1. Automated HIC assembly A. Di Mauro ITS-MFT mini-week 12.03.2014

2. VEA is an Italian company specialized in artificial vision and robotic systems (SDD cables quality checks performed using a system from this company) In order to achieve the required accuracy (5  m in chips position) and repeatability, Linear Positioning Stages (X,Y,Z) have been preferred to robotic arms (faster but less precise) The structures are simple and also the mathematical model to compensate errors due to thermal expansion is quite simple This machine allows the HIC assembly for both IB (1 x 9 chips) and OB (2 x 7 chips) by simple replacement of the "assembly frame", the "FPC stack" and the “soldering balls grid“. 12/03/2014 ITS-MFT mini-week - Autom. HIC assembly - A. Di Mauro 2 Automated HIC assembly system from VEA

3. TOP VIEW SIDE VIEW X or Y Linear Positioning Stage -200 mm/s -0.05  m unidirectional repeatability -0.2  m bidirectional repeatability System overview 3 Z LPS with 0,1 μm unidirectional repeatability

4. MOBILE TABLE TOP VIEW Ultra high-precision rotation stage - ± 1.7  rad (0.0001 o ) repeatability The assembly frame is positioned on the rotation stage, components are held by vacuum. 4 System overview

5. SIDE VIEW An aluminium bridge structure supports all actuators to manipulate the various components and the laser head All components (chips, FPC, soldering grid, soldering balls) are stored in the various stacks and “moved” under the corresponding actuator fixed on the bridge; each actuator picks- up or release the component moving in Z direction (vertical LPS) Various video cameras are used to measure positions or monitor the process 5 System overview

6. Cycle time estimation 12/03/2014 ITS-MFT mini-week - Autom. HIC assembly - A. Di Mauro 6 PhaseNormal time (s) Pessimistic time (s) Chip placement5.58.1 FPC placement5.88.5 Soldering balls grid placement5.88.5 Soldering balls placement (group of 22)3.810.5 Laser soldering (time per contact)510 Worst case scenarios: -9 chips → 9x8.1 + 8.5 + 8.5 + 9x(4x10.5) + 9x(88x10) = 8388” = ~ 2 h 20’ -2x7 chips → 14x8.1 + 8.5 + 8.5 + 14x(4x10.5) + 14x(88x10) = 13039” = ~ 3 h 38’ Manual operations not included: -components preparation and loading in respective stack/pallet -mounting of lid for vacuum and

7. Further tasks: QA checks Such a system can perform QA checks (HW OK, dedicated process to be added in vision system): FPC: continuity and quality of traces, diameter and aspect of holes chip: integrity, dimension, quality of pads HIC metrology Depending on requirements, such task could add several hours to the production of each HIC 12/03/2014 ITS-MFT mini-week - Autom. HIC assembly - A. Di Mauro 7

8. 12/03/2014 ITS-MFT mini-week - Autom. HIC assembly - A. Di Mauro 8 Spare slides

9. STEP 1: CHIP PLACEMENT The "chip manipulator" consists of a "chip vacuum grip" and a LPS to perform vertical movements (Z-axis). -The "mobile table" moves until the "chip manipulator" is above a given cell of the "chips pallet". -The "chip manipulator" is lowered and the "chip vacuum grip" takes a chip from the cell. -The "chip manipulator" is raised and the "mobile table" moves under the camera 1 to measures the “reference” position of the chip. -The "mobile table" and the "rotation stage" positions are then adjusted in order to deposit the chip from the "chip manipulator" in the correct position on top of to the “assembly frame". -The operation is repeated 9 (or 14) times. 9

10. STEP 2: FPC and balls grid placement The "FPC manipulator" consists of a "FPC vacuum grip" and a LPS to perform vertical movements (Z-axis). -The "mobile table" moves until the "FPC manipulator" is above the "FPC stack". -The "FPC manipulator" is lowered and the "FPC vacuum grip" takes an FPC from the "FPC stack". -The "FPC manipulator" is lifted -The "mobile table" moves under the cameras 2 and 3 to measure the reference position of the FPC. -The "mobile table" and the "rotation stage" positions are then adjusted in order to deposit the FPC in the correct position on top of the "assembly frame". -The same operations described above are replicated to place the "balls grid" 10

11. STEP 3: soldering balls placement The “soldering balls (SB) manipulator” consists of a “SB vacuum grip”, a LPS to perform vertical movements (Z-axis), and a LPS to perform horizontal movements (X axis). The “SB vacuum grip” can load a group of balls or also a single ball (in case of missing ball in the deposited group). -The “SB manipulator” moves on top of the SB distributor. -The “SB manipulator” is lowered and the “SB vacuum grip” loads an ordered group of 12 balls from the “SB distributor”. -The “SB vacuum grip” is lifted and moved to the centre of the table; during this movement it passes over the camera 4 which controls the presence and the correct positioning of all the balls. -The “mobile table” and the “rotation stage” are then adjusted in order to deposit the balls in the correct position on top of the “balls grid”. 11

12. THE SOLDERING BALL DISTRIBUTOR TOOL 12 The "balls distributor" is composed of an aluminium vessel machined from a full piece where the grooves (10% larger than ball diameter) are formed for the individual spheres. There is a "spare ball cannel" to take a single ball with the "single ball vacuum grip" that is included in the "vacuum grip balls." The "balls distributor" is provided with a movement of controllable vibration which allows a uniform distribution of the spheres.

13. 13 STEP 4: soldering TOP VIEW The laser head is mounted in the support bridge with a vertical LPS stage. - The "mobile table" moves in order to position each hole under the laser head, after soldering each single ball, the camera mounted on the laser head (connected with the vision system) analyses every single soldering. STEP 5: soldering balls grid removal - The "mobile table" moves in order to position assembly frame under the FPC manipulator, the balls grid is removed and put back in its container. STEP 6: HIC removal - The assembly frame holding the HIC is removed by the operator.