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Published byAldous Norris Modified over 9 years ago
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FPGA Process Flowchart Backup
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FPGA Configurability Basis of configurability – Nature of transistor based FPGA Physical limitations – Through header on PCB using Xilinx provided development tools Backup
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FPGA Configurability Customer configurable – Configuration languages Knowledge of VHDL/Verilog – Development packages Xilinx provided development tools – Physical configuration requirements Connect programmer and download data file, restart board Backup
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Processing Elements DSP CPU based C Language FPGA Transistor based VHDL/Verilog Backup
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Customer Needs Use Supplied Components – 10MP Visual Camera – IR Camera – 1 of the 2 Inertial Navigation Systems depending on availability NovAtel OEM Board OEMV3 NovAtel OEM Board OEMV2 – OEM Camera Processing Board Interface to single 10Mpixel Camera through proprietary “D3 Camera” connector. Interface to single Thermal Camera through Camera Link Interface. Capture 10MP data at 1FPS Capture the Thermal Camera data synchronized with the 10Mpixel camera. Capture INS data and store to match corresponding photos. Accept data from auxiliary external cameras and INS units Make data overlay and processing possible on-board Output data from the supplied OEM Board connection for real-time viewing Store data internally during flight using a SSD SATA drive. Package must include mounting and space necessary for four cameras. Package everything (except for the IR camera) to protect it against the environment and to minimize the size. “Everything” Includes: – (4) visual cameras and their lenses – (1) INS sensor – (1) OEM Camera Processing Board – Any other components necessary for operation Position images for ground observations Make cameras separable from the processing hardware Interface package to a light passenger aircraft.
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Backup slide: Final Output IR Camera with INS Data overlay Color Aerial Photograph
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Customer provided devices OEM Digital Signal Processing Board CameraLink® to D3 Conversion Chips Novatel OEM Board IMU System Cameras – (2) Using D3 Connector interface – (1) IR using Camera Link
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Appendix: Radiation Assumptions: Treat enclosure as a black box Neglect Convection Neglect Conduction Temperature at surface of chassis = temperature inside of chassis All Power consumed by electronics is output as heat radiating out =.89 q c =.5q b
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Appendix: Humidity Dew point temperature is given as: – Constants defined as follows: Variables: – T d - Dew point ( C) – T - Ambient temperature ( C) – RH - Relative humidity (%) – m - Temperature range dependant constant (non- dimensional) – T n - Temperature range dependant constant ( C) constants temp range Tn ( C) m 0 to 50243.1217.62 -40 to 0272.6222.46
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