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Published byHilary Randall Modified over 5 years ago
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SNAP NIR Detector Packaging Development: Universal SiC Package
Bruce C. Bigelow Department of Physics, University of Michigan 30 June 2005
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SiC NIR Package Design Issues
Neither vendor is producing a package we want to use for SNAP SiC is currently favored for focal plane components Need a package design that can accommodate either RSC or RVS designs Main details are package size, connectors, and interface to FP 8 June 2005 B. C. Bigelow -- UM Physics
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Current Rockwell Package Design
8 June 2005 B. C. Bigelow -- UM Physics
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Current Rockwell Package Design
H2RG package and mounting details 8 June 2005 B. C. Bigelow -- UM Physics
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Current RVS Package Dimensions
8 June 2005 B. C. Bigelow -- UM Physics
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B. C. Bigelow -- UM Physics
Current RVS Package Raytheon Proprietary / Competition Sensitive 8 June 2005 B. C. Bigelow -- UM Physics
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UM SNAP NIR Package Design
8 June 2005 B. C. Bigelow -- UM Physics
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UM SNAP NIR Package Design
8 June 2005 B. C. Bigelow -- UM Physics
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UM SNAP NIR Package Design
8 June 2005 B. C. Bigelow -- UM Physics
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UM SNAP NIR Package Design
8 June 2005 B. C. Bigelow -- UM Physics
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