1. Encapsulation Studies

2. Encapsulation Studies
100 modules encapsulated with Sylgard 186
Modules tested before/after encapsulation
No channel failures were found
In order to test the effect of thermal cycling, envorimental chamber acquired
xxx-xxx cycles between -30 C and 50 C and then test
Xxx-xxx extreme cycles between -40 C and 80 C and re-test

3. First thermal cycle 36 modules tested so far
xxx-xxx cycles each between -30 C and 50 C
Only 1 had any new failed channels after cycles
It has 9 new 2 sensor opens (1.7%)
Opens vary with time
Intermittent connections
1 bond lift-off visible
2 had scratches on PA which might have caused opens after repeated freezing and baking
Most channels have no visible damage
In total, only 0.05% channels effected

4. Second Extreme Thermal Cycle
17 modules tested so far
XX cycles between -40 C to 80 C
7 modules have new failures
1 chip acts if the FE is dead
6 other modules have in total 12 new opens
5 opens at module edges where bonds used to be difficult to make
4 of 6 modules
In most cases, bond damage not visible
1.6% of channels effected
0.1% if chip failure excluded