1. CCTC MFG Capabilities & Technology Roadmap 2010

2. CCTC Manufacturing Capabilities
SIZE
Maximum Processed finish board size
22 X 16inch
Average Processed finish board size
8 X 6inch
Board Size Tolerance
±0.004inch
Maximum Panel Size
24 X 24inch
Minimum Panel Size
14 X 10inch
THICKNESS
Maximum Processed Thickness
.250inch
Average Processed Thickness
.062inch
Board Thickness Tolerance
+/-10%
Warp / Bow and Twist - Inch per Inch
≤0.5%
LAYER CONSTRUCTION
Maximum Processed Layer Count 28
Average Processed Layer Count 8
Minimum Dielectric Thickness (not including Microvia layers)
.002inch
Minimum Core Thickness
0.004inch
Layer to Layer Registration
.003inch
Dielectric Tolerance Layer to Layer
±10%

3. Minimum Mechanically Drilled Hole size Preferred
CCTC Manufacturing Capabilities
ASPECT RATIO
Maximum Aspect Ratio - Plated Through Holes
10: 1
Maximum Aspect Ratio - Microvia Holes
1: 1
Minimum Drill Size - Mechanically Drilled holes prior to plating
.008inch
Minimum Mechanically Drilled Hole size Preferred
.010inch 
Smallest Finished PTH
.006inch
Smallest Finished PTH - Tolerance
±.002inch
Nominal Finished PTH
.023inch
Nominal Finished PTH - Tolerance
±.003inch
HOLE SIZE TOLERANCE
PTH Standard
PTH Compliant Pin
NPTH
True Position Tolerance

4. CONDUCTOR WIDTH
Minimum Inner Layer Width
.003inch
Typical Inner Layer Width
.005inch
Minimum Outer Layer Width
Typical Outer Layer Width
Minimum Trace on 3 oz base copper
+/-.002
Minimum Trace on 4 oz base copper
Minimum Trace on 5 oz base copper
+/-.003
CONDUCTOR SPACE
Minimum Inner Layer Space - Trace to Trace
Typical Inner Layer Space - Trace to trace
Minimum Outer Layer Space - Trace to Trace
Typical Outer Layer Space - Trace to trace
Minimum SMD Land Pattern Pitch
0.016inch
CONTROLLED IMPEDANCE
Impedance Typical - Value Ohms
50 , 75 , 100
Impedance Typical - Tolerance
±10%
Maximum Impedance Capability - Value Ohms
150
Minimum Impedance Capability - Value Ohms 28
Maximum Impedance Capability - Tolerance
±20%(value < 50 Ohms)
Minimum Impedance Capability - Tolerance
±8%(single ended impedance value > 100 Ohms)
Impedance Modeling Tool (Type/Name) (I.e.True FieldSolver)
Polar CITS25
Impedance Measurement Technique (Equipment/Type)
Polar CITS500S
Differential Impedance Measurement Technique (Equipment/Type)

5. CCTC Heavy Copper Capability
Item
Normal cap.
Special Cap.
Layer ≤8
5oz min. line/space
Inner layer
16/16 mil
14/14 mil
Outer layer (finish)
12/12 mil
10/10 mil
3oz min. line/space
8/8 mil
7/7 mil
Line tolerance
Inner 3OZ
±2 mil
±1.5 mil
Inner 5OZ
±3 mil
±2.5 mil
Min. Drill bit mm
20 mil
16 mil

6. CCTC Heavy Copper Capability
Item
Normal Cap.
Special Cap.
Min. copper clearance
3OZ
≥12mil
5OZ
≥15mil
Inner layer annular ring (to drill bit)
Inner 3OZ
≥9 mil
≥8mil
Inner 5OZ
≥15 mil
Dielectric Thickness
Inner 3OZ、Copper density≥70%
≥0.15mm
Inner 3OZ、35%≤copper density<70%
0.25mm
≥0.2mm

7. CCTC Heavy Copper Capability
Item
Normal capability
Special capability
Hole to Line
mil
≥9mil
≥8mil
Min. Legend width
≥5.5
5.0≤X＜5.5
Min. Legend space
≥7.5
6≤X＜7.5
Inner layer copper density
Inner 3OZ
≥35%
Inner 5OZ
≥80%

8. CCTC HDI Manufacturing Capabilities
TECHNOLOGY
Buried Vias - Conventional
YES
Blind Vias - Conventional
Blind Micro vias
- How many sequential layers of Micro vias (one side) 3
Buried Micro vias (through an individual internal laminate)
Buried Resistors - Omega
N/A
Buried Resistors – Printed
Buried Capacitance
Conductive Via Fill (CB100)
Other Specify
Flex (Layer Count)
Rigid Flex

9. CCTC Manufacturing Capabilities
LAMINATE MATERIALS
Supplier
FR4 Standard Di-Functional Tg =
Shengyi S1000-2, Isola HR370
FR4 Standard Multifunctional Tg = 170℃
Iteq , GW , Grace
FR4 Tetra functional Tg = 140℃
Shengyi , GW , Grace
Resin Coated Copper Tg = 140℃
LG Chemical
Getek-Nelco-13
N/A
Getek-Nelco-13 Equivalent
Isola FR408HR
Polyimide
Arlon , Isola
BT Epoxy
Isola, MGC
Cyanate Ester
PTFE - Teflon
Arlon
Halogen Free
Panasonic, Shengyi
Rogers RO4350
Rogers
Omega-Ply
Mixed Dielectrics (specify)
Rogers 4350/FR4
Metal Backed Substrates
Metal Core

11. Basic Property Comparison for Various Material
According to our experiments on lead free material, the experience during the PCB manufacturing and also the feedback from our customers during their assembly, we compared the general property parameters of various lead free material. Please refer to below table:
Laminate
Type LF HF Tg
(℃) /DSC
Td-5% (℃)/
TGA
IPC-4101B
Z-CTE/TMA
T-260 (min)/TMA
T-288 (min)/
TMA
Dk/
1MHz
Df/
Fill
Anti
CAF
Res sys
a1/a2 ppm /℃)
50-260℃
Isola
PCLFR-370-HR Y N
180
350
IPC-4101B/126
45/220
2.6% 60 20
4.8
0.015 PN
FR408
185
IPC-4101B/99
19/230
3.3%
3.6
0.012 MF
Shengyi
S1000
150
335
48/250 10
4.7
0.011
S1000-2
340
2.8%
0.013
ITEQ
IT158TC
40/250
0.016
IT180ATC
45/240
0.017

12. ELECTRICAL TEST
Net List Extraction
YES
Net List Comparison
Simultaneous Top and Bottom 100% Net List
Maximum number of Nodes
20000
Other (Specify)
PRODUCTION CYCLE TIME
Average Production Cycle Time - Days
Quick Turn Capability - Days
days
Average Production Lot Size (Panels)
100
Maximum Production Lot Size (Panels)
300
Minimum Production Lot Size (Panels) 80
 IPC Class 2 and 3
YES 
BELLCORE COMPLIANCE
SEC Testing in House
SEC Testing Subcontractor
N/A
SIR Testing in House
SIR Testing Subcontractor
Solderability Testing (Frequency)
Per lot for shipment
Steam Age Testing Capability in House
Steam Age Testing Subcontractor
Gold Porosity Measurement Technique
YES ,POROSITY TESTER
Gold Roughness Measurement Technique
Gold Thickness Measurement Technique
X-Ray

13. CCTC Tech Roadmap Item Current 2011 2012 Mass Production R&D
Resin System
FR-4 Tg 180C°
Yes
---
Halogen Free FR-4 Tg 170C°
PTFE
Rogers Tg 280C°
Limited
BT Tg 200 C°
Polyimide Tg 260C°
RCC and LDP
Normal Epoxy
Tg 140C° Td 310C°
Halogen Free Epoxy Tg 150C°Td 350C°
LDP 170C°
Current Supplier
1. Shengyi; 2. Grace; 3. Isola; 4. Rogers; 5. MEM; 6. Nanya; 7. Arlon; 8. MGC;
9. Hitachi. 10. Panasonic

14. CCTC Tech Roadmap Item Current 2011 2012 Mass Production R&D
Max. layer count 28 32 40 36
HDI N+C+N 3 4
via on buried hole/
stack via
Yes
---
Max. Panel size
24” x 20”
28” x 22”
30” x 24”
Max. board thickness
( mm / mil )
5.6 / 220
6.35 / 250
7.0/.276
6.35/250
Min. board thickness
0.4/16
Tolerance of
thickness
T ＜ 1.0 mm
± 8%
± 7%
1.0 mm ≤ T ＜ 2.0 mm
± 6%
T ≥ 2.0 mm
± 10%

15. CCTC Tech Roadmap Item Current 2011 2012 Mass Production R&D
Min. core thickness
( mm / mil )
0.1 / 4
0.075 /3
0.075 / 3
0.05 /2
Min. Prepreg thickness ( um / mil )
50 / 2
---
Min. inner layer base copper thickness ( OZ )/Thick
0.33/ mil
---　
0.33/ mil
Max. inner layer base copper thickness ( OZ )/Thick
4.0/Ltd mil
5.0/
7.0mil
3.0/
3.6 mil
Min. outer layer base copper thickness ( OZ )/Thick
0.33/ mil
Max. outer layer base copper thickness ( OZ )/Thick
3.0/ mil
7.0 mil

16. CCTC Tech Roadmap Item Current 2011 2012 Mass Production R&D
Min. mechanical drill hole diameter ( mm / mil )
0.20/8 limited
---
0.20/8
Min. NPTH Tolerance
+/- 25 um /- 1 mil
+/- 25 um /- 1 mil
Min. PTH Tolerance
+/- 50 um +/- 2 mil
+/- 50 um /- 2 mil
Aspect ratio of PTH hole
10:1
12:1
16:1
PTH Hole location accuracy ( um / mil )
50/2

17. Large Window, Conformal Mask and Copper Direct
CCTC Tech Roadmap
Item
Current
2011
2012
Mass Production
R&D
Min annular ring (mil) per side 5
3.5
Min Clearance (mil) per side 7 6
Min. Laser Drill dia.( um / mil )
75 / 3
---
Aspect ratio of Microvia
0.75:1
1:1
Plate Filling Via
Yes
Min. Capture Pad annular ring ( um / mil )
100 / 12
75 / 10
88 / 10
Min. Target Pad annular ring ( um / mil )
Laser drill method
Large Window, Conformal Mask and Copper Direct

18. CCTC Tech Roadmap Item Current 2011 2012 Mass Production R&D
Min. Inner layer line width/space ( um / mil )
75 / 3
50 / 2
---
Min. out layer line width/space ( um / mil )
Min. SMT Pitch ( mm / mil )
0.3 / 12
Min. BGA Pitch ( mm / mil )
0.4 / 16
Min. Trace width tolerance
( Trace < 0.1 mm / 4 mil ) ( um / mil )
+/ /- 0.8
+/ /- 0.5
+/ /- 0.8
+/ /- 0.5
Min. Layer registration ( um / mil )
Min. Trace to hole ( mm / mil )
0.16 / 6.5
0.15 / 6
Min. Trace to board edge
( mm / mil )
0.25 / 10
0.2 / 8

19. CCTC Tech Roadmap Item Current 2011 2012 Mass Production R&D
Solder Mask registration tolerance
( um / mil )
+/ /- 2
+/- 37.5
+/- 1.5
+/ /- 2
---
Min. Solder dam ( um / mil )
50 / 2
Solder Mask type
Taiyo PSR 4000, Tamura DSR 2200,
Huntsman P77ma Halogen Free S/M.
Green, Blue, Black
Solder Mask Process
Electrostatic Spray Coating and Silk Screen
Surface Process
Lead Free HASL, ENIG, ENIG+OSP, OSP, Electrolyte Ni/Au, ENIG + Gold Finger, Immersion-Silver, Immersion-Tin,
Impedance control accuracy (%)
±10
± 7 ±7
± 5
Board warp & twist tolerance（%）
0.5
Routing Tolerance ( mm / mil )
+/ /- 4
+/ /- 4
---　
Punching Tolerance ( mm / mil )

20. PSR4000/Taiyo, DSR2200/Tamura,Huntsman ZM-400WF/Chuanyu , 200W/Taiyo
CCTC Manufacturing Capabilities
SOLDERMASK AND LEGEND
Nominal Soldermask Thickness (Measured at Crest)
mil
Soldermask Type and Supplier
PSR4000/Taiyo, DSR2200/Tamura,Huntsman
Minimum Solder Mask Web
3mil
Minimum Solder Mask Clearance to Pad
2mil
Soldermask Material RoHs Compliant?
Yes 
Legend Material RoHs Compliant ?
 Yes
Legend Type and Supplier
ZM-400WF/Chuanyu , 200W/Taiyo
SURFACE FINISHES
HASL
YES
Electrolytic Ni/Gold
Electroless Ni/Immersion Gold
FST Dexter (Immersion Tin)
Immersion Tin Other Specify
ATO
Soft Gold
OSP
Immersion Silver
Tin Lead Reflow
N/A
Palladium
R&D
Selective Tin Lead Reflow

21. BUM1+N+1 design parameter BUM1+N+1

22. BUM1+N+1 design parameter BUM1+1+N+1+1

23. 3-Build Up - CU Filled Via

24. Thank you!