1. This is the new logo for the XC4000X family
This is the new logo for the XC4000X family. It represents both the XC4000XLA and the XC4000XV.

2. XC4000X Advancements over Existing Products
50%
Less
Power
Run-time
Price
Speed
Capacity
This foil overviews the key changes from the XC4000XL/XC40125XV to the new XLA and XV devices.
We are doubling Speed (this is best case chip to chip timing) and capacity.
Prices, Power, and Runtime (with 1.5) are all cut roughly in half. 2x
More

3. XC4000X Series 4000XLA 4000XV 4000XL Next Generation Doubles Density &
208
MHz
4000XLA
4000XV
I/O Performance 96
MHz
4000XL
Here are the members of the 4kX families and their capacity/performance limits.
Again note the 500K density and the 200 MHz speeds.
180K
500K
System Gates
Next Generation Doubles Density &
Performance of Industry leading XC4000XL

4. XC4000XLA Doubles System Speeds
208 MHz
133 MHz
96 MHz
System Speed = 1 / (Clk-Out + Setup + Hold)

5. XC4000X Series Internal Performance
314 MHz
172 MHz
108 MHz
This foil shows some examples of XLA/XV internal performance.
The prescaled counter represents the register to register performance through one level of logic.
The 32-bit Adder performance shows arithmetic performance. This is determined by the carry chain.
Dual-Port RAM shows the performance of the Select-RAM.

6. 50-70% Less Power Consumption
The XC4000XLA has much lower power dissipation than the XC4000XL. This is do to the combination of a complete relayout and the move from 0.35 micron TLM to 0.25 micron 5LM. The typical net is much shorter and will have much lower capacitance. Charging and discharging the capacitance of the nets is the major consumer of dynamic power.
The additional benefit of lower voltage in the XV devices lowers the power even more.

7. XLA Die Size Reduction Results in Lowest Cost
XC4000XL
0.35 micron process
3 Layers of Metal
Relative Die Size = 1
XC4000XLA
Ultra dense process
5 Layers of Metal
Relative Die Size = 0.35
The die size of the XC4000XLA is 65% smaller than the equivalent XL device.
The reasons for this are:
100 Man months of effort in optimizing the layout
A complete relayout from first generation 0.35 micron process
technology to state-of-the-art 0.25 micron technology
The major benefits are:
We can offer much lower prices to customers.
Optimized interconnect allows higher performance and lower power dissipation

8. 4000XL to 4000XLA Price Comparison
This shows the massive price reductions possible in going from the XL to the XLA. This is book pricing.
The slowest cheapest devices are cut by over 50%.
The -09 XL to -09 XLA reduction is more than 80%
XC4062XL/AHQ240

9. XC4000X Series FPGAs
Double Performance & Capacity while cutting Power & Run-times in half
XC4000XLA Family:
Fastest 3.3V FPGAs
208 MHz Chip-Chip Speeds
XC4000XV Family:
500,000 System Gates
Doubles Industry Capacities
Advanced 0.25 5LM process

10. Appendix

11. XC4000XLA Family 4013XLA 4020XLA 4028XLA 4036XLA
Logic Cells 1,368 1,862 2,432 3,078
System Gates* 30,000 40,000 50,000 65,000
Max. RAM bits 18K 25K 33K 42K
Max I/O
4044XLA 4052XLA 4062XLA 4085XLA
Logic Cells 3,800 4,598 5,472 7,448
System Gates* 80, , , ,000
Max. RAM bits 51K 62K 74K 100K
Max I/O
20-30% of CLBs as RAM

12. XC4000XLA Packaging Leadership
4013XLA 4020XLA 4028XLA 4036XLA 4044XLA 4052XLA 4062XLA 4085XLA
PQ/HQ HQ160
PQ/HQ HQ208
PQ/HQ240
HQ304
BG256
BG BG BG432
BG560
The smaller die of the XLA also allows bigger parts to go into smaller packages. All packages are completely footprint compatible.
In addition, we will be announce a family of 1.0mm BGAs for the XLA.
New with XLA

13. XC4000XV Family
40110XV 40150XV 40200XV 40250XV
CLB Array 64 x x x x 92
Logic Cells 9,728 12,312 16,758 20,102
System Gates 220, , , ,000
HQ240 HQ240
BG352 BG352
BG432 BG432 BG432 BG432
BG560 BG560 BG560 BG560

14. XC4000X Competitive Leadership
500K
208 MHz
100%
100%
bigger
87%
faster
46% less power
250K
111 MHz
54%
Rel. Power
(Clk-Out + Setup + Hold)
Xilinx 4000X-07
Altera FLEX 10K-1

15. Altera 3.3 Volt Die is 44% larger
Xilinx
XC4062XLA
Logic Cells = 5472
Relative Die Size = 1
Altera
EPF10K100A
Logic Cells = 4992
Relative Die Size = 1.44
Because the 10KA family was designed with first generation 0.35 micron technology and the XLA is designed with state-of-the-art 0.25 micron technology, the XLA die sizes are much smaller.
In this case, we looked at the 4062XLA vs. the 10K100A and found the 10K100A to be 44% larger in die size. In most cases the XC4062XLA will hold more logic than the 10K100A.
With the XLA family we can offer similar or lower prices than Altera 10KA devices and maintain a much higher level of profitability.
Source: Actual die size comparison of optimized .35u products

16. XC4000X I/O Performance
This foil shows the estimated increase in I/O performance from the XC4000XL to the XC4000XLA and XV.
The existing -08 chip to chip performance with the global clock is 96MHZ. The XLA/XV global clock I/O performance will go to 133MHz. Using the Fast Clock users will be able to get 208MHz chip to chip performance.