1. SNAP NIR Detector Packaging Development: Universal SiC Package
Bruce C. Bigelow
Department of Physics, University of Michigan
30 June 2005

2. SiC NIR Package Design Issues
Neither vendor is producing a package we want to use for SNAP
SiC is currently favored for focal plane components
Need a package design that can accommodate either RSC or RVS designs
Main details are package size, connectors, and interface to FP
8 June 2005
B. C. Bigelow -- UM Physics

3. Current Rockwell Package Design
8 June 2005
B. C. Bigelow -- UM Physics

4. Current Rockwell Package Design
H2RG package and mounting details
8 June 2005
B. C. Bigelow -- UM Physics

5. Current RVS Package Dimensions
8 June 2005
B. C. Bigelow -- UM Physics

6. B. C. Bigelow -- UM Physics
Current RVS Package
Raytheon Proprietary / Competition Sensitive
8 June 2005
B. C. Bigelow -- UM Physics

7. UM SNAP NIR Package Design
8 June 2005
B. C. Bigelow -- UM Physics

8. UM SNAP NIR Package Design
8 June 2005
B. C. Bigelow -- UM Physics

9. UM SNAP NIR Package Design
8 June 2005
B. C. Bigelow -- UM Physics

10. UM SNAP NIR Package Design
8 June 2005
B. C. Bigelow -- UM Physics