1. PACS IBDR 27/28 Feb 2002 PACS CRE1 PACS CRE development Ybe Creten, Patrick Merken, Jan Putzeys, Vic Fonderie, Chris Van Hoof IMEC

2. PACS IBDR 27/28 Feb 2002 PACS CRE2 Overview CRE and FEE design and design status CRE/FEE Schedule and milestones CRE and FEE Problems and possible solutions PA/QA: AIV plan and activities PA/QA: Key Inspection Points Conclusions

3. PACS IBDR 27/28 Feb 2002 PACS CRE3 CRE design and design status At IIDR: –CRE input stage in spec (in terms of gain/debiasing, noise and power) –smallest C int not functional but solution identified –linearity of output stage out of spec but solution identified on separate buffer QM CRE design iteration –CRE122000 linearity of output stage –CRE032001 smallest Cint –CRE102001 increased dynamic range

4. PACS IBDR 27/28 Feb 2002 PACS CRE4 CRE design and design status (ctd) Status of CRE122000/CRE032001 –meet key CRE specifications: gain/debiasing, noise, power consumption linearity of output buffer –do not meet dynamic range (<2V, marginally acceptable) starting point of integration ramp smallest C int linearity (“integrates”) –results of IMEC confirmed by CSL

5. PACS IBDR 27/28 Feb 2002 PACS CRE5 CRE design and design status (ctd) Status of CRE102001: –in addition meets dynamic range requirement –shows smallest C int approaching linearity spec (absolute value tbc) CRE032001 CRE102001

6. PACS IBDR 27/28 Feb 2002 PACS CRE6 CRE Substrate design and design status QM_1 without shortcircuit resistors (baseline design) QM_2 model (featuring additional resistors) –Two production runs with BCB (adhesion deficient) without BCB (_NB) to deliver sufficient assemblies QM_3 model made (to accommodate interface changes) –Available (no BCB version)

7. PACS IBDR 27/28 Feb 2002 PACS CRE7 Harness Substrate design and design status Harness QM_1 (baseline design) Harness QM_2 model (and QM_2NB without BCB) Harness QM_3 model in preparation = FM model additional reference lines and reduced (3) temperature sensor connections ; FM harness substrates scheduled for April 2002

8. PACS IBDR 27/28 Feb 2002 PACS CRE8 FEE status Multiple FEE assemblies made –QM_1 FEE delivered 6 July 2001 8 CRE082000 on QM_1 substrate delivered –QM_2 FEE failed 6 CRE032001 on QM_2 substrate shorted during bonding –QM_2 FEE recovery 3 CRE032001 on QM_2 substrate tested and delivered to MPE in November 2001 3 CRE032001 on QM_2_NB substrate in stock (different R_mirror) 13 CRE032001 on QM_2_NB assembled, tested and delivered to CSL (December 2001) –QM_3 FEE 25 CRE102001 on QM_3 substrate (29 in process) plan: phased assembly/test/delivery until Jan. 2002 29 assembled in February 2002 Presently in test Full delivery mid March 2002

9. PACS IBDR 27/28 Feb 2002 PACS CRE9 Schedule and Milestones Delayed start date TBC M1 met M2 met M3 met 12/2001 M4 moves to 03/2002 M5 moves to 04/2003

10. PACS IBDR 27/28 Feb 2002 PACS CRE10 Schedule: Implications of FM delivery date 11/04/036/02/03 29/10/02 11/07/02 CRE FM design 1 month CRE pretest 2 months FEE assembly/test today Counting back from FM delivery date Answers needed to several questions ! - absolute value C int and background - I out and C output adapation/redesign - latch-up tests on 12 modules - QM test results 06/01/03 FM tapeout 2 months CRE production

11. PACS IBDR 27/28 Feb 2002 PACS CRE11 (Possible+Encountered) Problems and possible solutions

12. PACS IBDR 27/28 Feb 2002 PACS CRE12 PA/QA: AIV and Test plan A general overview of the manufacturing of the FEE and Harness substrates: document PACS-IM-PL-001. Incoming inspection of parts and materials which are used during the manufacturing/assembly of the FEE and Harness substrates: document PACS-IM-PL-002. The assembly of the FEE substrates: document PACS-IM-PL-004 (draft). Verification of the performance of the FEE: document PACS-IM-PR-001. Critical items list: input provided FMECA: input provided

13. PACS IBDR 27/28 Feb 2002 PACS CRE13 PA/QA: AIV and Key Inspection Points FEE: each FEE is tested at room temperature and at 4 Kelvin. This test will indicate any error in bonding, resistor value, electrical connectivity, etc. Harness substrate: Each harness substrate will be visually inspected before packaging (‘packing’).

14. PACS IBDR 27/28 Feb 2002 PACS CRE14 Conclusions FEE deliveries –3 FEE on QM_2 delivered for detector tests –13 FEE on QM_2NB delivered for module tests –25 FEE on QM_3 delivery pending (assembled and partially tested/accepted) ‘Forced’ delay in start of FEE FM design. No ‘idle time’ due to this delay: –design/test: of QM FEE in sufficient detail for correction/change of C int –assembly/inspection: destructive bond-strength testing on spare FEE modules ECP for modified CRE substrate and harness substrate –verification: cryogenic radiation setup and testing AIV and test plans available