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Test of HV Prototype Boards for LHCb Outer Tracker NIKHEF, Amsterdam The Netherlands 2003-10-16.

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Presentation on theme: "Test of HV Prototype Boards for LHCb Outer Tracker NIKHEF, Amsterdam The Netherlands 2003-10-16."— Presentation transcript:

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2 Test of HV Prototype Boards for LHCb Outer Tracker NIKHEF, Amsterdam The Netherlands 2003-10-16

3 HV Boards Johanson Capacitors PCB Embedded Working HV = 1,600V Mass Production: 1,950 Test items:  Leakage Current  Capacitance  Micro-cracks inside Caps x 32

4 Experimental Setup HV to gnd net on HV boards may contributes to the measured leakage currents!

5 Experimental Setup (cont.) HV = 2kV, Thermal Cycling = 20 o C ~73 o C, Time = 24days, 15 boards are tested

6 Temperature Cycling Temperature Cycle: 20 o C 45 min. 20 o C  73 o C 15 min. 73 o C 45 min. 73 o C  20 o C 15 min. Relative Humidity, not controlled, but kept low when temperature goes down Due to unknown error of the temperature control system

7 Leakage Currents Leakage currents of 15 boards are logged, as well as the temperature and relative humidity

8 One Thermal Cycle Left: with gnd net on HV board connected Right: only 32 output pins of capacitors connected Contribution from HV to gnd net on HV board: ~1nA@T=20 o C and ~10nA@T=73 o C

9 Correlation with Temperature and RH Spread at T=73 o C (T=20 o C) is caused by time needed to warm up (cool down) the capacitors inside PCB Not sensitive to RH anymore

10 Spikes It is highly suspected that:  T goes down to <0 o C due to unknown error;  ice formed on the board surface;  T goes up to 0 o C, ice turns to be water to make board surface conductive  current spike occurs

11 Leakage current at T=20oC I leak of each board ↓ < 2nA, including the component from HV to gnd net on HV boards

12 Capacitance Measurement 480 Capacitors 479: ~30pF less than before 1: 187pF, 2/3 of other capacitors A crack found under microscope

13 Summary I leak of each board < 2nA after 24-day HV-on 1 of 480 channels of capacitors has merely been broken by 24-day thermal cycling. Micro-cracks could be detected by thermal cycling, although cycling conditions should be optimized by further study.


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