1. Electrical Quality Assurance Markus Friedl HEPHY Site Qualification, 6 August 2015

2. 6 August 2015M.Friedl: Electrical Quality Assurance2 APVDAQ EQA Tests Ladder Tests Summary

3. 6 August 2015M.Friedl: Electrical Quality Assurance3 APVDAQ EQA Tests Ladder Tests Summary

4. HEPHY Clean Room Installation 6 August 2015M.Friedl: Electrical Quality Assurance4 Linear LV power supplies VME Crate 2 x Keithley 2410 HV power supplies (software controlled) PC (under the table) Metal box with repeater boards Device under test (here: L5.904 wrapped in cloth) Barcode scanner

5. New Since January (Site Qualification 1)  Metal box with repeaters mounted under shelf  Was on table during test of L3 hybrids (cable pigtail)  DAC boards installed for both p and n sides  Software updates  IntCal vs. Vsep scan  APVDAQ: automatic recognition of strange channels  IV Scan (new in end of July, thus no class B data yet)  Generates CSV file for database  Allows to go to standard bias (100V) after scan (0..200V) 6 August 2015M.Friedl: Electrical Quality Assurance5

6. APVDAQ Screenshots  IntCal 6 August 2015M.Friedl: Electrical Quality Assurance6  IntCal vs. Vsep List of strange channels (also stored in log file)  Download: http://www.hephy.at/project/belle/belle2svd/apvdaqhttp://www.hephy.at/project/belle/belle2svd/apvdaq

7. IV Scan Screenshot 6 August 2015M.Friedl: Electrical Quality Assurance7

8. 6 August 2015M.Friedl: Electrical Quality Assurance8 APVDAQ EQA Tests Ladder Tests Summary

9. EQA During Ladder Assembly  SBW and SFW  APVDAQ test upon reception  APVDAQ test once glued onto ribs  Origami –z and ce flexes  APVDAQ test at reception  Origami sub-assembly (OSx.nnn)  No more intermediate tests (not very conclusive)  APVDAQ test for –z and ce once completed  Completed ladder  APVDAQ test for each sensor  Full FADC test with source 6 August 2015M.Friedl: Electrical Quality Assurance9

10. What Is Tested? (1/2)  APVDAQ Test  In the clean room (1F)  One sensor at a time  Always:  ADC delay scan  FIR calculation  10k pedestal run  IntCal run  With sensor (in addition):  IV scan  IntCal vs. Vsep scan 6 August 2015M.Friedl: Electrical Quality Assurance10

11. What Is Tested? (2/2)  FADC Test  In the lab (4F)  All sensors at once  ADC delay scan  FIR calculation  10k pedestal run  IntCal run  IV scan  Source scan  Work in progress… 6 August 2015M.Friedl: Electrical Quality Assurance11

12. Main Ladder Testing Ingredients  Module test box  Ladder on x-y stage  90 Sr source (1mCi) mounted inside box  Already used for several beam tests (CERN, DESY)  Flushing with dry air and CO 2 cooling possible, but not intended for ladder tests  Readout system  Will use FADC V1 components for a dedicated setup  LV & HV power (replica of APVDAQ)  Linear lab power supplies for LV  2 x Keithley 2400 for HV 6 August 2015M.Friedl: Electrical Quality Assurance12

13. Test Box with L5.903 (CERN, June 2015) 6 August 2015M.Friedl: Electrical Quality Assurance13

14. Ladder Testing: Outlook  All hardware exists  To do: DAQ firmware (Richard Thalmeier) & software (master student Lukas Bulla, with help by Hao Yin)  Back-port recent firmware to V1 hardware  Program motion path for x-y stage  Adapt DAQ software for V1 hardware/firmware  Integrate all functions and sequence  Beta version ready until early September  To do: Install & adapt Giulia’s analysis software (project student Daniel Lukic in September) 6 August 2015M.Friedl: Electrical Quality Assurance14

15. Origami Sub-Assembly Testing: Outlook  Will do a source scan with APVDAQ in late August  Qualification of new Origami & PA0 (batch 0)  To be performed on OSA to minimize potential loss of valuable sensors  Source/scintillator holder (Florian + machine shop)  Operated in dark box  Can manually slide along OSA in z direction 6 August 2015M.Friedl: Electrical Quality Assurance15

16. 6 August 2015M.Friedl: Electrical Quality Assurance16 APVDAQ EQA Tests Ladder Tests Summary

17. Hit Profiles (1/2)  Slides shown on 16 April 2015  FADC readout (full class B ladder)  4 measurements with source pointing ~at center of each sensor  Profile is much wider than scintillator  multiple scattering  Shadow of ribs clearly visible (blurred outer edges)  APV25 chips not visible 6 August 2015M.Friedl: Electrical Quality Assurance17

18. Hit Profiles (2/2)  Features of Origami flex visible:  Gap between green copper buses for power  Gap between green and red parts (upper edge)  Both are more pronounced for –z and bw because 2 Origamis are stacked there 6 August 2015M.Friedl: Electrical Quality Assurance18

19. More Data  All plots (hit profile, noise, cluster width, signal-to-noise, etc.) can be found in the Twiki: https://belle2.cc.kek.jp/~twiki/bin/view/Detector/SVD/L5LadderTests https://belle2.cc.kek.jp/~twiki/bin/view/Detector/SVD/L5LadderTests  Noise patterns all look as expected  Most important conclusion: operating the full ladder simultaneously works as good as individual parts 6 August 2015M.Friedl: Electrical Quality Assurance19

20. Comparison APVDAQ – FADC  Different readout chains (factor ~1.5 in gain)  Figure of merit: IntCal Amplitude / noise (a kind of SNR)  Similar numbers, FADC sometimes slightly better  All data available in Twiki (link on previous page) 6 August 2015M.Friedl: Electrical Quality Assurance20

21. Pinhole Comparison APVDAQ – Sensor  BW: No pinholes (consistent for APVDAQ & sensor)  -Z:  P-side pinholes: 19, 765, 766 (consistent)  N-side pinholes: none (consistent)  CE:  P-side pinholes: 67,69, 750 (consistent), 68 (sensor only)  N-side pinholes: 7,15,17, 277,284, 426  FW:  P-side pinholes: 430,440,442,466,470,518,616,626,632,670 (consistent); several more (APVDAQ only); several more (sensor only)  N-side pinholes: 199,296 (APVDAQ only); 312 (sensor only)  Sensor measurements inconsistent between Vienna and Trieste 6 August 2015M.Friedl: Electrical Quality Assurance21

22. 6 August 2015M.Friedl: Electrical Quality Assurance22 APVDAQ EQA Tests Ladder Tests Summary

23.  Electrical Quality Assurance during series production  APVDAQ well established  DAC installed for both p and n sides  IV scan added recently  Will do source scan verification on OSA (batch 0) in late August  FADC ladder testing: in progress  Full ladder scan with 90 Sr source  Will use dedicated V1 FADC hardware in electronics lab  Needs some more software work for control, DAQ and analysis (manpower is assigned) 6 August 2015M.Friedl: Electrical Quality Assurance23

24. Further Reading  C.Irmler: EQA during Ladder Assembly  SVD QCG Group Meeting, 16 April 2015  http://kds.kek.jp/getFile.py/access?contribId=0&resId=0&mater ialId=slides&confId=18441 http://kds.kek.jp/getFile.py/access?contribId=0&resId=0&mater ialId=slides&confId=18441  M.Friedl: L5.903 [class B ladder] Measurements  SVD QCG Group Meeting, 16 April 2015  http://kds.kek.jp/getFile.py/access?contribId=1&resId=0&mater ialId=slides&confId=18441 http://kds.kek.jp/getFile.py/access?contribId=1&resId=0&mater ialId=slides&confId=18441 6 August 2015M.Friedl: Electrical Quality Assurance24

25. 6 August 2015M.Friedl: Electrical Quality Assurance25