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Head of Mobile Communication Technology Research Lab.

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Presentation on theme: "Head of Mobile Communication Technology Research Lab."— Presentation transcript:

1 Head of Mobile Communication Technology Research Lab.
휴대인터넷 단말 기술 및 개발 현황 Jin-Sung Choi Ph.D Head of Mobile Communication Technology Research Lab.

2 Contents 1. WiBro 단말 개요 2. WiBro 단말 Requirement
3. WiBro 단말 Architecture 4. WiBro 단말 개발 현황

3 1. WiBro 단말 개요 1) WiBro 서비스와 단말 types 2) WiBro 서비스 및 단말기 발전 전망

4 WiBro 단말 개요 WiBro 서비스와 단말 Types
대략 4개의 SVC Category로 구분되며 Focus하는 서비스 내용에 따라 Concept 차별화 및 다양한 형태의 단말기가 출현할 것으로 예상됨 SVC Category 단말 형태 Web Browsing File Downloading 원격 교육 / 의료 Information 대용량 VOD, MOD, AOD 실시간 Streaming 방송 3D Network Game Entertainment Instant Messaging 서비스 Multimedia Messaging 서비스 화상 채팅 및 게시판 Communication M-Commerce 텔레매틱스 물류 등 전문 서비스 Commerce / Biz

5 WiBro 단말 개요 WiBro 서비스 및 단말기 발전 전망 `06년 초 `07년 ~ `09년 ~ 도입기 성장기 성숙기 단말기
Notebook + WiBro(PCMCIA Type) CDMA / WiBro DBDM Handset Modem 1 Chip 화 PDA + WiBro Module Smart Phone 사업자 제공 서비스 - Web Browsing을 통한 자료검색 및 D/L - - 채팅 및 메신저 SVC - VOD/MOD - 실시간 방송 - MMS - 위치기반 Push SVC - Network Game - 화상 Chatting - Mobile to Mobile SVC - Upgrade VOD/MOD - VoIP - 화상통화 - 위치기반 확장 SVC - 텔레매틱스 - 그룹웨어 연계 - Commerce/Payment 유선인터넷의 무선확장 EV-DO Data SVC의 WiBro망 이용 저렴/고품질 Multimedia SVC 제공 Value added 차별화 SVC

6 WiBro 단말 개요 WiBro 표준화 현황 TTA Mobile WiMAX (802.16e) Phase I 개정 2004.6
정통부 WiBro 기술 권고안 발표 (’04. 7월) 현재 TTA 휴대인터넷 표준은 사실상 IEEE802.16의 Subset 임 TTA Mobile WiMAX (802.16e) Session 34 (HPi) TTA (HPi) 802.16d/e 구 분 O-PUSC(M), O-FUSC(M), AMC(M) PUSC(M), FUSC(M) Permutation BW BW x 8/7 Sampling Frequency 2 Symbols 1 Symbol Preamble 2005.2Q PUSC 지원 Phase II 2004.4Q ~ Q PHY Harmonization MAC Harmonization 최대전송속도(50Mbps) AAS, MIMO 적용 OFDMA/TDD 1024FFT, BW : 10MHz Issue 802.16e/D6 Sponsor Ballot IEEE e Published

7 2. WiBro 단말 Requirement

8 WiBro 단말 Requirement 기본 Requirement 단말 type 별 Requirement
기존 유선 수준의 다양한 서비스를 제공하기 위해 기존의 이동통신단말에 비해 향상된 사양 필요 High Quality Display 고성능 CPU 대용량 Memory 단말 type 별 Requirement WiBro 서비스에 따라 단말의 Requirement 세분화 Information, Communication SVC Wide LCD, QWERTY KBD, Camera 등 Entertainment SVC Wide LCD, Game Pad, T-DMB 기능 등 Other Requirement 무게, 확장 Memory, 외부 interface (CF, IrDA, Bluetooth, USB) 등

9 3. WiBro 단말 Architecture 1) WiBro DBDM 단말 Architecture
2) WiBro PDA 단말 Architecture 3) WiBro Laptop (PCMCIA) Architecture

10 Key pad, Power management, etc.
WiBro 단말 기술 WiBro DBDM 단말 Architecture SDRAM 16Mx32bit EBI2 EBI2 NAND FLASH MIDI RF Interface RF Module GPIO (WiBro) Glue Logic GPIO (UIM) MAC/BB RF MSM6550 GPIO EXPENSION Module GPIO (I2C) GPIO (MMC) WiBRO Module We can also choice a CF or PCI Interface. But in this case, we have to make a Glue Logic for digital signal conversion. RS232-C Transceiver GPIO (UART1) GPIO (Camera) USB Transceiver GPIO (USB) 3M Pixel GPIO (IrDA) Key pad, Power management, etc. GPIO (Others) IrDA SIR

11 Key Pad, Qwerty keyboard
WiBro 단말 기술 WiBro PDA 단말 Architecture Key Pad, Qwerty keyboard GPIO DFI NAND Flash 128MB 3M Pixel GPIO (camera) NOR Flash 128MB Intel 806MHz ( Discrete ) EMPI SDRAM 64MB IrDA SIR GPIO (UART) T-DMB Module / WLAN b/g GPIO SD Socket GPIO (SD/MMC#2) (TBD) WiBRO Module 3.5” VGA TFT LCD GPIO (LCD Controller) GPIO (SD/MMC) MAC/BB RF RS232-C Transceiver GPIO (FFUART) USB Transceiver GPIO (USB) Audio Codec Speaker GPIO (AC97) Battery Module GPIO (USB) Mic Headset

12 Memory Technology Driver
WiBro 단말 기술 WiBro Laptop (PCMCIA) Architecture Application Software Operating System BIOS Memory Card Device Driver Flash File System Card Services 68 PIN Socket Memory Technology Driver WiBRO PCMCIA Card Connector to host PCMCIA Driver 68 PIN Connector Socket Services MAC/BB RF Laptop

13 4. WiBro 단말 Technical Issue
1) Chipset Size and Power consumption 2) Device Driver Porting 3) Interface between CDMA and WiBro chipset

14 WiBro 단말 Technical Issue
Chipset Size and Power consumption SoC Type : Feb `06 Reasonable Size : 16 x 16 mm2 Power Consumption (TBD) : about Max 700 mw All in one solution (RF + BB) FPGA Type (Two Chip) : May `05 Reasonable Size (Area) : 25 x 25 mm(RF + BB) But Power Consumption : We won’t care of it at this chips 16mm SoC RF BB Filter TCXO Amp S/W diplexer This layout is just an example. 25mm

15 WiBro 단말 Technical Issue
How will WiBro Module “Device Driver Porting” to “Rex OS ” in the MSM Chipset (CDMA/WiBro DBDM) WiBro Module won’t depend on CDMA S/W Module REX OS : Qualcomm’s CDMA S/W module But can provide API and device driver for WiBro Module Applications REX WAP, WIPI, HTTP,FTP DHCP Client Frame Processing Session UI interface, sockets, … WiBro Extension Lower MAC Transport TCP/UDP Device Driver Interface Network IP EAP-MD5, -TLS, -TTLS, -LEAP Buffer Mgmt Tx/Rx Data Link RLP,PPP CS Upper MAC WiBro PHY Serial I/O API, … WiBro Module Driver RAM Physical Host IO Host IO SoC WiBro Module Qualcomm Software

16 WiBro 단말 Technical Issue
Interface between “CDMA MSM Chipset ” and “WiBro BaseBand chipset” (CDMA/WiBro DBDM) i) The First Choice Memory BUS Interface (DPRAM) ii) The Second Choice SDIO Interface  flexible host bus interface (can be converted to SDIO using Glue Logic) TBD 2.5 ~ 2.7 V MSM 65xx TBD 3.3 V Wibro Chip Rex_OS TBD OS ? 1.375V  5% Analog voltage Analog voltage MSM65XX Chipset doesn’t support “Wait signal” Digital Core voltage Digital Core voltage 1.8 V  5% 2.7 V  5% Peripheral Voltage 1.8 V  5% 2.7 V  5% Peripheral Voltage MMC Interface SD/SDIO 1bit and 4 bit interface I/F In case of SDIO Interface - 1bit transfer mode (SD/SDIO) - 4bit transfer mode (SD/SDIO)

17 WiBro 단말 Technical Issue
Memory BUS Interface Interface between MSM and Wibro BB ChipSet EBI2 - External Bus Interface 2 Core : 1.65V~1.95V Typ:1.8V I/O : 2.6V~2.8V Typ:2.7V NAND (Flash) MAC/BB PHY/BB RF ADC AFC DAC 2.3G~2.4G Wibro Memory (?) EBI2 MSM 8bit or 16bit interface EBI1 SDRAM I hope to use the same I/O voltage in your Wibro chipset We can use Dual Port RAM at this Interface

18 WiBro 단말 Technical Issue
CF, PCI, SDIO interface We can also choice a CF or PCI Interface. But in this case, we have to make a Glue Logic for digital signal conversion. NAND 2.3G~2.4G EBI2 MSM ADC CF GLUE LOGIC PHY/BB MAC/BB PCI AFC RF SD I/F DAC SDIO I/F EBI1 MEMORY SDRAM MSM chipset internally has a SDIO Interface.(MSM6500 -> 1bit, MSM6550 -> 4 bit) therefore it will be one of the most simple connection between MSM and Wibro BB chipset.

19 5. WiBro 단말 개발 현황 1) Intel WiMAX Chip Roadmap 2) WiBro 단말 개발 Schedule

20 802.16e Express Card Reference Design
WiBro 단말 기술 Intel WiMAX Chip Roadmap: Nov 2004 802.16e Infrastructure Silicon & Reference Platform (2007) Reference Platform(s) Silicon Q2/Q3’05 WiMAX Modem Reference Platform(s) 1H’07 802.16e Express Card Reference Design 802.16e Handset Silicon & Reference Platform (2008) Q3’05* PRQ : Production Qualification, the milestone used to recognize an Intel product has moved to Production. PHY & MAC API Q1’05 2H’06 MAC/PHY solution 802.16e MAC/PHY solution Silicon/Software 2004 2005 2006 2007 Development Planning Exploration

21 WiBro 단말 개발 현황 LGE PSS 개발 Schedule
현재 PDA, 핸드셋 단말 위주로 Chipset Solution 발굴 및 개발 진행 중이며 DBDM(CDMA+WiBro) Type으로 `06년 3Q에 시장 출시 예정 (*PSS : Portable Subscriber Station) 2Q 1Q ’06 4Q 3Q ’05 ‘04 기술 확보 모듈 확보 CDMA/WiBro 상용 폰 개발 WiBro Test Module (FPGA Type) Performance Test & Parameter Optimization WiBro Requirement Spec WiBro Test Module 개발 PhaseⅠ: - Module Base 선행 개발(’05.3Q) (CDMA 폰 Interface 활용 정합) - 성능시험 최적화(’05.4Q) Field Test Phase Ⅱ: 상용DBDM단말 개발 PDA Type(’06.2Q) DBDM Type(’06.3Q) WiBro Network상에서의 Business기회 점검 WiBro 핵심 SVC 발굴 WiBro 서비스 상에서 최적 UI 및 단말기 Form Factor, Feature개발

22 Great Company Great People 감사합니다


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