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COOLRUNNER II REAL DIGITAL CPLD

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Presentation on theme: "COOLRUNNER II REAL DIGITAL CPLD"— Presentation transcript:

1 COOLRUNNER II REAL DIGITAL CPLD
Ravi Kumar Vommina CPE 695 11/15/2018 UAH

2 Contents Introduction Features Architecture Advanced Features
Applications ISE 6.1 Cool Runner II Family parameters 11/15/2018 UAH

3 Introduction Reconfigurable Computing Platforms
Implementing algorithms directly in hardware Parallelism nature of Hardware Efficient Implementation FPGA (Field Programmable gate Array) Configurable logic blocks and routing resources CLB uses LUTs to implement Boolean functions Inclusion of hard cores CPLD (Complex programmable logic device) PLA , programmable AND plane,fixed OR plane PAL, both AND and OR planes 11/15/2018 UAH

4 Common logic may be shared in Cool Runner II
Introduction PAL: Requires 4 pt’s! PLA: Requires only 3 pt’s! A B C A B C Can NOT share common logic X = A & B # C Y = A & B # !C X Y X Y Indicates ‘used’ junction Common logic may be shared in Cool Runner II Indicates ‘unused’ junction Indicates ‘fixed’ junction 11/15/2018 UAH

5 Cool Runner II Features
Real Digital patented design technology enabling high performance and ultra low power consumption. true CMOS both in process technology and design technique 1.8 V system, fastest low power CPLD using real digital technology 0.18u process technology CMOS CPLD Static Icc of less than 100 micro amps at all times 100% CMOS product term generation 11/15/2018 UAH

6 CMOS V DD In steady state there exist always a finite resistance path between Vout and either VDD or Ground. Ideal static power should be zero Small static power consumption exists due to leakage currents and sub threshold conduction that is < 100 micro amps Total power = dynamic+short circuit +static Short circuit current flow is due to the delay in rise and fall times of input. Dynamic power = C .VDD2/ 2 . f CMOS inverter V V in out C L V V DD DD R p V V out out R n 11/15/2018 UAH V in 5 V V DD in 5

7 Product term generation
B C D Distributed RC model (Elmore delay) tpHL = 0.69 Reqn(C1+2C2+3C3+4CL) Design for speed: Alternative structures CL A C3 B C2 C C1 D 11/15/2018 UAH

8 100% CMOS Product Generation
Delay < 0.1ns Delay < 0.3ns 11/15/2018 UAH

9 Cool Runner Architecture – High Level View
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10 Cool Runner II Macro cell view
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11 Global Clock Signals Clock input is buffered that drives multiple internal global signal traces to deliver low skew and reduce loading delays 11/15/2018 UAH

12 Recap High level View 16 macro cells in a function block
Function blocks use PLA Function blocks interconnect with advanced interconnect matrix AIM is highly connected low power rapid switch Macro cell View 56 product terms 4 control terms, 3 product terms One flipflop as (D,T or latch) , ( edge or dual edge triggered) Xilinx software makes the choice when to choose product or global or control term 11/15/2018 UAH

13 Cool Runner-II I/O Characteristics
Programmable Output capabilities performed with software attributes Open drain with pull up Slew rate 11/15/2018 UAH

14 Cool Runner II input view
Schmitt Trigger Input 11/15/2018 UAH

15 Cool Runner II Input Characteristics
Termination Options Bus- Hold (Weak Keeper) Pull-Up CGND During power up device is in Quiescent state 11/15/2018 UAH

16 Advanced Features – Data Gate
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17 Advanced Features – Clocking Options
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18 Advanced Features-Cool Clock
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19 Using the advanced features
Clock divide declaration Instantiation Schmitt Trigger input 11/15/2018 UAH

20 Advanced Features-On the fly Configuration
Initial pattern is loaded into a configuration shifter The pattern first transfers into nonvolatile memory The pattern is then read from NV to SRAM for actual cell operation Leaves ability to reload the NV memory as xilinx says, “On the Fly” 11/15/2018 UAH

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23 Impact Menu 11/15/2018 UAH

24 Selecting OTF 11/15/2018 UAH

25 Cool Runner II Features
Advanced Design Security Hot Pluggable Wide package availability Supports Multi Voltage standards 11/15/2018 UAH

26 Applications Ideal for high speed designs:
High performance CPLD Advanced features Double data rates Target device for portable designs: Lowest power Maximum battery life Lower heat dissipation Small packaging Chip scale packaging 11/15/2018 UAH

27 PDA Battery Compact Flash Flash SRAM LED P Docking Cradle LCD Keypad
SMBus Battery Compact Flash Flash SRAM IrDA LED P UART Docking Cradle LCD SPI Keypad Touchscreen 11/15/2018 UAH

28 Interface for DDR SDRAM Interface
Address Data Control DDR SDRAM P Double data rates Address translation 11/15/2018 UAH

29 ISE6.1Design Flow An active project space is created.
Existing VHDL modules can be added or new ones can be created in the project. A user constraint file is specified that maps the input and out put signals to the actual pins of the device Synthesis of the design is performed by just selecting the implement design option. Device is configured by IMPACT. 11/15/2018 UAH

30 Cool Runner II 11/15/2018 UAH

31 Bibliography WWW.Xilinx.com http://bwrc.eecs.berkeley.edu/IcBook/
11/15/2018 UAH


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