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3. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. 研究需求之基礎建設 研究成果融入教育 教育需求之基礎建設 尖端研究 基礎建設教育 國內所需 （ 1 ） 針對國內所需開授相關課程 （ 2 ） 人才培育 電子構裝力學 清華大學動機系電子構裝力學（碩博士班）修課人數 85 年： 40 餘人 86 年： 40 餘人 87 年： 約 70 人， 修課系所含動機、材料、化工與業界 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

4. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. 電子構裝力學教學搭配事項 自有之有限元軟體 ─ for Thermal Management and Thermal Stress/Strain Analysis 清華大學動機系電子構裝網站 （ http://140.114.57.4/ep_cae_www.html ） 電子構裝材料庫 錫球回焊成型預估軟體 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

5. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. Reliability Modeling vs. Reliability Testing 1. Reliability Testing ( 一般的流程 ) Design Build Large Quantity of Prototypes Accelerated Life Testing Design Simulation and Process Modeling Build Small Quantity of Prototypes Model Validation Mass Production 2. Reliability Modeling ( 一個成熟 R&D 團隊的流程，目前世界大廠研發流程 ) Build Test Vehicle Accelerated Life Testing 3. Reliability Modeling ( 最佳目標流程 ) Design Simulation and Process Modeling Model Validation Mass Production Build Test Vehicle Mass Production Labor Intensive Long Cycle Time (e.g. a typical cellular phone requires 4-7 iterations, 4-8 weeks per iteration) Lack of Physical Insight Cycle Time Reduction ( 節省約 2 倍時程 ) Computation Intensive Cycle Time Reduction ( 節省約 10 倍時程 ) Computation Intensive Physical Insight Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

6. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. Development of Next Generation Package System Chip Scale Package, Wafer Level Packaging and Flip Chip will be the Better Solution for The Next Generation Packaging System Research on Chip Scale and Wafer Level Packaging are more Suitable for Mechanical Engineering Key Research Issues Required for Flex CSP and Wafer Level Packaging Manufacturing Infrastructure IC Factory (XXXX 、 XX ） Packaging House （ XXXX 、 XX ） Flex Circuit （ XXXX 、 XX ） Surface Mount Technology （ XX ） 其他（ XX ） Research Infrastructure Solid Mechanics -- Fracture, Visco/Plastic, Thin Film Mechanics, Statistic Mechanics, Liquid Formation, etc. Material Science -- Material Characterization, New Materials Manufacturing and Automation Heat Transfer MEMS Etc. Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

7. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. 美國在電子工業的世界競爭力 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

8. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. National Tsing Hua University Electronic Packaging/CAE Labs. 美國各大學與協會電子構裝研究分工 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室