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Introduction SiC substrate Process Expitaxial graphene on Si – face Expitaxial graphene on C – face Summary Graphene synthesis on SiC.

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Presentation on theme: "Introduction SiC substrate Process Expitaxial graphene on Si – face Expitaxial graphene on C – face Summary Graphene synthesis on SiC."— Presentation transcript:

1 Introduction SiC substrate Process Expitaxial graphene on Si – face Expitaxial graphene on C – face Summary Graphene synthesis on SiC

2 Graphene synthesis methods Graphene Synthesis Top down Bottom Up Mechanical exfoliation Chemical exfoliation Chemical synthesis Pyrolysis Epitaxial Growth CVD Other methods

3 Epitaxial growth Single crystalline film on a single crystalline substrate. SiC substrate graphene Feasibility and scalability High temperature process, difficult graphene transfer from SiC to other sub, expensive substrate. Anneal Si

4 SiC substrate Hexagonal polytypism. (4H, 6H) 3 carbon – 1 Si ( bilayer ) – 1 carbon linking another layer Polar: Si – face (0001), C – face (000ī) A B C B

5 Surface cleaning ( H2 etching, furnace, Ar + H2, ~1 atm ) or CMP Surface oxide removing ( heating ~1000°C, UHV, Si flux )  SiO gas Graphene formation - UHV, high temp - Ar overpressure, more high temp Process

6 Si – face (0001) Unit vector: SiC 3.08A, graphene 2.46A Rotating 30°C formation to align First graphene layer covalent bonding with Si. Structural graphene but no electrical property (ZLG)

7 From 2 nd graphene layer (MLG), forming π bonding. Intrinsic doping n~10^13 due to the ZLG-SiC interface. Bilayer intrinsic doping and band gap opening Si – face (0001)

8 Transfer doping - Deposit electron acceptor - ex. Antimony, bismuth, F4-TCNQ ( electron acceptor molecule. Intercalation - Decoupling ZLG from SiC by putting other Si – face (0001)

9 Rotating 30° or ± 2.2° [10ī0] formation. Electrically decoupled between layers Stacks of layer  single layer electronic properties. C – face (000ī)

10 Si – faceC - face -Uniform single layer thickness control ( Ar overpressure ) -No effect of Ar overpressure -Uniformity control difficult -Defect free from SIC substrate-Surface defect -High crystal quality-Process control difficult -2000 cm2/VS (N-doped) -30000 cm2/VS (charge-neutral) -5000 cm2/VS (N-doped) -150,000 cm2/VS (charge-neutral) SUMMARY

11 J. Hass, et al. PRL 100, 125504 (2008) C. Riedl, et al. J. Phys. D: Appl. Phys. 43 (2010) 374009 Zachary R. Robinson, et al. CARBON 81 (2015) 73-82 J. Hass, et al. J. Phys: Condens. Matter 20 (2008) 323202 U. Starke, et al. MRS Bulletin 37 (DEC. 2012) Phillip N. First, et al. MRS Bulletin 35 (APR. 2010) Reference


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