Detector R&D at NIKHEF ATLAS Silicon Tracker LHCb Vertex tracker Medipix2 1.20 m

3. © NIKHEF 2005 SAC NIKHEF 21 May 2005 3 Hybrid Pixels  Direct Conversion (no scintillator)  no CCDs  no CMOS imagers  but: Hybrid Pixel detectors Schematic of a hybrid pixel detector MediPix chip 14 x 14 mm 2 sensitive area periphery

4. © NIKHEF 2005 SAC NIKHEF 21 May 2005 4 Medipix2 @ NIKHEF Medipix2 X-ray Imager Photon Counting V th min ~1000 e- ( ~4 keV) noise-free high dynamic range 14 x 14 mm 2 256 x 256 pixels 55 x 55 μm 2 pixel size ~ 1 Mhz per pixel ~ 100 frames per second

5. © NIKHEF 2005 SAC NIKHEF 21 May 2005 5 Medipix Collaboration - Univ + INFN Cagliari - CEA-LIST Saclay - CERN Genève - Univ d'Auvergne - Univ Erlangen - ESRF Grenoble - Univ Freiburg - Univ Glasgow - IFAE Barcelona - Mitthoegskolan Sundsvall - MRC-LMB Cambridge - Univ + INFN Napoli - NIKHEF Amsterdam - Univ + INFN Pisa - FZU CAS Prague - IEAP CTU Prague - SSL Berkeley Spokespersons: Michael CAMPBELL CERN Jan VISSCHERS NIKHEF

6. © NIKHEF 2005 SAC NIKHEF 21 May 2005 6 Plug and Play 90 Sr electron source 20 frames / second (software limited)

7. © NIKHEF 2005 SAC NIKHEF 21 May 2005 7 Tests at ESRF synchrotron Michaela Mitschke anti-scatter slit badly adjusted X-ray pencil beam 10 x 10 μm, steps 5 μm perfect PSF Spectroscopy: 3 rd 4 th 5 th Harmonics

8. © NIKHEF 2005 SAC NIKHEF 21 May 2005 8 Some Images mm 28 mm Flies @ 10 keV Leaf @ 5.9 keV Tungsten source 55 Fe source 14 14 mm

9. © NIKHEF 2005 SAC NIKHEF 21 May 2005 9 Quad-chip module 2x4 chip carrier 2x2 sensor Swatch movie 19 keV Mb source 5 fps

10. © NIKHEF 2005 SAC NIKHEF 21 May 2005 10 Photon/electron Imaging Industries

11. © NIKHEF 2005 SAC NIKHEF 21 May 2005 11 PANalytical, Almelo  XRF  XRD  SAX  X-ray Detectors  2005: market introduction market introduction

12. © NIKHEF 2005 SAC NIKHEF 21 May 2005 12 Advantages of Hybrid Detectors Mainstream CMOS Follow semiconductor technology innovation Follow semiconductor technology innovation Yield, Price/Performance, turn-around Yield, Price/Performance, turn-around Radiation Resistance Radiation Resistance Increasing pixel functionality 0.25 μm 33 x 10 6 transistors/chip 0.25 μm 33 x 10 6 transistors/chip 130 nm, 90 nm > 10 9 transistors/chip 130 nm, 90 nm > 10 9 transistors/chip Freedom of choice for the sensor Higher-Z materials GaAs, CdTe, CZT > 20 keV Higher-Z materials GaAs, CdTe, CZT > 20 keV Gas-avalanche chambers Gas-avalanche chambers Micro Channel Plate in vacuo Micro Channel Plate in vacuo } < 4 keV

13. © NIKHEF 2005 SAC NIKHEF 21 May 2005 13 The Future through-via etching and wafer thinning courtesy IMEC Leuven

14. © NIKHEF 2005 SAC NIKHEF 21 May 2005 14 Fully tiled X-ray imager pitch redistribution 3D-stacking Gbit/s serial readout

15. © NIKHEF 2005 SAC NIKHEF 21 May 2005 15 4-Side Tiling: Through the Wafer 2 μm courtesy IMEC Leuven 2 µm wide trench with polySi filling, insulated with Oxide, 20 µm deep

16. © NIKHEF 2005 SAC NIKHEF 21 May 2005 16 Gbit/s Readout Mpix2MXR20: simulations 500 MHz (?) 2 ms readout time (?) 250 frames/sec @ 50%

17. © NIKHEF 2005 SAC NIKHEF 21 May 2005 17 TLK3101 TRANSCEIVER 2.5 Gbps to 3.125 Gbps On-Chip 8-Bit/10-Bit Encoding/Decoding Comma Alignment and Link Sync On-Chip PLL Clock Synthesis

18. © NIKHEF 2005 SAC NIKHEF 21 May 2005 18 Next step: 130 nm Technology 1 mm 2 chip Serial Transmitter in 130 nm Multi-Project Wafer submit J.R. Schrader NIKHEF

19. © NIKHEF 2005 SAC NIKHEF 21 May 2005 19 Next step: 130 nm Technology Chip Pseudo random generator (at 3.2 Gbps) Eye diagram TXRX Pre-emphasisTransmitter: now runs at 5 Gb/s BER < 10 -12 ~ 40 mW J.R. Schrader NIKHEF / UTwente 30 m RG58U

20. © NIKHEF 2005 SAC NIKHEF 21 May 2005 20 Funding FOM: Projectruimte (2002, with MESA) STW: Project with FEI and Leiden EU-FP5+6: TMR 1999/ M.Curie2001/ IP (IdePhix) / STREP EZ: Senter/IWT/Eureka (with IMEC) FOM: Industrial Partnership Program (IPP) Industry: Technology Transfer (PANalytical) green: succesful yellow:failed red: targeted

21. © NIKHEF 2005 SAC NIKHEF 21 May 2005 21 Conclusions  Hybrid Pixels Detectors are Mature  Tiling 2 x N chips is solved  Tiling N x N chips will come soon  Gbit/s IO will offer > kHz frame rates  Next IC-Technology Nodes (130, 90 nm): more functionality per pixel … a Spectroscopic Imager ? a Spectroscopic Imager ?