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FPC1011F Introduction of a new sensor package.

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Presentation on theme: "FPC1011F Introduction of a new sensor package."— Presentation transcript:

1 FPC1011F Introduction of a new sensor package

2 FPC1011F Summary: FPC has invested + 1 000 KUSD High quality design
Electrically compatible with FPC1011C Available as solderable component New high quality supplier chain Production start June 2008

3 FPC1011F Product improvements: BT substrate + High quality FR4
+ No silver migration or oxide - May need mechanical support from underneath

4 FPC1011F Product improvements: BT substrate Film Assisted Moulding
+ Standard mould method + Embedded passives + Protects silicon edges

5 FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact + Custom design of flex film (length etc.) - Sourced by customer

6 FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact Available for soldering with BGA + Enables automated assembly process + Low cost

7 FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact Available for soldering with BGA New hard coating + Mass production process, applied on wafer + Not sensitive to scratches, - May give ESD footprint under extreme conditions

8 FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact Available for soldering with BGA New hard coating - May give ESD footprint under extreme conditions: Strong ESD discharge from test electrode (>7.5KV) => Coating surface may be affected by oxygen plasma reaction => May be detected in image from extremely wet fingers. Disappears over time (typically by 30% after 3 days) Conditions for possible appearance: Low humidity, typically northern China (may bring high voltage ESD discharges), High humidity, typically southern China (may bring wet skin properties), Electrode approach from top & discharge via sensor surface. Not observed by live finger discharge.

9 FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact Available for soldering with BGA New hard coating Metal frame + More robust versus plastic frame in FPC1011C + Available in different forms + Colour and surface conditions (default Satine finish metal colour) - Needs minimum order quantity

10 FPC1011F Product improvements: BT substrate Film Assisted Moulding
Flex film contact Available for soldering with BGA New hard coating Metal frame available in different forms

11 New Supplier chain Production improvements: Assembly managed by Amkor
+ No. one package supplier world wide Full automated production process + High volume capacity + Repeatable high quality process Well defined qualification process + High product quality - Longer product change time

12 New Supplier chain Production process: Silicon production

13 New Supplier chain Production process: Spin coating process
Silicon production Coating Spin coating process

14 New Supplier chain Production process: Silicon production Coating
Packaging Wafer dicing Die attach Wire bonding Passives FIM mould Frame assembly Flex contact assembly Test & outgoing inspection

15 FPC1011F Customer feedback: Thank you for your attention ! Questions?
Acceptable product? Thank you for your attention !


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