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CS510 Computer Architectures

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Presentation on theme: "CS510 Computer Architectures"— Presentation transcript:

1 CS510 Computer Architectures
Lecture 2 Cost Cost CS510 Computer Architectures

2 CS510 Computer Architectures
nMOSFET NMOS Transistor(NMOS FET) n+polysilicon low pressure chemical vapor deposition N+ SiO2, Oxidation (approx. 0.6 micron) Gate oxidation(approx 0.05 micron) Form Source and Drain areas As ion implantation P-type silicon Cost CS510 Computer Architectures

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NMOS Inverter Oxidation grow n+ n+ Etching contact area aluminum deposit, form pattern Aluminum(connection) Cost CS510 Computer Architectures

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Wafer, Die, IC Wafer F F F F F F F F F F F F F F Processing Slicing F IC F Die Packaging Cost CS510 Computer Architectures

5 Integrated Circuits Costs
IC Cost = Die Cost + Testing cost + Packaging Cost Final Test Yield Wafer Die Processing Testing Packaging Testing Yields = good dies processed dies Cost CS510 Computer Architectures

6 Integrated Circuits Costs
IC cost = Die cost Testing cost Packaging cost Final test yield Die cost = Wafer cost Dies per Wafer x Die yield Cost CS510 Computer Architectures

7 Integrated Circuits Costs
IC cost = Die cost Testing cost Packaging cost Final test yield Die cost = Wafer cost Dies per Wafer x Die yield Dies per wafer = p * ( Wafer_diam / 2) p * Wafer_diam Die Area (2 * Die Area)0.5 - Test Dies per wafer Cost CS510 Computer Architectures

8 Integrated Circuits Costs
IC cost = Die cost Testing cost Packaging cost Final test yield Die cost = Wafer cost Dies per Wafer x Die yield Dies per wafer = p x ( Wafer_diam / 2) p x Wafer_diam Die Area (2 x Die Area)0.5 Defects_per_unit_area x Die_Area (manufacturing complexity(No. of masking levels)) Die Yield = Wafer yield x {1+ - a } Cost CS510 Computer Architectures

9 Integrated Circuits Costs
Die Cost goes roughly with (die area)4 example : defect density : 0.8 per cm2 a = 3.0 case 1: 1 cm x 1 cm die yield = (1+(0.8x1)/3)-3 = 0.49 case 2: 1.5 cm x 1.5 cm die yield = (1+(0.8x2.25)/3)-3 = 0.24 20-cm-diameter wafer with 3-4 metal layers : $3000-$4000 in 1995 assume $3500 case 1 : 132 good 1-cm2 dies, $27 case 2 : 25 good 2.25-cm2 dies, $140 Cost CS510 Computer Architectures

10 CS510 Computer Architectures
Real World Examples Chip Metal Line Wafer Defect Area Dies/ Die Layers Width Cost /cm2 mm2/Wf Yield Cost 486DX $1, % $12 Power PC $1, % $53 HP PA $1, % $73 DEC Alpha $1, % $149 Super Sparc $1, % $272 Pentium $1, % $417 From "Estimating IC Manufacturing Costs,” by Linley Gwennap, Microprocessor Report, August 2, 1993, p. 15 Cost CS510 Computer Architectures

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Other Costs Die Test Cost = Test Jig Cost * Ave. Test Time Die Yield Packaging Cost: depends on pins, heat dissipation, beauty, ... Chip Die Package Test & Total cost pins type cost assembly cost 486DX2 $ PGA $11 $ $35 Power PC 601 $ QFP $3 $ $77 HP PA 7100 $ PGA $35 $ $124 DEC Alpha $ PGA $30 $ $202 Super SPARC $ PGA $20 $ $326 Pentium $ PGA $19 $ $473 QFP: Quad Flat Package PGA: Pin Grid Array BGA: Ball Grid Array Cost CS510 Computer Architectures

12 Cost/Performance What is Relationship of Cost to Price?
Component Costs List Price 100% Component Cost 100% Cost CS510 Computer Architectures

13 Cost/Performance What is Relationship of Cost to Price?
Component Costs Direct Costs (add 25% to 40% of component costs) Recurring costs: labor, purchasing, scrap, warranty List Price 100% Direct Cost 20% to 28% Component Cost 72% to 80% Cost CS510 Computer Architectures

14 Cost/Performance What is Relationship of Cost to Price?
Component Costs Direct Costs (add 25% to 40%) recurring costs: labor, purchasing, scrap, warranty Gross Margin (add 82% to 186%) nonrecurring costs: R&D, marketing, sales, equipment maintenance, rental, financing cost, pretax profits, taxes List Price PC’s -- Lower gross margin - Lower R&D expense - Lower sales cost Mail order, Phone order, retail store… - Higher competition Lower profit, volume sale,... 100% Gross Margin 45% to 65% Direct Cost 10% to 11% Gross margin varies depending on the products High performance large systems vs Lower end machines Component Cost 25 % to 44% Cost CS510 Computer Architectures

15 Cost/Performance What is Relationship of Cost to Price?
Component Costs Direct Costs (add 25% to 40%) recurring costs: labor, purchasing, scrap, warranty Gross Margin (add 82% to 186%) nonrecurring costs: R&D, marketing, sales,equipment maintenance, rental, financing cost, pretax profits, taxes Average Discount to get List Price (add 33% to 66%): volume discounts and/or retailer markup List Price 100% Average Discount 25% to 40% Avg. Selling Price Gross Margin 34% to 39% Direct Cost 6% to 8% Component Cost 15% to 33% Cost CS510 Computer Architectures

16 Cost/Performance What is Relationship of Cost to Price?
List Price Direct Cost Gross Margin Average Discount Component Cost 15~33% 6~8% 34~39% 25~40% Direct Cost Gross Margin Component Cost 25~44% 10~11% 45~65% ASP Direct Cost Component Cost 72~80% 20~22% Component Cost 100% +(25~40)% +(82~186)% +(33~66)% Cost CS510 Computer Architectures

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Cost CS510 Computer Architectures

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Cost CS510 Computer Architectures

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Chip Prices (August 1993) Assume purchase 10,000 units Chip Area Mfg. Price Multi- Comment mm2 cost plier 386DX 43 $9 $ 486DX2 81 $35 $ PowerPC $77 $ DEC Alpha 234 $202 $ Pentium 296 $473 $ Intense Competition No Competition Recoup R&D? Early in shipments Cost CS510 Computer Architectures

20 Workstation Costs: $1000 to $3000
DRAM: % to 55% Color Monitor: 15% to 20% CPU board: 10% to 15% Hard disk: 8% to 10% CPU cabinet: 3% to 5% Video & other I/O: 3% to 7% Keyboard, mouse: 1% to 2% Cost CS510 Computer Architectures

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Learning Curve Unit $ production costs time to introduce new product volume Years Cost CS510 Computer Architectures

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Volume vs Cost Manufacturer: If you can sell a large quantity, you will still get the profit with the lower selling price Lower direct cost, lower gross margin Consumer: When you buy a large quantity, you will get a volume discount MPP manufacturer vs Workstation manufacturer vs PC manufacturer Cost CS510 Computer Architectures

23 CS510 Computer Architectures
Volume vs. Cost Rule of thumb on applying learning curve to manufacturing: “When volume doubles, costs reduce 10%” A DEC View of Computer Engineering by C. G. Bell, J. C. Mudge, and J. E. McNamara, Digital Press, Bedford, MA., 1978. Example: nodes = 8,000 nodes/year vs. 100,000 Workstations/year Workstation volume = 12.5 x MPP volume 12.5 = 23.6 Workstation cost: (0.9)3.6 = 0.68 For workstations, cost should be 1/3 less of MPP What about PCs vs. WS? Cost CS510 Computer Architectures

24 Volume vs. Cost: PCs vs. Workstations
PC 23,880, ,547, ,006, ,480,000 WS 407, , , ,585 Ratio 65X = (0.9)6.0 = 0.53 = For whole market 50% costs for PCs vs. Workstations Single company: 20% WS market vs. 10% PC market Ratio 32 32X = (0.9)5.0 = 0.59 = For single company 60% costs for PCs vs. Workstations Cost CS510 Computer Architectures

25 High Margins On High-End Machines
R&D considered Return On Investment (ROI) = about 10% Every $1 R&D must generate $7 to $13 in sales High end machines need more $ for R&D Sell fewer high end machines Fewer to amortize R&D Needs Much higher margins Cost of 1 MB Memory (January 1994): PC $ (Mac Quadra) WS $ (SS-10) Mainframe $1,920 (IBM 3090) Supercomputer $ (M90 DRAM) $1,375 (C90 15 ns SRAM) Cost CS510 Computer Architectures

26 Recouping Development Cost On Low Volume Microprocessors?
Hennessy says MIPS R4000 cost $30M to develop Intel rumored to invest $100M on 486 SGI/MIPS sells 300,000 R4000s over product lifetime? Intel sells 50,000, s? Intel must get $100M from chips (100M/50M=$2/chip) SGI/MIPS can get $30M from margin of workstations vs chips vs. 30M/0.3M=$100/chip Alternative: SGI buys chips vs. develops them Cost CS510 Computer Architectures

27 Price/Performance: Gross Margin vs. Market Segment
0% 20% 40% 60% 80% 100% Mini W/S PC Average Discount Gross Margin Direct Costs Component Costs Cost CS510 Computer Architectures


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