1. Status of ALD 33 mm MCP Development at Argonne
Jeffrey Elam, Qing Peng, Anil Mane, Joseph Libera
Argonne National Laboratory

2. Atomic Layer Deposition for Micro channel Plates
MCP Structure
pore
resistive coating (ALD)
emissive coating (ALD)
conductive coating (evaporation)

3. Flow Chart of ALD Resistive (RES) and Secondary Electron Emissive (SEE) Layers
ALD Group
Feedback for optimizing,
composition, thickness etc
Feedback for optimizing
RES, SEE on Si or glass
Feed back
Completed MCP
SEE on silicon
SEE Material testing group (Slade)
RES testing by ALD group (Qing)
Gain Testing Group
(Matt)
Need faster feedback for optimizing coatings
Need vacuum testing setup for high voltage resistant testing
Need e-beam evaporation system for end spoiling
Need faster feedback for optimizing coatings
Major bottleneck is feedback from testing

4. Flow Chart for MCP Fabrication
Incom Glass Plates
Acetone
sonication clean
Air dry at
200C >2h
Vacuum dry in ALD system (1 Torr flowing UHP N2)
Electrode coating
Baking at 400C
under N2
ALD RES, SEE coatings
in situ
Ozone clean
Test
resistance
Deliver for testing

5. Status of ALD Materials Development
RES layer:
Many candidates being developed and tested
uniformity (SEM, ellipsometry), composition (EDAX, XRF), electrical resistance (Hg probe)
3 new materials ready for gain testing
waiting for feedback before applying to Incom glass
Resistive coating need substantial characterization directly on MCPs.
(need vacuum testing setup – parts being ordered)
SEE layer:
SEE candidates delivered
waiting for feedback

6. Status of Endspoiling Current procedure Opportunities for E-beam NiCr
Au film by thermal evaporator (Hau Wang group)
>2 hr one side
Dewetting and adhesion problems, poor control over incident angle
Need e-beam evaporation of NiCr with rotation, 45 incident angle
Opportunities for E-beam NiCr
Center of Nanoscale Materials at ANL
Proposal accepted, but e-beam is down…
Orlando Auciello, MSD, (not operational - requires significant time and money)
Beihai Ma, ES, (not operational - requires significant time and money)
Robert Erck, MSD, (busy, not available)
John Pearson, MSD, (busy, not available)
Kwok, Wai-Kwong, (busy, not available)
Eileen Hahn, Fermilab – contacted, available, arranging to meet

7. Sample holder for electrode coating Fab will be completed this week.

8. Resistance testing setup

9. 2 ¾ in flange for electrical feed through
3 3/8 in flange for adding future parts
3 3/8 in flange for
thermal couple feed through
6.44”
2 ¾ in flange to connect to rough pump and Turbo.
Cross from Kj lesker,
ID of tube is: ”
Length of tube:
6.44”
3-3/8" CF
3.22
2.71
2-3/4"
2"
1-1/2"
4-1/2 (2.04) C
$335.00

10. MCP holder for resistive layer coating
PEEK +
Metal o-ring
MCP
Metal o-ring -
PEEK

11. Conclusions The Status of ALD developing for MCPs
Multiple ALD material system are waiting for testing
Optimizing process is limited by testing feedback.
Urgent problems need to be solve for speeding up process
Resistivity Layer:
Electrode coating equipment
In-situ vacuum, high voltage testing tool
Gain testing feed back
SEE layer:
SEE coefficient feedback for ALD film