1. Tunnel Electronics Baseline Issues Snowmass Workshop August 25, 2005 Ray Larsen for SLAC ILC Group

2. August 25, 2005Tunnel Electronics R.S. Larsen2 Outline  Motivation: Cost Reduction  Risks: Radiation Damage, Lower Availability  Fy2000 Study  New Developments  Proposed R&D  Baseline Recommendations

3. August 25, 2005Tunnel Electronics R.S. Larsen3 NLC Cost Reduction Study Fy2000  Lehman cost model: 1 Tunnel - Alcoves every 235m  Electronics near sensors in concrete wall “TEE’s” Eliminate long-haul cables Sacrificial short-hauls (pigtails) Protect COTS electronics against gammas, neutrons Serial digitized data out on copper, fiber Consider Wireless for slow data, Robotics servicing  BPMs, LLRF, vacuum pumps-gauges-valves, magnet movers, temperature, MPS-BCS-PPS... Gigabit links to next level - BW not an issue.

4. August 25, 2005Tunnel Electronics R.S. Larsen4 TEE Basic Models * *Preliminary - S. Rokni & S. Roessler

5. August 25, 2005Tunnel Electronics R.S. Larsen5

6. August 25, 2005Tunnel Electronics R.S. Larsen6 Fy2000 Results  Radiation protection “would likely work”  Concrete wall depth marginal– extra bumps easy if casting. Civil cost not estimated.  Packaging, cooling seems feasible  All connectors on module rear for robotic remove/replace RF coax plug-in connectors a major issue Robotic economic study done (J. Cornuelle w/ Stanford ME dept.) – seems feasible.  Significant cost reductions possible

7. August 25, 2005Tunnel Electronics R.S. Larsen7 Lehman ($253K) vs. CD 0.4 ($118K) TEE Cost Reduction $135M (53%)

8. August 25, 2005Tunnel Electronics R.S. Larsen8 ILC Proposed Tunnel Models Dual Shallow or Deep Tunnels  Two versions for MK  Access every n Km  Lateral penetrations every ~40 m for short WG or cable feeds  Fig. A: Instrumentation in Aux. Tunnel, long cables to sensors  Fig. B: Instrumentation in Beam Tunnel, short cables to sensors, data cables to Aux tunnel MK (X) I,M (X) KB I, B (A) (B) Cables Cables + WG

9. August 25, 2005Tunnel Electronics R.S. Larsen9 2-Tunnel Model w/~Penetrations ~6in. Penetration Module Tray

10. August 25, 2005Tunnel Electronics R.S. Larsen10 ILC Linac Instrumentation (~40m) ~1m ATCA Standard Module

11. August 25, 2005Tunnel Electronics R.S. Larsen11 Proposed New Study In-Tunnel Instrumentation  2-Tunnel instrument model never estimated. Radiation modeling for electronics just starting  New state-of-art circuit, packaging models needed BPMs, LLRF, tuners, movers, cryo temperature, vacuum, etc. Standard module designs, mezzanine cards, hot swap Robotic module replacement

12. August 25, 2005Tunnel Electronics R.S. Larsen12 New Commercial Developments Since Fy2000 High density plug connectors up to 5 GHz available (ATCA) – interface on rear adapters High Availability standard architectures (ATCA) Hot swap modules demonstrated (ATCA) New cooling options available including liquid leak-less plugs on backplane (Rittal, ATCA) Gigabit communications w/ embedded processor chips, $5 Wireless chips, high speed 12-14 bit sampler ADC-DAC commodity products, more to come….. Cannot afford to NOT explore latest technologies.

13. August 25, 2005Tunnel Electronics R.S. Larsen13 Baseline Recommendation  BCD R&D: Re-model all systems to state-of-art electronics, HA packaging, communications Estimate BCD model - all electronics in Auxiliary tunnel, short penetrations to beam tunnel (10m) at ~40m  ACD R&D: Redefine tunnel packaging, protection scenarios for cold machine, COTS electronics Study Rad-Hard design for vac-ion pumps Study Robotics maintenance model Re-estimate potential cost-availability benefits