1. Quality System
Q4, 2017

2. ChipMOS Quality Policy
ChipMOS IS DEVOTED TO THE FOLLOWING CUSTOMER FOCAL POINTS WITH THE CONSCIOUSNESS OF CONTINUAL IMPROVEMENT AND AGGRESSIVELY FIT CUSTOMER EXPECTATION TO SATISFY CUSTOMER.
南茂秉持著持續改善的精神，致力於以下顧客關注事項，積極實現客戶期望，以達客戶滿意。
ON TIME DELIVERY OF PRODUCTS WHICH MEET OR EXCEED CUSTOMERS’ QUALITY AND RELIABILITY REQUIREMENTS AT A COMPETITIVE COST.
QUALITY
產 品 品 質 : 符 合 客 戶 需 求
產 品 成 本 : 具 市 場 競 爭 力
產 品 交 期 : 準 時 服 務 客 戶
COST
DELIVERY

3. Milestones of ChipMOS Quality System
ISO17025
Certification
- Electricity
- Temp.
- Electrical Test
ISO9001
TS16949
ISO14001
Certified
OHSAS 18001
Certified
QC080000
Certified
ISO17025
Certification
- Chemical Analysis
IATF 16949
Certified
Quality Award (CSQ)
SONY GP
(Tier 2)
Certified
Company
wide
EICC
Compliance
ISO 27001
Certified
ChipMOS
1997 ~ 2002
2003~2007
2008~2012
2013~2017
ISO9002/ISO14001/QS 9000
Certified
Hsinchu
ISO 9001
ISO /TS16949 Certified
ISO14001:2004
Certified
ISO9002/ISO14001/QS 9000
Certified
SONY GP
(Tier 1)
Certified
ISO14064
Greenhouse Gas
ANS/ESD
S20.20
Tainan
EICC VAP
ISO16949/ISO14001/
OHSAS18001
Certified
(Logic Test/Memory Test)
ISO9001/ISO14001 Certified (Bumping)
Chupei/
HuKou
CSQ : Chinese Society for Quality
CNLA : Chinese National Laboratory Accreditation (ISO 17025)
Plan S3 3 3

4. Proven ChipMOS Quality
ISO/TS 16949:2009
ISO9001:2015
QC :2012
ISO 27001:2013
Waiting for IATF Certification
GHG
Verificaton Statement
ISO 14001:2004
OHSAS 18001:2007
ISO/IEC 17025 S4 4 4

5. ChipMOS Quality Management System
ChipMOS develops process-oriented QMS to identify and meet customer’s requirements and expectations in an effective and efficient manner to achieve competitive advantage.
CUSTOMER REQUIREMENT & EXPECTATION
CUSTOMER SATISFACTION
Continuous improvement of the quality management system
Corrective & Prevention, Continual Improvement System P A
Human Resource
System
• Training
• Qualification
• Empowerment &
Motivation
Management/ Strategy Planning Process
• Adv. Tech development
• Business plan
• Strategy planning
• Management review
• Organization planning
Monitor, Measurement, & Analysis System
• Data analysis
• Process performance
• Internal Audit
• Supplier performance
• Inspection
• Customer satisfaction
Investigation D C
Input
Output
Customer Requirement
Process
• Market Investigation
• Identification of customer needs
• Customer order, contract review
• Customer Service
(Satisfaction Complaint)
APQP
Process
• APQP
• Process Planning
Production
Planning Process
• MRP/CRP/CPS
• Resource plan
• Material purchasing plan
Production Process
• Purchasing
• Warehouse Mgt
• Production
• Measurement & Prod EQ Mgt
• Nonconformance Prod Mgt
• Stock, Shipping
Product S5 5

6. Continuous Improvement (System)
Annual goal setting
Management Commitment on continuous improvement
Management Committee
Quality
Goal
Product
Control
Calculate with cost category prevention cost, appraisal cost, internal failure cost, external failure cost
Analysis with cost Index
Quality
Cost
Management
Review
Dept. Manager
Dept. Manager
PIT team up with major process issue
QC story implementation
QC tools application
PIT conference award
Process
Improvement
Team
Cross
Function
Engineers
& Staffs
Engineers
& Staffs
Quality awareness promotion
ID conference award
Benefit prize for reward
IDEA
BOX
Company
Wide
Shop-floors

7. Continuous Improvement (Product)
Control Method
Data Sheet
Check Sheet
SPC Applications NO
Failure Mode
Influence to Product
Possible Cause
Detection Method
Product Characteristics
Process Parameters
Responsibility
Corrective Action
OCAP (Out of Control Action Plan)
Cpk
>= 1.67
1.33 <=
<1.67
< 1.33 20 50 10 40 30 60
Target :Cpk >= 2.0
(based on customer requirement)
MONTH
100%
YES
Small Quality Variation
Mean Value to Target
PROCESS CAPABILITY

8. Supplier Quality Assurance
Request
New Suppliers
Qualification
Phase I
Evaluation
Phase II
Qualification
Phase III
SPC
SPC
Suppliers
Capability Maintenance
Suppliers
Capability Improvement
Phase I
STC
STS
IQC
Ranking
Auditing
Win/Win
Phase II

9. Supplier Quality Assurance
ChipMOS
Supplier
1. Annual audit
2. Ranking (Quarterly)
3. QNR / PNR
4. Spec. / Drawing
5. New supplier qualification
1. Quality meeting
2. Abnormality handling
3. RMA handling
4. Review customer
feedback
1. C of C
2. Monthly report
3. Cpk data
4. Improvement report
5. Regular supplier meeting
(Quality & Technology )
Continuous improvement
1. 8D System
2. QIP
3. SPC

10. Assembly Quality Control Flow
1. Wafer inspection
. Optical inspection
. Wafer ID
2. Material inspection
. Dimension
IQC gate
Materials
Suppliers
Wafer in
Flow
Wafer sorting
Wafer -
mount
& dicing
Die &
Wire
Bonding
Molding
Marking
Plating
Trim &
Form
Visual &
Outgoing
Control
Testing
IPQC Gate
- Optical
inspection
- Adhesion
. die shear test
- Bondability
. wire pull test
. Ball shear test
IPQC Monitor
- Optical inspection
- Mark adhesion
IPQC Monitor
- Optical inspection
- Dimension
. Outline
. Coplanarity
IPQC Gate
- Optical inspection
- Purity
IPQC Monitor
- Optical inspection
- Moldability (x-ray)
. Wire sweep
. Void
- Parameter check
. Temperature
IPQC Monitor
- Optical inspection
- Plating thickness
- Solderability
. Sn content
. Soldering test
- Contamination
FQC/OQC Gate
- Optical inspection
. Marking
. Lead
. Package
Packing check
Document check
Control
Item

11. FT Quality Control Flow
IQC gate
Incoming
control
1. PKG inspection
. Lead
. Package body
. Marking
2. Consumable material inspection
. Appearance
. COA
Customers
PKG :
Elec. testing
& burn in
( & marking )
PKG :
V/M inspection
(lead & mark
Scanning)
Packing
Outgoing
Control
Shipping
• Assembly
• Subcontractors
• In-house
Flow
Vendors
FQC gate
- PKG Optical inspection
. Lead
. Package
. Marking
PQC gate
- Visual inspection
. Packing material
. Label content
. Packing method
- Packing
. QC seals QC
Control
Item
OQC gate
- Document check

12. WS Quality Control Flow
IQC gate
Incoming
control
- Wafer inspection
. Appearance
. Wafer ID
- Consumable material inspection
. Appearance
. COA
Wafer :
CP testing
&
laser repair
Wafer :
V/M inspection
(probing mark
& Ink)
Packing
Outgoing
Control
Customers
Shipping
Flow
Vendors
FQC gate
- Wafer inspection
. Appearance
. Document check
OQC gate
- Label content
- Documents check
- Packing check QC
Control
Item

13. WB Quality Control Flow
IQC gate
Incoming
control
- Wafer inspection
. Appearance
. Wafer ID
- Chemical, Reticle, Target
. Appearance
. COA
Wafer :
Bumping
Wafer :
V/M inspection
(AOI)
Packing
Outgoing
Control
Customers
Shipping
Flow
Vendors
FQC gate
- Wafer inspection
. Appearance
. Document check
OQC gate
- Label content
- Documents check QC
Control
Item

14. LCDD Quality Control Flow (TCP/COF)
IQC gate
Materials
Suppliers
1. Wafer inspection
. Optical inspection
. Wafer ID
2. Material inspection
. Optical inspection
. Dimension
Wafer in
Flow
Wafer sorting
Wafer -
mount
& dicing
ILB
Potting
Marking
Testing
Visual &
Outgoing
Control
Shipping
IPQC Gate
Optical inspection
Document check
IPQC Monitor
Dimension
FQC/OQC Gate
Optical inspection
Packing check
Document check
Control
Item
IPQC Monitor
- Bondability
. Total height
. Bend height (TCP)
. Edge gap (COF)

15. LCDD Quality Control Flow (COG)
IQC gate
Materials
Suppliers
1. Wafer inspection
. Optical inspection
. Wafer ID
2. Material inspection
. Optical inspection
. Dimension
Wafer in
Wafer sorting
Wafer -
mount
& dicing
AOI
P/P
Visual &
Outgoing
Control
Flow
Shipping
IPQC Gate
Optical inspection
Document check QC
Control
Item
FQC/OQC Gate
Optical inspection
Packing check
Document check

16. APG (TSOP/BGA/QFP/QFN)
Reliability Test (Procedure)
APG (TSOP/BGA/QFP/QFN)
LCDD (TCP/COF)
Samples In
Samples In
Preconditioning
Reliability Stress
Environment
Mechanical
Reliability Stress
Environment
Mechanical
FT or O/S Judgement
FT Judgement
Report Issued
Report Issued

17. Reliability Test (Capability)TH
TST
HT-SLT
PCT
TCT
THB
LT-SLT
HAST
Reflowing
All testing conditions follow and meet JEDEC, MIL and JEITA International Standards

18. Failure Analysis (Package Level)

19. Total Customer Satisfaction
Real
Information
Aggressive
Operation
Timely
Implementation
Effective
Action
Full-Scale
Consideration
Not only a subcontractor, but customer’s virtual fab. & trustable partner.
From customer’s view point to consider customer’s requirement.
24 hrs, 365 days, non-stop operation to carry on customer’s requirement.
In-time, On-time to implement customer’s requirement / specification.
Fix problem or Meet requirement at once by effective action.