1. Via Filling Machine DP-HF Model V1.0 Circuit Automation, Inc. Phone 1.714.763.7762 © CAI April 27, 2008

2. Why via filling? Allows the size of PCB to shrink Creates more space on the surface Allows via-in-pad technology Built up multilayer's with stacked vias

3. Commercially Available Materials Peters PP 2794 PP 2795 Sanei Kaguku (PHP-900 series) Taiyo THP-100DX1 VF DuPont CB100 Preferred Paste thickness is in the 450 centipoises range.

4. DP-HF Features No Viton Seals Single Chamber filling Self Aligning Print head Vacuum system for blind vias Unique application head reduces waste Waste collection system Fill entire panel

5. 24” X 30” 610 X762mm Max Size Auto Loader Touch Screen Vacuum Chamber

6. Filled Via Holes

7. DP-HF Process Appropriate size Fill Head is installed. Panel is loaded into clamp Panel is transported into machine Start and Stop Fill positions are chosen for first panel or stored recipe is selected. Filling parameters are chosen. Panel is filled. Panel is transported to load section. Panel is removed

9. New Ink Pump

10. New Direct Inject Head

11. Head for 18’ (454mm) Panel Seal Adjusters Adjustment Feedback 17.6 filling area 447mm)

12. Non Viton fill head

13. Micro-Adjust Fill Head

14. Panel Load/Unload Door

15. Heavy Duty Strong Clamp

16. Waste Collection System

17. New Whisper Drive System 4 lead screw Belt driven, extra smooth transfer fill rate

18. Large Capacity Vacuum Pump 7.4 hp 177cfm pump

19. Manual Control Screen

20. MMI Screens

21. High Performance 2 nd Generation Contact Circuit Automation 5292 System Drive Huntington Beach, CA 92649 1.714.763.4180 ph 1.714.763.4181 fax www.circuitautomation.com