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Day 12: October 1, 2012 Variation

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1 Day 12: October 1, 2012 Variation
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Day 12: October 1, 2012 Variation Penn ESE370 Fall DeHon

2 Previously Understand how to model transistor behavior
Given that we know its parameters Vdd, Vth, tOX, COX, W, L, NA … CGC CGCS CGCB Penn ESE370 Fall DeHon

3 But… We don’t know its parameters (perfectly)
Fabrication parameters have error range Identically drawn devices differ Parameters change with environment (e.g. Temperature) Parameters change with time (aging) Why I am more concerned with robustness than precision. Penn ESE370 Fall DeHon

4 Today Sources of Variation Coping with Variation Fabrication Operation
Aging Coping with Variation Margin Corners Binning Penn ESE370 Fall DeHon

5 Fabrication Penn ESE370 Fall DeHon

6 Process Shift Oxide thickness Doping level Layer alignment
Growth and Etch rates and times Depend on chemical concentrations How precisely can we control those? Vary machine-to-machine, day-to-day Impact all transistors on wafer Penn ESE370 Fall DeHon

7 Systematic Spatial Parameters change consistently across wafer or chip based on location Chemical-Mechanical Polishing (CMP) Dishing Lens distortion Penn ESE370 Fall DeHon

8 FPGA Systematic Variation
65nm Virtex 5 [Tuan et al. / ISQED 2010] Penn ESE370 Fall DeHon

9 Oxide Thickness [Asenov et al. TRED 2002]
Penn ESE370 Fall DeHon

10 Line Edge Roughness 1.2mm and 2.4mm lines From:
Penn ESE370 Fall DeHon

11 Optical Sources What is the shortest wavelength of visible light?
How compare to 45nm feature size? Penn ESE370 Fall DeHon

12 Phase Shift Masking Today’s chips use λ=193nm Source
Penn ESE370 Fall DeHon

13 Line Edges (PSM) Source:
Penn ESE370 Fall DeHon

14 Intel 65nm SRAM (PSM) Source:
Penn ESE370 Fall DeHon

15 Statistical Dopant Placement
[Bernstein et al, IBM JRD 2006] Penn ESE370 Fall DeHon

16 Random Trans-to-Trans
Random dopant fluctuation Local oxide variation Line edge roughness Etch and growth rates Stochastic process Transistors differ from each other in random ways Penn ESE370 Fall DeHon

17 Source: Noel Menezes, Intel ISPD2007
Penn ESE370 Fall DeHon

18 Impact Changes parameters Change transistor behavior W, L, tOX, Vth W?
Penn ESE370 Fall DeHon

19 Example: Vth Many physical effects impact Vth
Doping, dimensions, roughness Behavior highly dependent on Vth Penn ESE370 Fall DeHon

20 Vth Variability @ 65nm [Bernstein et al, IBM JRD 2006]
Penn ESE370 Fall DeHon

21 Impact of Vth Variation?
Higher VTH? Not drive as strongly Id,sat (Vgs-VTH)2 Performance? Penn ESE370 Fall DeHon

22 Impact Performance Vth  Ids  Delay (Ron * Cload)
Penn ESE370 Fall DeHon

23 Impact of Vth Variation
Think NMOS Vgs = Vdd Penn ESE370 Fall DeHon

24 FPGA Logic Variation Altera Cyclone-II Xilinx Virtex 5 65nm 90nm
[Tuan et al. / ISQED 2010] [Wong, FPT2007] Penn ESE370 Fall DeHon

25 Impact of Vth Variation?
Lower VTH? Not turn off as well  leaks more Penn ESE370 Fall DeHon

26 2004 Borkar (Intel) Micro 37 (2004) Penn ESE370 Fall DeHon

27 Operation Temperature Voltage Penn ESE370 Fall DeHon

28 Temperature Changes Different ambient environments
January in Maine July in Philly Air conditioned machine room Self heat from activity of chip Quality of heat sink (attachment thereof) Penn ESE370 Fall DeHon

29 Self Heating Borkar (Intel) Micro 37 (2004)
Penn ESE370 Fall DeHon

30 Thermal Profile for Processor
[Reda/IEEE Tr Emerging CAS v1n2 2011] Penn ESE370 Fall DeHon

31 Temperature (on current?)
High temperature More free thermal energy Easier to conduct Lowers Vth Increase rate of collision Lower saturation velocity Lower saturation voltage Lower peak Ids  slows down One reason don’t want chips to run hot Penn ESE370 Fall DeHon

32 Temperature and Ids Penn ESE370 Fall DeHon

33 Temperature (leakage?)
High temperature Lowers Vth Penn ESE370 Fall DeHon

34 Voltage Power supply isn’t perfect Differs from design to design
Board to board? How precise is regulator? IR-drop in distribution Bounce with current spikes Penn ESE370 Fall DeHon

35 Aging Hot Carrier NBTI Penn ESE370 Fall DeHon

36 Hot Carriers Trap electrons in oxide Also shifts Vth
Penn ESE370 Fall DeHon

37 NBTI Negative Bias Temperature Instability
Interface traps, Holes Long-term negative gate-source voltage Affects PFET most Increase Vth Partially recoverable? Temperature dependent Another reason not to run hot. [Stott, FPGA2010] Penn ESE370 Fall DeHon

38 Measured Accelerated Aging (Cyclone III, 65nm FPGA)
[Stott, FPGA2010] Penn ESE370 Fall DeHon

39 Coping with Variation Penn ESE370 Fall DeHon

40 Variation See a range of parameters L: Lmin – Lmax
Vth: Vth,min – Vth,max Penn ESE370 Fall DeHon

41 Impact of Vth Variation
Higher VTH Not drive as strongly Id,sat (Vgs-VTH)2 Lower VTH Not turn off as well  leaks more Penn ESE370 Fall DeHon

42 Variation Ion,min=Ion(Vth,max) Margin for expected variation
Must assume Vth can be any value in range Speed  assume Vth slowest value Ion,min=Ion(Vth,max) Id,sat (Vgs-Vth)2 Probability Distribution VTH Penn ESE370 Fall DeHon

43 Gaussian Distribution
From: Penn ESE370 Fall DeHon

44 Impact Given What maximum Vth should expect to see for a circuit of
Vth,nom = 250mV Sigma 25mV What maximum Vth should expect to see for a circuit of 100 transistors? 1000 transistors? 109 transistors? Penn ESE370 Fall DeHon

45 Class ended here Penn ESE370 Fall DeHon

46 Variation See a range of parameters Validate design at extremes
L: Lmin – Lmax Vth: Vth,min – Vth,max Validate design at extremes Work for both Vth,min and Vth,max ? Design for worst-case scenario Penn ESE370 Fall DeHon

47 Margining Also margin for Temperature Voltage Aging: end-of-life
Penn ESE370 Fall DeHon

48 Process Corners Many effects independent Many parameters
With N parameters, Look only at extreme ends (low, high) How many cases? Try to identify the {worst,best} set of parameters Slow corner of design space, fast corner Use corners to bracket behavior Penn ESE370 Fall DeHon

49 Simple Corner Example What happens at various corners? 350mV Vthp
Vthn Penn ESE370 Fall DeHon

50 Process Corners Many effects independent Many parameters
Try to identify the {worst,best} set of parameters E.g. Lump together things that make slow Vthn, Vthp, temperature, Voltage Try to reduce number of unique corners Slow corner of design space Use corners to bracket behavior Penn ESE370 Fall DeHon

51 Range of Behavior Still get range of performances
Any way to exploit the fact some are faster? Probability Distribution Delay Penn ESE370 Fall DeHon

52 Speed Binning Sell Sell cheap nominal Discard Sell Premium
Probability Distribution Delay Penn ESE370 Fall DeHon

53 Midterm 1 Contents should not be a surprise Identify CMOS/non-CMOS
Identify CMOS function Any logic function  CMOS gate Noise Margins Transistor Equations All regions and identify operating regions variation Circuit quasistatic configuration and switching delay Penn ESE370 Fall DeHon

54 Admin HW4 First midterm next Monday Previous midterm Review on Sunday
Solutions linked to 2011 syllabus Solutions linked to 2010 syllabus But only one midterm in 2010 so parts more advanced than where we are now Review on Sunday Time? Penn ESE370 Fall DeHon

55 Idea Parameters Approximate Differ Robust design accommodates
Chip-to-chip, transistor-to-transistor, over time Robust design accommodates Tolerance and Margins Doesn’t depend on precise behavior Penn ESE370 Fall DeHon


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