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Bruno Murari STMicroelectronics Universita’ di Pavia 24 Marzo, 2004 Microelettronica e MEMS Oggi.

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Presentation on theme: "Bruno Murari STMicroelectronics Universita’ di Pavia 24 Marzo, 2004 Microelettronica e MEMS Oggi."— Presentation transcript:

1 Bruno Murari STMicroelectronics Universita’ di Pavia 24 Marzo, 2004 Microelettronica e MEMS Oggi

2 Outline The Electronic System Building Blocks System Oriented and Smart Power Technologies MEMS: Inertial Sensors and Microactuators Microfluidics: Lab on Chip and Photonics Switches Packaging and Interconnections Conclusions

3 The Electronic System Building Blocks

4 Concentrated System in a Single Box

5 Typical Aggregation of Different Technologies for System Optimization

6 System Oriented and Smart Power Technologies

7 BCD History and Evolution

8 Engine Control Unit Architecture

9 Typical SoC for Intelligent Mirror in Modern Cars

10 Example of Intelligent Mirror in Modern Cars

11 Typical Power Management Chip for Mobile Phones

12 Example of Portable Sets that require Sophisticated Power Management Chips

13 N/P-LDMOS in H-bridge Optical Data Storage Disk Drive Integrated motor driver device with capability to control the spindle, tracking, focus and tray motors. This device operates on a single 3.3V supply and provides integrated power FETs for all engine motors. N/P-LDMOS in H-bridge N/P-LDMOS in H-bridge

14 N/P-LDMOS in H-bridge Logic CMOS Power Combo for Data Storage Hard Disk Drive

15 Head Driver for Printer Logic CMOS N/P-LDMOS

16 Efficiencies for Different Classes of Operation for Audio Output Amplifiers

17 System Structure of High Efficiency PA + + - - Front High Impedance Rear Buffer Control Logic Vin FVin R FP FM RM RP I_F I_R I_RP Final Amplifier FrontFinal Amplifier Rear

18 Example of 2x75 Watt High Efficiency PA Thick (6  m) Copper Metallization

19 DDX ® - Direct Digital Amplification

20 MEMS: Inertial Sensors and Microactuators

21 Silicon as Structural Material

22 MEMS MEMS: M icro E lectro M echanical S ystem – three dimensional device embedded in silicon – multifunction system consisting of sensors, actuators, electronics.

23 Different Type of Accelerometer

24 Rotational Accelerometer

25 Silicon Microstructures in Future HDD

26 Typical Assembly of an HDD Suspension with Microactuator

27 Microactuator Chip

28 Microactuator Concept

29 Microactuator without Cap Movie

30 Microactuator with Cap Movie

31 Atomic Resolution Storage from HP A tomic R esolution S torage (ARS) technology Uses focused electron beams and a phase change media to read and write data Micromachined movers provide high resolution access of media by fixed emitter tips Technology developed at HP Labs ARS products Perfect for mobile applications Small, high density storage Memory cards and embedded storage applications Cost effective … enabling appliances and applications Scientific American – January 2003

32 Millepede from IBM Scientific American – January 2003 High Doped Silicon Cantilever Heater

33 Millipede Movie (from IBM web Site)

34 Microfluidics: Lab on Chip and Photonics Switches

35 Ink Jet Cartridge

36 Lab on Chip

37 “Sample to Answer” Flow

38 Lab on Chip Movie

39 Bubble Switch for Optical Network ST/AGILENT Partnership

40 Photonic Switching Concept

41 ST/AGILENT Bubble Switch Movie

42 Packaging and Interconnections

43 High Voltage Interconnection

44 High Voltage Through Silicon Vias

45 Multichip and Stacked Dice

46 Conclusions The VLSI evolution has been and will a be major driving force, but does not cover the whole picture Interfacing the real world requires for different approaches, skills and education Analog electronics is the bridge between the laws of nature (physics) and computing (software): multidisciplinary by nature, impossible to be constrained in one scheme Lateral thinking is a key process for quantum leaps in innovation

47 Thank You


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