1. 24 March 2014 The ups and downs of the MaPSA project March 2014francois.vasey@cern.ch1

2. MaPSA-Light Development (1) March 2014francois.vasey@cern.ch2 + = MPA-wafer Sensor or MPA-MPW 6” or 8” Nov 2013

3. MaPSA-Light Development (1) March 2014francois.vasey@cern.ch3 + = MPA-wafer Sensor or MPA-Light-MPW 6” or 8” NEW Sensor-Light 4”

4. MaPSA-Light Development (2) Try also assembly without requiring compatibility with TSV option, to have a best-case comparison basis March 2014francois.vasey@cern.ch4 MPA wafer MPA wafer-level Test Sensor wafer Sensor test Sensor UBM, bump, dice MPA TSV Option MPA UBM, dice MaPSA assembly MaPSA test Chip foundry Sensor foundry Assembler 1 (TSV) Assembler 2 (no TSV) Assembler 3 (only TSV) HEP Nov 2013

5. Chats with TSV-capable companies IPdia – Visit to CERN 15 Jan IMEC – Visit to IMEC 26 Feb Both agreed that 1000-2000$/wafer was a likely TSV processing price – (Si sensor 6” wafer price estimate: 1200 CHF) Both spontaneously proposed alternatives to TSVs for MPA-MPA interconnectivity March 2014francois.vasey@cern.ch5

6. Outer Tracker Layout Evolution March 2014francois.vasey@cern.ch6 Tilted Barrel is becoming baseline (no need for MPA z-interconnectivity anymore)

7. MaPSA-Light Development (2) TSV compatibility becomes low priority March 2014francois.vasey@cern.ch7 MPA wafer MPA wafer-level Test Sensor wafer Sensor test Sensor UBM, bump, dice MPA TSV Option MPA UBM, dice MaPSA assembly MaPSA test Chip foundry Sensor foundry Assembler 1 (TSV) Assembler 2 (no TSV) Assembler 3 (only TSV) HEP NEW

8. MaPSA-Light Development (3) francois.vasey@cern.ch 8 Substrate Strip sensor Cooling SSA March 2014 MAPSA Nov 2013

9. MaPSA-Light Development (3) francois.vasey@cern.ch 9 March 2014 NEW PS module completely re-designed to cope with thermal load

10. MPA and bumps are between sensors ! francois.vasey@cern.ch 10 Strip sensor March 2014 Cooling Pixel Sensor …Plus: Cannot get bumped MPAs from TSMC Because of mixed wire/bump bond requirement - Why not shift constraint to more flexible sensor producer ?

11. Flipping the MaPSA upside down francois.vasey@cern.ch 11 Strip sensor March 2014 Cooling Pixel Sensor Strip sensor Cooling Extended Pixel Sensor Proposal Nov 2013

12. MaPSA-Light Development (3) Pixel Sensor is extended to include passive routing edge and wire bond area – Can this be done in 6” and 8” wafer? MPA has an additional I/O bump row – Can bumped 12” MPA-wafer be tested? Assembler does only MPA dicing and flip chipping MPA directly cooled (sensor cooled through MPA) Pix sensor HV connection as in 2S module No material between pix and strip sensor March 2014francois.vasey@cern.ch12 Proposal Extended Pixel Sensor

13. Generous Development Sequence March 2014francois.vasey@cern.ch13 MPA-Light design Req Doc RFQ Study OK MaPSA-Light Report MaPSA Test Production Q1 2014 Q2Q3Q4Q1 2015 Sensor-Light design Nov 2013

14. Slipping Development Sequence March 2014francois.vasey@cern.ch14 MPA-Light design Req Doc RFQ Study OK MaPSA-Light Report MaPSA Test Production Q1 2014 Q2Q3Q4Q1 2015 Sensor-Light design NEW Flipped MPA