1. An Unobtrusive Debugging Methodology for Actel AX and RTAX-S FPGAs Jonathan Alexander Applications Consulting Manager Actel Corporation MAPLD 2004

2. 2182/MAPLD 2004Alexander Logic Design Challenges  Designs often don’t work the way they were intended to the first time  Device Issues  Timing Problems  External setup/hold  Clock skew  Cross-clock domain paths  Software/Timing model bug  Device speed (faster or slower than expected)  Device Problems  Damage due to electrical overstress (EOS)  Defect  Packaging  Non-Device Issues  Signal Integrity  V IH /V IL  Ground/Vcc Bounce  Cross Talk  Termination  Edge rates  Power supply noise  Assembly  Solder shorts  Component orientation  Component alignment  PCB Design or PCB Manufacturing  Spacing rules  Shorts/Opens

3. 3182/MAPLD 2004Alexander Debugging Challenges  Non-Device Issues  Signals can be directly probed on a PCB  Power supplies can be probed  Resistance can be measured  Components can be replaced  JTAG tests for continuity  Must have test points and test headers for access to signals  Device Issues – ASIC  Custom test vectors offer high coverage for the specific design implemented  Test points and test blocks built into device  Limited access to internal nodes  Long and expensive re-spins

4. 4182/MAPLD 2004Alexander Debugging Challenges (Cont’d)  Device Issues – Reprogrammable FPGAs  Device can be reprogrammed to access internal node activity  Debuggers are available for pre-determined node access  Manufacturers have very high test coverage and can retest devices  Re-place and route required to view different nodes  Timing issues very difficult to detect due to requirement of a new place and route  Device Issues – Axcelerator FPGAs  Manufacturer has very high test coverage for production screen  Built-in probe circuitry gives access to virtually every net in the design without additional programming or redesign  Design-specific test vectors are needed for manufacturer failure analysis

5. 5182/MAPLD 2004Alexander Axcelerator Design and Debug Flow

6. 6182/MAPLD 2004Alexander Probe Setup  Silicon Explorer 2  Serial port connection between PC and Probe header on board  100MHz asynchronous sampling  Multilevel triggering  Four internal probe channels  18 total logic analyzer channels (4 may be used for internal probing)  Requires 5V or 3.3V power. Power can be taken from the PCB (~1 Amp required) or from supplied power converter.  18 X 64K sample buffer

7. 7182/MAPLD 2004Alexander Axcelerator Probing Setup

8. 8182/MAPLD 2004Alexander Control Registers Axcelerator Probe Circuitry  JTAG Test Access Port (TAP) used for control interface  Silicon Explorer connects to JTAG TAP to designate XY coordinate of cell to observe.  Cell output is transmitted to one of four available probe output pins.  Dynamic Internal Node Access  Nodes can be selected and changed while device is in full system operation  Selecting a node has no impact on design performance

9. 9182/MAPLD 2004Alexander Axcelerator Cell Probe Selection Example

10. 10182/MAPLD 2004Alexander Silicon Explorer Logic Analyzer 2 1 3 4

11. 11182/MAPLD 2004Alexander Silicon Explorer Logic Analyzer 1. Probe Control  This section shows what signal each probe is assigned to  This section will also shows what the Checksum of the device is, allowing the user to verify that the device has been programmed with the correct design 2. Node Listing  This section shows all the nets/nodes that can be probed 3. Waveform Viewer  This is the window where all waveforms captured by the Silicon Explorer II are displayed. 4. Menu  This is where all the controls are located  It allows manipulation of the waveforms

12. 12182/MAPLD 2004Alexander Probe Performance  Maximum observable signal speed  Worst case RTAX-S simulations show 100MHz signals can be observed without distortion  Typical case RTAX-S simulations show that up to 150MHz signals can be observed without distortion

13. 13182/MAPLD 2004Alexander Probe Guidelines  The Silicon Explorer gives access to internal nodes through XY coordinates  Built in logic analyzer can be used to view signals at 100MHz sample rate  Oscilloscope or other logic analyzer can connect to probe outputs to view signals with higher resolution  Measuring delays  The probe circuit is not designed to accurately reflect internal delays. Only logic states and timing approximations should be considered  Errors due to timing can be observed such as hold and setup violations on a flip flop.

14. 14182/MAPLD 2004Alexander Probe Guidelines  Design Tips  Reserve the probe pins in Actel’s Designer software. This will prevent the probe pins from being used as IOs  Avoid assigning probe pins as inputs or bi-directionals. If the pins are needed for IO, use them only as non-critical outputs  Avoid assigning JTAG pins as inputs or bi-directionals. If the pins are needed for IO, use them only as non-critical outputs  Do not program the security fuse in the FPGA. This will disable the probe circuitry in the device.  The probe circuitry allows four simultaneous internal signals to be monitored with a maximum of two signals per tile.  70 Ohm series resistors are recommended on every probe connection

15. 15182/MAPLD 2004Alexander Conclusion  Real-time observation of internal nodes allows you to Find:  Timing violations  Logic errors  Large glitches  Un-obtrusive probe circuitry means:  No need to re-place and route design  No additional delay added to design when probing  No FPGA logic gates needed