1. Heat Mitigation Considerations

2. Needs Considerations Approach Maintain optimal temperature range required by components Prevent the heat produced by the electronics from interfering with the operation of cameras Maintain an air/water tight environment

3. Needs Considerations Approach External environment Temperature on ground : assume 40-70 degrees F (Rochester in May) Temperature at 30,000 ft (5.7 miles): -66.8 - -36.8 degrees F * (assuming the system is in an aircraft) * Temperature drops about 3.56 Degrees F/1000 ft (http://en.wikipedia.org/wiki/Lapse_rate) Image ID: wea00041, NOAA's National Weather Service (NWS) Collection Photographer: Ralph F. Kresge #1059 Internal environment External temperature plus temperature of heat generated by electronic components (TBD)

4. Needs Considerations Approach Initial concept sketch Thermally isolate electronics and optics Allows for individual temperature needs of components to be met Possible conductive heat transfer method: all boards mounted to a single conductive backbone mounted in chassis Utilize conductive heat transfer methods inside the chassis Allows for an air/watertight environment Utilize passive convective heat transfer methods outside the chassis if necessary Removes heat from system

5. Mounting to Airframe

6. Needs Considerations Approach Ensure imaging system is securely attached to airframe Reduce vibration of system Image from: www.airamericafc.com/imaging/

7. Pre-existing bolt patterns in aircraft Pre-existing opening in aircraft for imaging systems Does not interfere with other components of imaging system Needs Considerations Approach

8. Utilize airplane’s pre-existing bolt pattern in vibration damping mount to attach vibration damping mount directly to airframe Needs Considerations Approach Initial sketch for vibration damping airframe-mount