1. PACS IBDR 27/28 02 02 BOLC/BOLA1 BOLC / BOLA SAp/DAPNIA/DSM/CEA C. CARA WE Design Team: A. BOUERE - N. DEVIN - G. DHENAIN - E. DOUMAYROU M. SEYRANIAN - D. SCHMITT - T. TOURRETTE QA/PA: N. COLOMBEL - L. DUMAYE - F. LOUBERE - V. MAUGUEN AIV: C. BONNIN - … Test Equipments: F. DALY - P. DE ANTONI - M. DONATI - E. POINDRON

2. PACS IBDR 27/28 02 02 BOLC/BOLA2 BOLC/BOLA Design (1) BOLC design –Electrical 4 board types: –BAB (Bolometer Analog Board) - 5 x 32 analog channels –BIAS (Bolometer Bias & Clock translator) - x 3 –DAQ_IF (Data Acquisition & transfer to DMC) - 1 M + 1 R –BOLC_BP (passive BackPlane) - x1 1 independent module: –PSU (Power Supply) –Mechanical Electronics boards are mounted on stiffeners Modules (electronics boards+stiffeners) - x10 - are plugged and locked into an enclosure which also supports the backplane PSU BOLC box bottom (mechanical & thermal IF specified)

3. PACS IBDR 27/28 02 02 BOLC/BOLA3 BOLC/BOLA Design (2) Secondary power Connectors BOLC main box PSU Top cover Connectors to/from FPU (x18) Connectors to/from DMC (x4) Primary Power + bonding stub

4. PACS IBDR 27/28 02 02 BOLC/BOLA4 BOLC/BOLA Design (3) BOLA design –Electrical 2 board types: –B_BOLA (Diff Amp.*+Filter for Blue Bolometer): x4 –R_BOLA (Diff Amp.*+Filter for Blue Bolometer): x2 * Diff Amp. Uses JFET pairs (x160) –Mechanical Electronics Boards are mounted on individual stiffeners Modules (Board+stiffeners) are stacked Top cover & base plate (with feet) on each side of the « stack »

5. PACS IBDR 27/28 02 02 BOLC/BOLA5 BOLC/BOLA Design (3) “BLUE” Modules (x4) “RED” Modules (x2) Top cover Base plate with feet

6. PACS IBDR 27/28 02 02 BOLC/BOLA6 BOLC/BOLA Status (1) Status: –H/W Readout: –8 channel prototype (BAB) functionally tested - Awaiting for performance tests on real bolometers –BIAS board designed (waiting for spec. Validation) –BIAS FPGA is ready –SimBOLC BIAS fabrication started (avail. 4/03) –BOLA modelling in progress –New grounding scheme under preparation * Control: –DAQ_IF FPGA VHDL ready - –SIMBOLC DAQ_IF under fabrication (avail. 04/03) –300mK temperature channel design is validated (jan. 02) –« >1K », Heater control design tests in progress (  end of march) Mechanical –Overall Design (Stiffener+box) are ready –Detailed Design is started (13/02) * (elec.+meca. grounds inside BOLC)

7. PACS IBDR 27/28 02 02 BOLC/BOLA7 BOLC/BOLA Status (2) Status …: –Test Equipments LTU –Preliminary specification available –Full specification in progress –Software specification is started FPU simulator –Specification available –Electronics Boards in fabrication –Software implementation in progress BOLG (BOLA test cryostat) –“Pulse tube” cooler available –Cryostat specified –Documentation BOLC/BOLA Specifications - SAp-PACS-CCa-0024 - 1.0 BOLC/BOLA ICD - SAp-PACS-CCa-0024-00 - 1.0 BOLC/DMC E ICD - SAp-PACS-CCa-0046-01 - 1.1 FPU simulation Specifications -SIG-PACS-PDA-0013-01 - 1.0 Instrument Description Document contribution: BOLC/BOLA units description

8. PACS IBDR 27/28 02 02 BOLC/BOLA8 Budgets BOLC –Outer envelope: 382,5 x 289 x 333,5 (L x D x H - mm) –Mass 18.25 kg (previous) 15.25 kg (updated) Allocation *: 14.5 kg –Power consumption Max. Average: 44.22 W Allocation: 35 W * Refer to IID-B 2.0 BOLA –Outer envelope 162 x 119 x 121 (L x D x H - mm) –Mass 1.7 kg Allocation: 2.6 kg –Power dissipation Average: 0.2 W Allocation: 0.2 W

9. PACS IBDR 27/28 02 02 BOLC/BOLA9 Models Definition From “Development Plan” document: –BreadBoards: to validate electronics designs (in particular: detector readout & drive electronics) * –STMs: to validate (vibration & thermal) BOLC, BOLA, PSU mechanical structure * –Simulator: to validate IF with DMC - BOLC only * –EMs: to perform electrical compatibility tests PSU-BOLC - PSU only * –QMs: QM1: to validate design & electrical IF with PhFPU QM2: full qualification model * –FM: full model … –FS: spare boards only * : not for delivery

10. PACS IBDR 27/28 02 02 BOLC/BOLA10 Models Summary SystemsS/S L1 S/S L2 S/S L3 STMEMQM1QM2FMFS BOLCReadoutBAB-R1-1111 BAB-B4-2442 BIAS3-2331 ControlDAQ_IF2-1221 BOLC_BP1-1111 Box1-111- BOLADIFFAMP 6-6662 BIAS_Filter Box6-6662 PSU11 Power bench STM EM 1 HarnessBOLC/DMC---22 PSU/BOLC---22

11. PACS IBDR 27/28 02 02 BOLC/BOLA11 PA / QA Plan & Activities Documentation available: –Standard Product Assurance Plan: SAp-GERES-FLo-436-00 issue 1.0 of 09/11/2000 –BOLC/BOLA DCL: SAp-PACS-VM-0058-01 issue 10 of 01/2002 –BOLC/BOLA DML: SAp-PACS-NC-0071-02 issue 0 of 01/2002 –BOLC/BOLA DPL: SAp-PACS-NC-0072-02 issue 0 of 01/2002 Documentation in preparation: – BOLC/BOLA FMECA Draft available Final document in correction/amendment phase: –Available by end of February (ref: SAp-FLo-0082-02)

12. PACS IBDR 27/28 02 02 BOLC/BOLA12 AIV Plan & Activities AIV activities diagram is available for –QM1 –QM2 –FM Test configurations document is available in draft form Test equipments required are identified & defined –Factory Support Equipment (FSE) for post-fabrication testing (1 per electronics board) –Local Test Unit (LTU) for DMC interface simulation –FPU simulator for PhFPU simulation

13. PACS IBDR 27/28 02 02 BOLC/BOLA13 Problem Areas (1) BOLA thermal interface with S/C –Problem: minimum operating temperature (120K) not accepted by ESA. –Solution(s): Evaluate performance (mainly noise) of JFET at lower temperature (≥ 50 K) Built up of BOLA thermal model (JFET self heating evaluation) BOLC mechanical interface with S/C –Problem: Need for formal agreement to proceed with mechanical manufacturing –Solution(s): depends on boxes configuration on panel H/W is frozen: mechanical design update is difficult Connector back-shell update

14. PACS IBDR 27/28 02 02 BOLC/BOLA14 Problem Areas (2) BOLC specification confirmation: –Problem: still waiting for detector test results –Solution(s): start designing boards not dependent of bolometer characteristics (DAQ_IF & BackPlane) Component cost –Problem: current estimation exceed initial estimation –Solution(s): …

15. PACS IBDR 27/28 02 02 BOLC/BOLA15 Schedule / Milestones