2. Jean-Philippe Tock (TE-MSC) On behalf of the SMACC project

3.  Activities since last LSC (10/01/2014)  Arc splices installation By Activities By sectors  SIT  DFBA (See next presentation)  Dashboards  Specials  Quadrupole diodes  Dipole diodes  Activities for the next 2 weeks  Conclusions

4. JPh Tock 4/34  Sector 56 :  Final leak test and surface work on DFBAK SHM  Investigation on dipole diodes  Sector 67 : Pressure test planned for 15.01.2014  Leak tests, ElQA  Sector 78  Progress on M leak tests and closure of interconnections  Disconnect DFBAO SHM (Priority to be defined)  Sector 81  Complete the M lines rewelding  M leak tests  Sector 12  Complete electrical insulation  Progress on quad diodes consolidation  Sector 23  Cu machining  Installation of shunts  Start electrical insulation  Sector 34  Cu machining  Installation of shunts  Sector 45  M lines opening & ElQC in the zone of He spill test, temporary reclosure of ICs SMACC Main activities for the last 2 weeks   OK, 8 remain due to NCs > Half done but on hold  OK, 3 remains due to NCs   OK, 6 remain due to NCs  >25% done    On-going, Splices condemned by spill test were measured, reclosure completed this week    Pressure tested successfully, See later SHM disconnecred and at the surface > 90% leak tested, > 80% reclosed > 75 % tested On-going, almost half done  From last LSC (10.01.2014) All is reclosed but the IC with DFBAK, Good progress, see next presentation Insulation vacuum leak tested on >80% of S56 OK, 14 remain due to NCs   >50% done

5. JPh Tock 5/34 SEQUENCE AND STATUS OK to open 8 sectors Open ICs 8 sectors Install DN200 100 % Open M sleeves > 7.4 sectors ElQC (old splices) > 7 sectors Undo / Redo splices ≈ 6.5 sectors ElQC (new splices) Machine Cu > 6.5 sectors ElQC after Cu mach. ≈ 6.5 sectors Install shunts > 6.3 sectors ElQC after shunt > 6 sectors Insulate splices ≈ 5.2 sectors Weld M > 4.2 sectors Leak test M > 3.2 sectors Close IC ≈ 3 sectors Final LT ≈ 1.9 sector Consolidate Q diodes ≈ 4.6 sectors Stopped, Will slightly impact in 2 weeks Cancelled Completed

6. JPh Tock 6/34 SMACC Progress report by activity Courtesy H Prin  Desoldering / Resoldering: Completed in about 6.5 sectors equivalent  Desoldering in 23 is completed and well advanced in 34  54 ICs had not almost no splices to be redone (1 of) For geometrical reason  Still enough ICs available for Cu machining 97 77

7. JPh Tock 7/34 SMACC Progress report by activity  Shunts are installed in ≈ 6.4 sectors-eq (1354 ICs ≈ 80%) Almost completed in 23 Work in sectors 23-34 (No infrastructure at P3) Slightly > 1 week ahead of schedule Mind the last X% effect Shunt weekly installation rate (4 weeks sliding average)

8. JPh Tock 8/34 SMACC Progress report by activity  Insulation box: Installed in 5.2 sectors equivalent Courtesy H Prin / G Maury > 80 injected in W3 and in W4 > 50 ICs are ready for injection Under recovery (< 1 week behind baseline) Only 7 IC left in 5 first sectors (<1 %) Buffer of >3 weeks wrt welding 92

9. JPh Tock 9/34 SMACC Progress report by activity  M Welding : ≈ 872 ICs welded, > 4 sec-eq:  Routinely 12 ICs/day  Work concentrated in 1 sector  4 leaks were found end of 2013 (2 in S78 and 2 in S81) Investigations are still on-going (2), To be followed As presented LSC 4.10.2013 11 weeks @ 34 18 weeks @ 51 37 ICS behind forecast (Eq to 3 days ; Recovered in a month)

10. JPh Tock 10/34 SMACC Progress report by activity  M sleeves leak testing : (780 ICs) are leak tested (> 3.5 sec-eq)  Following the M lines  About 1 month behind schedule  Should recover as for the M welding Courtesy P Cruikshank / L Mourier

11. JPh Tock 11/34 SMACC Progress report by activity  Reclosure of interconnections : Almost 3 sec equivalent are reclosed  Started closing 81 about a week ahead of baseline  Reclosing temporarily IC in 45 for He Spill test  Only 15 IC (About 1 day) behind schedule globally

12. JPh Tock 12/34 SMACC Progress report by activity  Final leak test: ≈ 1.7 sec equivalent completely validated  3 weeks to have results after repumping  4 subsectors under test in 78, 5 th one next week (> 1/3)  First sector to be released soon in 81 (Today or beginning of next week)  About 5 weeks behind schedule; limited by release rate

13. SMACC Sector 67  Leak test at 10 bar (half design pressure)  QRL, LSS cryostats, Arc beam vacuum : OK  Magnet cryostat and DFBAs: New leak on C’K circuit (A19R6) at 10 bar, recloses at 1 bar Longitudinal localisation and repair with the other NCs  Demonstrates the interest of the “0.5 * design pressure leak test” Dixit P Cruikshank  Purge is on-going To come:  ElQA  Flushing  ElQA  Campaign to fix NCs (leaks, thermometer, possible short circuits in diodes, ?)  beginning of March 14 Courtesy P Cruikshank

14. JPh Tock 14/34 SMACC Progress report by sector Main activities are :  Work on NCs (Not priority: DFBAO) 1 NC blocks the W leak test of usually 16 ICs  Leak test of M lines  Closure of interconnections  Leak test on insulation vacuum Courtesy M Pojer

15. JPh Tock 15/34 SMACC Progress report by sector Main activities are :  Leak test of M lines  Reclosure of IC Main activity is :  The welding of M lines

16. JPh Tock 16/34 SMACC Progress report by sector Main activities are :  Installation of electrical insulation  Work on overheated splices (More info later)  Preparation for Q diodes consolidation Main activities are :  Almost all old present splices have been measured  Splices redoing  Cu machining  Shunt installation

17. JPh Tock 17/34 SMACC Sector 45 He Spill test W4 (end) : Temporary relosure of W-bellows on 26 Ics (On-going) Preparation of test (TE-CRG) W5 : Half of sector (L5) not accessible for AUG tests W6 : He spill test during the nights (Access restrictions)

18. JPh Tock 18/34 SMACC Dashboards  Opening is completed  Shunting is slightly ahead on schedule  The installation of insulation boxes is recovering  Welding rate is more than required to recover baseline schedule  Reclosure: to increase, next week will be a good benchmark in 81  Insulation vacuum leak test : Limited by release rate

19. Completed New

20. JPh Tock 20/34 SMACC Progress report SIT  SIT  All cryomagnets are reconnected  Team members are partially reinforcing the train and the DFBA activities  Activities linked to NC and overheated splices  Intervention on triplet braids to start end of January (See next slide). Discussions with RP (should be OK). Courtesy N Bourcey, S Le Naour

21. JPh Tock 21/34 SMACC Progress report SIT : Interventions on triplets braid  Consolidation of triplet braids To be confirmed by CRG By order of priority: 1.Q1R1/Q1L5: Install braids 2.Q1L1/Q1R5: Remove braids 3.Q1L2/Q1L8: Remove braids Q1R2/Q1R8: Install braids 4.D1L2/D1L8: Remove braids on DFBX side D1R2/D1R8: Remove braids on arc side Present status :  1 was done in 2009  2 and 3 are planned within SMACC during LS1 Similar to previous interventions but without thermometers  4 will only be done if resources available and no impact on schedule (consider not done during LS1)

22. JPh Tock 22/34 SMACC Dashboards Baseline:66.5 % (62.4 %) Completed:64.4 % (58.8 %) Delay 7 (9) days Baseline:67.8 % (66.8 %) Completed:63.9 % (60.3 %) Delay 24 (27) days Decreasing delay Delay stable  Arc splices: Rates are stable All activities are still on-going Trend should remain in the next 1-2 months Main delay is in S12  DFBA: See next presentation Preliminary

23. JPh Tock 23/34 SMACC Dashboards Progress: Baseline:67.8% (64.4 %) Completed:63.7% (58.4 %) Delay15 (16) days Stable ; Δbaseline >≈ Δcompleted

24. JPh Tock 24/34 SMACC Quadrupole diodes (1/5)  Quadrupole diodes : ON HOLD  4.66 sectors are consolidated (56,67,78, 81 and 2/3 of 12- Up to Q28L2)  Components: 4 types : 1.Stainless steel plates (#4000) : All received with spares 2.Inconel nuts (#8000) : OK for the whole LHC 3.Inconel threaded plates (#4000): For 32 diodes at CERN (2/3 sec-eq). 4.Inconel studs (#8000) : 2 at CERN so < 1 diode-eq Delivery expected from supplier 3 W6  No reliable news from supplier 1  Do not count on its deliveries (Conservative or realistic?) Courtesy L Grand-Clement, R Moron –Ballester, F Savary

25. JPh Tock 25/34 SMACC Quadrupole diodes (2/5)  Quadrupole diodes : ON HOLD Action plan: (1 to 5 on-going in parallel) 1.Splitting the work in 2 to prepare consolidation as much as possible :  5 weeks originally foreseen per sector  All containers are open  Measurements before consolidation and removal of helicoil is on-going in S23   2 weeks per sector when components are available (with the present resources) 2.Launching orders to cover the complete LHC(+margin) without counting supplier 1 3.Visit supplier 3 next Tuesday (28.01.2014) 4.Investigate means to reduce delays (overtime) 5.Procure tooling to allow doubling the team 6.Identify resources with the right profile and who will become free (W5) 7.Train these resources as soon as components are available (W7 onwards) (Goal is to double the rate so  1 week per sector) 8.Assessing the impact on the schedule and interference with other activities (see next slide) and optimising the sequence (Priority by sectors, subsectors with other large NCs,…) Courtesy L Grand-Clement, R Moron –Ballester, F Savary

26. JPh Tock 26/34 SMACC Quadrupole diodes (3/5)  Quadrupole diodes : ON HOLD Impact on other activities: 1.Welding: Can weld 3 ICs/4 and 6 welds/7 2.Welding visual inspection: Have to come back to inspect welds of the diodes containers 3.M lines leak test : Can limit impact on schedule with extra tooling (plugs) Increase the workload, likely in a critical period 4.Closure of interconnections : If Pt3 is OK, 3 ICs/4 can be closed Increase the workload, but likely acceptable 5.Leak test of insulation vacuum Cannot be done According to baseline, should start W14 where we are blocked presently Courtesy L Grand-Clement, R Moron –Ballester, F Savary

27. JPh Tock 27/34 SMACC Quadrupole diodes (4/5) Courtesy L Grand-Clement, F Savary  Quadrupole diodes : Bare busbars Contact resistance QBQI.14L1 Before disconnection (µΩ) After consolidation (µΩ) Busbar/heatsink (µΩ) BB_d_A (less Ni)2.00.20.1 BB_d_B (bare)1.60.40.1 BB_d_C (less Ni)1.30.40 BB_d_D (bare)0.50.40.6 BB_m_A (Ag)1.50.3 BB_m_B (Ag)1.10.3 BB_m_C (Ag)1.40.6 BB_m_D (Ag)2.30.4

28. JPh Tock 28/34 SMACC Quadrupole diodes (4/5) Courtesy L Grand-Clement, F Savary  Quadrupole diodes : Bare busbars Contact resistance QBQI.16R8 Before Disconnection (µΩ) After Consolidation (µΩ) BB_d_A0.50.1 BB_d_B (bare)1.30.4 BB_d_C (less Ni)20.5 BB_d_D (bare)1.00.2 BB_m_A (Ag)0.80.5 BB_m_B (less Ag)0.50.1 BB_m_C (Ag)0.90.3 BB_m_D (less Ag)2.10.2

29. JPh Tock 29/34 SMACC Quadrupole diodes (4/5) Courtesy L Grand-Clement, F Savary  Quadrupole diodes : Bare busbars Bare busbar QBQI.32R7 Magnet busbar/connection plate Contact resistance QBQI.32R7 Before disconnection (µΩ) After consolidation (µΩ) BB_d_A (Ni)2.10.5 BB_d_B (Ni)2.30.6 BB_d_C (Ni)1.91.1 BB_d_D (Ni)2.50.3 BB_m_A (Bare)1.30.2 BB_m_B (Bare)1.50.5 BB_m_C (Bare)0.60.5 BB_m_D (Bare)1.30.2

30. JPh Tock 30/34 SMACC Quadrupole diodes (4/5) Courtesy L Grand-Clement, F Savary  Quadrupole diodes : Bare busbars  3 cases so far in sectors 78 & 81 (SSS from start of production)  Contacts resistance of bare busbars are lower than Ni/Ag coated ones [“almost” acceptable] and are less degraded so far than Ni/Ag coated ones  Actions have to be defined (Diodes WG): Ranging from use as is to … …. Magnet busbars exchange requires to change the SSS !  Busbars / heatsink contacts are electrically measured but not visually inspected systematically  Inventory of diodes stacks ready for installation is limited

31. JPh Tock 31/34 SMACC Dipole diodes  No outlier in 67 and 81  In 56, 3 dipole diodes (MDB) have been extracted and will be replaced in the coming days  In 78: 4 outlier leads (3 diodes)  Too early too conclude; it has to be analysed within the diodes WG (MPE-MSC) Courtesy M Bednarek & ElQA team Locatio n MTF_IDDiode leadContact resistance [Ohm] A15L8HCLBARB000-IN003058Anode208 µ A15L8HCLBARB000-IN003058Cathode89.8 µ A18L8HCLBBRD000-IN003012Anode18.9 μ A21R7HCLBBRA000-IN003014Cathode16.6 µ

32. JPh Tock 32/34 SMACC Summary on progress Main 13 kA Splices: Delay reduces  Unavailabilty of components for QDiodes consolidation Special Interventions:  Delay stable DFBA: See next presentation SMACC:  Slightly more than 2 weeks of delay Delays are sligthly reducing Very slightly more than nominal rate achieved these last 17 weeks !

33. JPh Tock 33/34  Sector 56 :  Final leak test and surface work on DFBAK SHM  Investigation on dipole diodes  Sector 67 : Pressure test successfull  Purge, ElQA, Flushing (CRG/MPE): Not formally SMACC project  Sector 78 (Not priority)  Work on NC  Work on DFBAO at the surface  Sector 81 (Priority)  Complete the M leak tests of non problematic Ics  Progress on IC closure  Sector 12  Progress on M lines rewelding  Start M leak test  Sector 23  Progress on the installation of electrical insulation  Work on overheated splices  Complete preparation for Q diodes consolidation  Sector 34  Complete splices unsoldering  Installation of shunts  Sector 45  Start desoldering and resoldering of splices SMACC Main activities for the next 2 weeks

34. JPh Tock 34/34 Conclusions  Delays are starting to reduce  Mind the last X % (S78 is at 91%) effect…  DFBA consolidation (see next presentation)  ?: Source of leaks in 78/81  ? : Actions to undertake for bare busbar in Q diodes (Diodes WG) Issues:  Components for consolidation of quadrupole diodes  Other diodes issues (Diodes WG-MPE/MSC)  Repair of NCs in parallel with production work (March in 67)