1. ECE 477 Design Review Team 10  Spring 2008 Paste a photo of team members here, annotated with names of team members. Paul Ng Daniel Bixby David Collins Matt Ligocki

2. Outline Project overviewProject overview Project-specific success criteriaProject-specific success criteria Block diagramBlock diagram Component selection rationaleComponent selection rationale Packaging designPackaging design Schematic and theory of operationSchematic and theory of operation PCB layoutPCB layout Software design/development statusSoftware design/development status Project completion timelineProject completion timeline Questions / discussionQuestions / discussion

3. Project Overview Overall Objectives Create an Unmanned Aerial Vehicle (UAV) which is capable of the following:Create an Unmanned Aerial Vehicle (UAV) which is capable of the following: Autonomous flight Autonomous flight GPS navigation GPS navigation Ground photography Ground photography

4. Project Overview (cont) Planned implementation Multiplex Easy Glider RC planeMultiplex Easy Glider RC plane Manual takeoff, landingManual takeoff, landing Controlled by PCB at cruising altitudeControlled by PCB at cruising altitude PCB triggers digital camera upon reaching GPS waypointsPCB triggers digital camera upon reaching GPS waypoints

5. Project Overview (cont) PCB Plane Control - In Orientation - Thermopile tilt sensingOrientation - Thermopile tilt sensing Velocity, position – GPS ModuleVelocity, position – GPS Module Destination data – Pre-written SD CardDestination data – Pre-written SD CardOut Drives servos for ailerons, rudder, elevatorDrives servos for ailerons, rudder, elevator Drives motor ESCDrives motor ESC

6. Project-Specific Success Criteria An ability to fly an R/C plane autonomously once airborne, based on pre-programmed waypoints.An ability to fly an R/C plane autonomously once airborne, based on pre-programmed waypoints. An ability to decode and display GPS coordinates.An ability to decode and display GPS coordinates. An ability to control motor speed and control surface position.An ability to control motor speed and control surface position. An ability to capture still images.An ability to capture still images. An ability to read waypoints from a MicroSD removable storage device.An ability to read waypoints from a MicroSD removable storage device.

7. Block Diagram

8. Component Selection Rationale Microcontroller Chosen component: MC9S12A64Chosen component: MC9S12A64 –Full assortment of required interfaces –16 bit PWM –Dual SCI ports –Small 80 pin package and modest amount of memory –Familiarity with processor family and development environment Competing Alternative: HCS12E seriesCompeting Alternative: HCS12E series

9. Component Selection Rationale GPS Chosen component: ETek EB-85AChosen component: ETek EB-85A –2.6 m accuracy using DGPS and WAAS –5 Hz refresh rate –Built in antenna –Extremely light weight: 0.52 oz –Lower price: $100 vs $200 Competing Alternative: Garmin GPS-18Competing Alternative: Garmin GPS-18 ETek EB-85A Garmin GPS-18

10. Component Selection Rationale Airframe Chosen component: Multiplex Easy Glider ElectricChosen component: Multiplex Easy Glider Electric –Foam construction for durability and easy repair –Glider design for stable flight –Large 71 in wingspan –Included ailerons for flight stabilization Competing Alternatives: Multiplex Easy Star, Super Cub ElectricCompeting Alternatives: Multiplex Easy Star, Super Cub Electric Easy Glider ElectricEasy StarSuper Cub Electric

11. Packaging Design Plane is the packagePlane is the package PCB and camera must fit inside fuselage along with the standard components.PCB and camera must fit inside fuselage along with the standard components. Components must not exceed EasyGlider limit of 31 oz.Components must not exceed EasyGlider limit of 31 oz. Components must be balanced with the structure of the plane.Components must be balanced with the structure of the plane. Excessive mods can alter the aerodynamics of the plane.Excessive mods can alter the aerodynamics of the plane.

12. Packaging Design - Weight

13. Packaging Design - Space Critical Items PCB - will be mounted on edges of cockpit area, PCB component height requires some hollowing out of cockpit plugPCB - will be mounted on edges of cockpit area, PCB component height requires some hollowing out of cockpit plug Upgraded Motor – virtually same size as the stock motor, fits in original spot in plane noseUpgraded Motor – virtually same size as the stock motor, fits in original spot in plane nose Camera – most difficult, requires the most substantial foam cuttingCamera – most difficult, requires the most substantial foam cutting

14. Packaging Design - Space Outside Fuselage Aileron Servos (2)Aileron Servos (2) Thermopiles (4)Thermopiles (4) GPS ModuleGPS Module Inside Fuselage Rudder, Elevator ServosRudder, Elevator Servos Radio ReceiverRadio Receiver Drive Motor ESCDrive Motor ESC CameraCamera BatteryBattery Drive MotorDrive Motor GearboxGearbox

15. Packaging Design - Balance Nose-heavyNose-heavy Battery, GPS Module used for final balancing, lever- arm manipulationBattery, GPS Module used for final balancing, lever- arm manipulation

16. Schematic (Microcontroller)

17. Schematic (Clock Generator) Standard Pierce Oscillator. Follows Manufacturer's Specifications and Requirements for MCU.

18. Schematic (Servo Controls) SERVOS Manual Override

19. Schematic (GPS Connections) LEVEL TRANSLATORS GPS Module 2.8V Regulator

20. Schematic (Camera) Darlington Array Works by pulling low switches on HP Photosmart R707 camera.

21. Schematic (Power Supply) Buck Non- Synchronous Step Down Voltage Regulator Available in both 3.3V and 5V ranges. Up to 87% Efficiency.

22. Schematic (LCD Interface) Uses a MAX3227 Level translator to convert from CMOS to RS-232. Converts from 0-5V to -12 to +12V.

23. Schematic/Theory of Operation Level Translators to 3.3V

24. Schematic (Thermopile) Low Power Amplifiers Thermopiles

25. Schematic (Miscellaneous) Voltage Sensing Circuit Radio Receiver Voltage Sensing Circuit used to gauge battery life to estimate flight time remaining. 10V Zener used for voltage protection

26. PCB Layout Dimensions: 3.5”x2.5”Dimensions: 3.5”x2.5” High component densityHigh component density 0805 SMD resistors/capacitors0805 SMD resistors/capacitors 2 Power supplies: 3.3V, 5V2 Power supplies: 3.3V, 5V Up to 3A current draw per railUp to 3A current draw per rail Few sensitive signalsFew sensitive signals Nets routed by priorityNets routed by priority Status: 100% Placed, 94% RoutedStatus: 100% Placed, 94% Routed (Not including ground planes)

27. PCB Layout Top Copper

28. PCB Layout Bottom Copper

29. PCB Layout Microcontroller

30. Clock/Camera

31. Clock/Camera

32. Power Supply

33. PCB Layout Thermopile

34. Plane Control

35. PCB Layout SD Card/LCD/GPS

36. PCB Layout SD Card/LCD/GPS

37. Software Design SCI and IOC interrupts fill variables then set flags for GPS and radio interfacingSCI and IOC interrupts fill variables then set flags for GPS and radio interfacing Timer interrupt used to create time stampsTimer interrupt used to create time stamps MicroSD interface is polling basedMicroSD interface is polling based Overall operation in a main loopOverall operation in a main loop Each module is written in its own source and header C filesEach module is written in its own source and header C files

38. Software Development Status Completed Interfaces using 9S12C32:Completed Interfaces using 9S12C32: –Timer counter used for time stamping –MicroSD card read and write over SPI –Digital camera control using several GPIO pins –Radio receiver tracking with input capture –Servo motor control with 16 bit PWM Tasks to complete next:Tasks to complete next: –Write GPS interface for 9S12C32 –Port code to 9S12A64 custom dev board –Write stabilization and navigation software

39. Project Completion Timeline Week 2/24 – 3/1 3/2 – 3/8 3/9 – 3/15 3/16 – 3/22 3/23 – 3/29 3/30 – 4/5 4/6 – 4/12 4/13 – 4/19 4/20 – 4/26 4/27 – 5/3 891011121314151617 Finalize PCB Populate PCB Software Design Packaging Testing Documentation

40. Questions / Discussion