1. Your Technology Experts…2017
Streamline is UL approved for Lead Free Materials
Your Technology Experts…2017

2. Your Full Service, Time Sensitive, Printed Circuit Board Solution
Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications.
TeleCom
Mil / Aerospace
DataCom
Medical
Industrial

3. Streamline Circuit Corp’s Facility
Manufacturing all levels of technology
Time sensitive prototyping through production
The facility was established in 1982
New management team installed September 2003
75,000 sq. ft. PCB manufacturing facility
Complete manufacturing process under one roof
1 mile from the San Jose Airport
Delivery convenience for out of state customers
Located in Silicon Valley
Short car ride away for pick up & deliveries
Financially secure in current market
conditions
Low cost infrastructure
Located in Silicon Valley

4. Management and their Experience
Chuck Dimick –CEO / Founder
Over 38 years of experience in PCB manufacturing.  Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991)
Greg Halvorson – President / Founder
Over 34 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc.
Tom Doslak – Sr. Vice President of Sales & Marketing / Founder
Over 26 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc.
Michael Graves - Vice President of Operations
Over 30 years industry experience in both production and prototype manufacturing. Former VP of Operations for Pacific Circuits, and DDI. He also has experience as Quality Manager of a major PCB fabricator.
Lorraine Hook – Director of Quality
Over 47 years of industry experience. Former Director of Quality for many successful companies including DCI and DDI. She has held dual positions as Corp. Quality Systems Manager.
Mike Trammel – Director of Engineering
Over 28 years of industry experience. Former Director of Engineering for DDI and Dynavision. 12 years of Materials Application Engineering and R&D experience.

5. Management and their Experience Cont.
JR Ramirez – Production Manager / Founder
Over 36 years of industry experience. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc.
Louis Oliveira – Pre-Production Engineering Manager
Over 29 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. Previously was Pre-Production Engineering at Dynamic Details. Held various key positions at Davila International Circuits.
Phil Ramon – Pre-Production Engineering Supervisor
Over 36 years of experience in the PCB industry. Previously worked for 16 years on the management team for South Bay Circuits, more than 9 years as Pre-Production Engineering Manager and 10 years at CTS Printex. 

6. Customer Service Support
Customer Service (24 hours - 7 days a week)
Sales, Engineering, Manufacturing and Quality
Dedicated customer service readily available-our support group’s located onsite in the facility
Quick response to all requests such as:
Job status
Delivery pull-in
Quantity Increases
Engineering design modification
Inside Sales Customer Support

7. Proactive Engineering Services
Manufacturing Capabilities
Prototype though volume
All time sensitive builds
DFM (Design for Manufacturability)
DFM Software (reviews in 10 minutes)
Net list compare to customer data
Custom Verification programs
Looking for customer design error
In plan Smart data Collection System
Controlled Impedance Verification
Stack up assistance
Copper distribution
Material verification
Cam Valor Stations
4 Laser Direct Imaging units (18 Micron)

8. Controlled Impedance Verification
DFM Scan & Report
Stack up assistance
Copper distribution
Material verification
Sub Panel /Array Support
Go to Pre-Production

9. Automated Optical Inspection Fusion 22 (25 Micron)
Quality Reassurance
Net list compare prior to MFG
Matching Net list to Gerber data
Front End DRC (design rule check)
Searching for customer design mistakes
AOI Automated Optical Inspection
Verifying inner & outer layers, and SUBs
X-Ray Verification
After Lam (Inspecta), After Drilling
Cross Section Verification
Hole Integrity True-Chem Software
Controlled Impedance Testing
TDR test of panel coupons
100% Net List Test On All Product
Eliminator Tester & flying probe
Coordinate Measurement Machine
First articles, 100% measurement verification
In house Mil & deliverable Lab
Automated Optical Inspection Fusion 22 (25 Micron)

10. On Time Delivery Assurance
100% In-house manufacturing from start to finish
Control delivery & customer flexibility
In-process quality verification system
No out sourcing delivery delays
Employee Training program
Performance evaluation every 6 months
In-house Chemical Laboratory
Cross Sections
Chemical analysis
Mil spec verification
Vacuum Lamination press
20 Chambers
10 flying Probe Testers

11. Continuous Improvement Programs
Working daily on:
Research and Development
Pre-Engineering Programs
Improvement Process Program
Department Performance Reviews
Preventative maintenance program
Employee Training Program
Planned Capital expense program
48,000 holes per minute
7 Micro Via laser Total
Management meetings

12. A Full PCB Solution Multilayer Rigid / Rigid- Flex / Flex
1 to 70 Layers Plus
28:1 High Aspect Ratio
3.23 Mils Hole to Copper
Buried / Blind Vias
9 Sequential Laminations
13+ Stacked Vias
1 Mil Trace & Space
Cavity Constructions
6 oz. + Copper Thickness
Copper Filled Micro Vias
+/- 5% Controlled Impedance Tol.
AS9100 Rev. C / ISO 9001 / ISO 13485
Mil-Spec / ITAR
RoHS & Halogen Free Materials
IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency
3 Mil Mechanical Drills
24” x 30” Oversize Panel
2 Mil Laser Drill Vias
Up to 345 Mils Board Thickness
Via Under Pad (Conductive & Non- Conductive Filled)
75+ Materials (Hybrid Constructions)
Certifications

13. Engineering walk through
PCB TECHNOLOGY ROADMAP
Standard
Manufacturing
Advanced
Manufacturing
Emerging Technology
Engineering walk through
.003”
+/-.001”
.0038”
+/-.001”
.002”
+/ ”
.001”
+/-.0005”
.0005”
+/ ”
Line Width
1. Line and Space
Line Space
Tolerance
Drill Size
.008”
+.010”
28:1
.004”
+.008”
20:1
.003”
+.006”
20:1
.003”
+.002”
28:1
2. Drilled Via Size
Pad Diam
Aspect Ratio
Up to 36
Up to .187”
<16”X22”
36 to 48
Up to .300”
<19”X22”
48 to 60
Up to .350”
<22X28
>.350
Layer Count
3. Misc. Attributes
Thickness
Board Size
FR4
Polyimide
PTFE
HC (Rogers)
Interposer
Substates
UTR’s
Next
Generation
HSD
Advanced
Interposers
Nano Foils
Alternative
Resin Systems
Change drill to current – mat page
4. Laminate Materials
Rigid
Flex
Rigid Flex
FR4
Stiffeners
EMI Shield
Conductive
Bond Ply
Thin Flex
UL Approved
High Speed
Flex High
Reliability
Flex
Data Security UL
Multilayers
Flex
*UTR = Ultra Thin Rigid 13 13

14. TECHNOLOGY ROAD MAP CONTINUED
Emerging Technology
Standard
Manufacturing
Advanced
Manufacturing
Engineering
Walk through
Via Size
.004”
+.005”
.6:1
.003”
+.004”
1:1
.002”
+.004”
2:1
.001”
+.003”
3:1
5. Micro Via Size
Pad Dam
Aspect Ratio
HASL
Entek
Imm Silver
ENIG
ENEPIG
LF HASL
Eless Au
Sel Solder
Imm tin
Solder
Bump
TBD
6. Surface Finishes
+/-.003”
.006”
+/-.002”
.003”
+/-.001”
.002”
Tangency
Registration
7. LDI Soldermask
Min opening
Min hole
.012”
8:1
.010”
12:1
.008”
18:1
<.008
20:1
8. Conductive and
Non-Conductive Via Fill
Aspect Ratio 14 14

15. Certifications Nadcap ISO 9001:2000
IPC 6012,13,15,16,18 Class 3 DA and DS
ITAR
AS9100 Rev C
Mil-Spec 31032

16. Total Quality Management
Q-Pulse
Total Quality Management
Quality Assurance Systems
Q-Pulse Quality System
NCMR’s and Corrective Actions
Audits
Training
Equipment Calibrations
BACK

17. Streamline’s Capital Expenditures
Use advanced equipment technologies to manufacture today's printed circuit board requirements
The future in PCB manufacturing is about
technology and automation
Hire and Train equipment operators
High percentage engineering personnel and staff
Laser Direct Imaging Nuvogo LDI (18 Micro)
Cuposit & Electroless Line
DES Inner Layer Strip-line

18. Streamline’s Toolkit Tomorrows Printed Circuit Technology 18
Best in Class
Pre-engineering Tools
Personnel
Advanced Materials
Material Prep
Laser Direct Imaging
Best in Class DES
State of the Art Lamination Technologies and Registration Systems
Best in Class Drilling
Laser Drill Technology
Electroless
Plating
State of the Art
AOI, Testing 18

19. IPC Manufacturing Class & Industries

20. Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex
8 Layer Rigid Flex Micro via
6 Layer Rigid Flex with Cavity

21. Registration and Micro Via’s
PCB Equipment Needed
for the Future
Pre Production
Engineering
LDI Image
Processing
Develop Etch
Strip
Registration and Micro Via’s
Laser Drilling
Electroless
Technology
Solder Mask
Silkscreen
Test
Product Integrity
Quality
Verification
Streamline is UL approved for Lead Free Materials
Off-Shore Solution
Test Cases
Flex / Rigid-Flex
Back

22. Flex / Rigid-Flex

23. Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex
8 Layer Rigid Flex Micro via
6 Layer Rigid Flex with Cavity

24. Flex Capabilities Standard Advanced Layer Count 1L to 6L 8L to 10L
Maximum Panel Size
10”x16” (250x406mm)
10”x35” (250x889mm)
Min. Line/Space (H & ⅓ oz)
0.004" (0.10mm)
0.003" (0.076mm)
Outline Tolerance
+/-.004” (0.10mm)
+/-.002” (0.05mm) by laser
Stiffener Types
PI, FR4+PSA
PI, FR4, Steel, Alum
Polyimide Thickness
0.5, 1 mil (12.5, 25um)
2, 3, 4 mils (50, 75, 100um)
Base Copper Thickness
0.5, 1 oz (17.5, 35um)
¼ to 2 oz (9 to 70um)
HDI Microvias
Yes
Adhesiveless Materials
Flexible Soldermask
White Coverlay
RA Copper

25. Base Material Flex and Rigid Flex
Other Material Flex and Flex-Rigid
Name Manufacture Material Name
Conductive Silver Ink DuPont CB028
Flex LPI Solder Mask Taiyo PSR-9000FXT, PSR-900
Rogers RFLEX 8080 Liquid Coverlay
Kapton/Polyimide Stiffener DuPont Pyralux, FR, Pyralux
FR4 Stiffener Isola FR406, FR408, 370
Grace GA-170LL
Polyimide Stiffener Arlon N
Aluminum Stiffener
Pressure Sensitive Adhesive 3M MP, F9469PC, F9460PC
Strain Relief (Epoxy) Emerson &Cuming Eccobond 45 Clear, Black
IPC Manufacturer Material Name
4202/1 DuPont Pyralux FR
4203/1 DuPont Pyralux FR
4203/18 DuPont Pyralux FR, Pyralux
4204/1 DuPont Pyralux FR, Pyralux
4204/11 DuPont Pyralux AP
4101/21 Isola FR406, FR408, 370
4101/24 Isola FR406, FR408, 370
Arlon PrePreg 49N
4101B/124 Arlon PrePreg 51N
4101/26 Isola FR406, FR408, 370
Isola Prepreg FR406N
Grace GA-170LL
4101/41 Arlon 35N
Isola Prepreg P26
4101/42 Arlon PrePreg 38N
4101/99 Isola 370HR
Note: Other materials available and have been manufactured, but non standard on per customer request.

26. Off-Shore Solution

27. One Stop PCB Solution 3 million square feet manufacturing Space
QTA days ( based on technology)
Local Team Support ( US and China)
24 hours 7 days a week technical support
Focused Facilities based on Technology & Quantities

28. Complete Tooling Package
“Build Exact”

29. Integration-Domestic/Offshore
“Build Exact”

30. Time To Market “Build Exact”
The following slides show several examples of timelines using SmartArt graphics.
Include a timeline for the project, clearly marking milestones, important dates, and highlight where the project is now.
“Build Exact”

31. Intellectual Property
The implementation of strict protection for intellectual property of customers, other than the traditional encryption and decryption.
We provide rigorous authorization and detailed access logs to our employees, in order to control the exchange information.
Move Customers' Logo off and destroy the unusable boards completely. ……

32. Go to Slide 1 BACK Beijing KaiserstraBe, Germany EUROPE N. AMERICA
ASIA
Oregon
Utah
California
Chongqing
Shanghai
Florida
Texas
Shenzhen, Guangdong
Zhuhai
AFRICA
Hangzhou
S. AMERICA
OCEANIA
Headquarter
Plants
Go to Slide 1
Offices
BACK

33. PCB Capabilities Standard Advanced Maximum Layer Count 36L 40L
Maximum Panel Size
21”x24” (533x610mm)
24”x42” (610x1067mm)
Maximum Finished Thickness
0.126" (3.2mm)
0.256" (6.5mm)
Minimum Finished Thickness
0.006" (0.15mm)
0.004" (0.10mm)
Minimum Core Thickness
0.002” (50um)
.0015” (38um)
Trace/Space (H oz)
0.003”
.0025”
Maximum Aspect Ratio
14:1
25:1
Minimum Mechanical Drill
0.008" (0.20mm)
Minimum Laser Drill
0.003" (0.076mm)
Min. Soldermask Dam
0.003" (76um)
0.0025" (64um)
Max. Base Copper Thickness
5 oz (75um)
6 oz (210um)
Impedance Control
+/- 8%
+/- 5%

34. Technology Development
Filled Buried Vias
Continual development of new Technologies, Processes, and Materials
Low Dk/Df, Low CTE, CAF resistant, and Halogen Free FR-4
High Aspect Ratio Plating (25:1 and 30:1)
Advanced plating and photo lithography processes
Advanced tooling systems for registration
High Technology Radio Frequency (RF) PCB’s
Metal Backed and Thermal Management PCB’s
Solid Copper Plating for Through Vias
Deep Blind Vias and Deep Stacked Microvias
Embedded Capacitance & Resistance (2015)
Embedded Heater Circuits (2015)
Stacked Microvias

35. Manufacturing Capabilities
STANDARD
ADVANCED
Single-Side Flexible Panel Size
12"x18" 18"x24"
20"x26" 24"x36"
Double-Side Flexible Panel Size
12"x18"
18"x24" and Up
Mulilayer Flexible Panel Size
Layer Count
3 to 12
13+
RIGID FLEX PANEL SIZE
2 to 28
28+
Multiple Lamination
Copper Foil Weights Internal/External
1/4 to 2 ounce
Up to 3 ounce
Kapton Polyimide Stiffener
.001" to .007"
.008" and Up
FR4 Stiffener
.003" to .062"
.063" and Up
Polyimide Rigid Stiffener
Lines, spaces & pad diameters
Internal Line Width
.0035"
.001"
Internal Spacing
External Line Width
External Spacing
SMT Pitch
.010"
Controlled Impedance
10% 5%
Via hole Finish
STANDARD
ADVANCED
Laser Micro Vias
.004"
.002"
Blind/buried Vias
Laser Pads
Minimum Drilled Hole Size
.012"
.0079"
Drilled Hole to Copper
.008"
.007"
Castellation
Yes
Finish surface
Tin Lead Plating Thickness
.0003" to .0005"
Less .0005"
Tin Nickel Plating Thickness
150 Micro Inches
250 Micro Inches
Low Stress Nickel
100 Micro Inches
Gold Plating Thickness
30 Micro Inches
As Specified
Electroless Nickel/Immersion Gold
Immersion Gold
Immersion Silver
Entek 106A HT
HASL
TOLERANCES
Plated Hole Tolerances (+/-)
.001"
Non-Plated Hole Tolerances (+/-)
Fabrication Tolerance (+/-)
.005"
.003"
Vision Rout (+/-)
Laser Rout (+/-)

36. Our products are used in
Communication
Infrastructure IT
Terminal
Industrial Equipment
Other Products:
Consumer/
Office Facilities/
Military/
Vehicle/
Our products are used in 于
Automobile electronic

37. Product Mix
Complete
PCB
Solutions

38. Certifications F1 F2 F3 F4 F5 F6 Plant ISO9001 TS16949 ISO14001
QC080000
OHSAS18001
GJB9001
TL9000
AS9100
ISO27001 F1
Certified F2 F3 F4 F5
On-going F6

39. Materials Material Type Supplier Product Tg (°C) High-Tg FR-4
ShengYi
S1000-2
175
ITEQ
IT180A
ISOLA
370HR
Mid-Tg FR-4
S1000
150
Low-Tg FR-4
S1141
140
IT-140TC
NanYa
NY1140
Halogen-Free FR-4
S1155
130
S1165
170
High Speed
 Low Loss Materials
FR408, FR408HR, IS420, IS620, GETEK
Nelco
N , -13EP/SI, N
Panasonic
Megtron4, Megtron6
Rogers
RO3003, RO3006, RO3010, RO4003C, RO4350B
Arlon / Taconic
PTFE (RF35, TLX, TLY)
Aluminum
Yugu
YGA Series
Flex Polyimide
SY/Taiflex/Panasonic
½, 1 mil, 2 mil PI
Rigid Polyimide
Ventec
VT901
250
Additional Materials are available.

40. Zeta Certified Revolutionary ZETA® Material
Sunshine is a ZETA® Certified Fabricator
Glass-free Polyimide Film, 13/25 um [0.5/1 mil]
Low Dk ( ) and low Df ( )
Ideal for HDI and High Speed Applications
High peel strength after multiple lam cycles
Lead-free compatible and Halogen free
High dielectric strength
Eliminates Pad Cratering
Copper
B-Stage Epoxy
C-Stage Polyimide
Zeta® Cap
Zeta® Bond SE
Zeta® Lam
Graphics provided by Integral Technology

41. Product Showcase High Speed Board 10 Layer HDI N4000-13EP
119x112mm [4.7”x4.4”]
Thickness 1.6mm [.062”]
Construction 1+8+1
Aspect Ratio 10:1
Via-in-Pad (VIPPO)
Min L/S .10 mm [.004”]
Drill/Pad .006”/.016”
ENIG Finish
Application: GPS Receiver, Satellite Positioning System

42. Product Showcase Telecom Linecard 16 Layer HDI 370HR
376x272mm [14.8”x10.7”]
Thickness 2.21mm [.087”]
Construction
Aspect Ratio 11:1
Via-in-Pad (VIPPO)
Min L/S .10mm [.004”]
Drill/Pad .008”/.018”
Controlled impedance
ENIG Finish
Application: Data Server, Communications

43. Product Showcase High Layer Count Board 30 Layers S1000-2 (Hi-Tg FR4)
7.0” x 7.0”
Thickness 3.81mm [.150”]
25:1 Aspect Ratio with 25 um [1.0 mils] plating required in vias
Smallest drill .006” on .012” pads
Via-in-Pad (VIPPO) with maximum dimple 12.5 um [0.5 mils]
Full body nickel/gold
Minimum line/space .10 mm [4 mils]
BGA mounting device positional accuracy requirement
Fabrication rout tolerance of +/ mm [.008”]

44. Product Showcase ATE Board 34 Layers S1000-2 (Hi-Tg FR4)
368x368mm (14.5”x14.5”)
Thickness 4.6mm (.180”)
18:1 Aspect Ratio
Blind vias from L32-34
Via-in-Pad (VIPPO)
Internal Cu: 1 & 2 oz
Minimum L/S 4 mils
Drill/Pad .010”/.016”
Over 20 impedance controlled lines (SE/Diff)
Countersink holes
For semiconductor testing

45. Product Showcase Rigid-Flex 14 Layer HDI Rigid-Flex
Construction: 14R – 2F – 14R
Min L/S: .10 mm [4 mils]
Thickness: 1.6 mm [.062”]
Application: Medical
8 Layer Rigid-Flex
Construction: 3R – 2F – 3R
Min L/S: .13 mm [5 mils]
Thickness: 1.0 mm [.040”]
Application: Industrial

46. Product Showcase RF (Radio Frequency) Layer Count: 2L to 10L boards
Mat’l Options: Rogers (4350B, 3010, 4003C), Taconic (RF35, TLX, TLY)
Hybrid Option: RO4350B + FR4
Finishes: ENIG, Thick Wire Bondable Gold, Flash Gold
Special Process: Selective plating and etching
Applications: Radio Trans-receivers, Antennas, Power Amplifiers
RF = Radio Frequency

47. Comprehensive Quality System Structure
Regular Reliability
Test
In Process
Quality Control
TQM Activities
(Continuous Improvement)
Outgoing
Incoming
Panel Control
(Traceability)
Quality
Assurance

48. Implemented Routine Reliability Tests(1)No
Description
Test Parameter
Method Reference
Frequency 1
Cross Section
Microscope inspection
IPC-TM
per Lot 2
Solderability
Preconditioning with 2X IR Reflow; Solder Pot Temp.:232±6 oC, 2-3 sec (Solder Dip)
IPC-TM 3
Thermal Stress, PTH
Temp 288±5 oC, Cycle Time: 10+1/-0 sec, Solder Float X5 Cycles;
IPC-TM 4
Peel Strength
1oz copper foil, 25mm sample width, vertical 50 mm/min for min. 30 mm distance
IPC-TM
weekly 5
Dielectric Withstanding Voltage
Finished PCB, /-0V, 150V/s, for 30+3/-0 sec
IPC-TM 6
Liquid to Liquid Thermal Cycling
-55 to 125oC, 15 min. dwell and ramp time, 200 cycles
IPC-TM
monthly 7
Tensile Strength & Elongation
Plated thickness of 0.05 mm to 0.1 mm; gage length 50 mm; cross head speed 1.2 mm/min; chart speed 500 mm/min
IPC-TM

49. Implemented Routine Reliability Tests(2)No
Description
Test Parameter
Method Reference
Frequency 8
CAF Testing
65±2℃, 87+3/-2 %RH, 100V bias, 500 hrs
IPC-TM
monthly 9
Surface Finish Thickness
Metal thickness on the pad at four corners and center of the board
IPC-TM
per Lot 10
Solvent Extracted Contamination (SEC)
75% v/v 2-propanol/water; run time: 30 minutes
IPC-TM
per day 11
IR Reflow Simulation
Lead: sec;
Lead free: sec
J-STD-020 12
Soldermask Adhesion
3M Brand 600 ½” wide; min. 50 mm in length; perpendicular pulling
Per IPC-TM 13
Interconnect Stress Test (IST))
Ambient temperature to 150 oC, min. 300 cycles
IPC-TM 14
Material Stability
Tg/∆Tg, CTE, T260. Sample is heated at a rate of 5oC/min until all desired transitions have been completed
IPC-TM

51. State of the Art Facilities

52. Facilities Summary •25 years of PCB fabrication experience in China
•Strong financial backing
•Market/Product focused factories
•State of the art equipment and processes
•QTA/NPI to volume production capabilities
•No constraints on expansion
•Dedicated research and development institute
•Commitment to be the technology leader

53. Technology Process

54. Pre-Production Engineering
Services
“In Plan” planning software
Customer Specific Rules Based Automation
Valor front end CAM (Unlimited Seats)
Industry Standard for front end engineering
Stack up consultations, Service Offered No Charge $
Insight Frontline DFM’s, Service Offered No Charge $
Tech Seminars /Webinars
Material Science, Latest in Laminates and Pre Preg’s
R&D, Building the Toughest to Gain the Knowledge
When you need it, we will be ready!
Quality
Assurance

55. Hybrid Construction for low cost
(Meg 6 combined with low cost material for power layer)

56. High Speed Materials Website Page

57. DFM Report

58. Graphical DFM report
BACK
Go to Pre-Production

59. Imaging System

60. LDI (Laser Direct Imaging) Orbotech Paragon SM20

61. LDI Imaging Systems 100% Laser Direct Imaging (LDI)
Repeatable process, computer controlled
24/7 consistent imaging regardless of shift
No film means lower tooling costs
No repeating defects
Consistent trace width
Tighter impedance control (+/- 5 %)
¼ Mil Accuracy Min Line/.0005 Space
Layer to layer registration within .0004”
No film growth due to heat expansion
BACK

62. SCHMID Precision DES Line (Develop – Etch – Strip)

63. Inner Layer Develop Etch Strip
January 2012 State of the art Schmid DES line Installed
Computer controlled for consistent product
Full automation removes human element
2 Micron variation over panel
1 mil core capability for substrate, HDI, and Rigid flex
4,000 Cores per day capacity based on current copper mix
Tripled capacity upon installation
Positions Streamline for future technologies
BACK

64. ESI UV / CO2 Laser Drilling Systems
42,000 Holes Per Minute
2 tables (84,000 holes per minute with dual table deployment)
High speed and volume throughput
Removes RF stitching constraint
Copper weights can be reduced/more waveforms
Hole sizes are shrinking with increased density of collimator
Recipe controlled
Eliminates carbon burn on cutting edge
Speed matched to existing DES line new 2013

65. Laser Drilling 7 Laser drills in house (7th has been purchased)
Daily processing 4-N-4 of means experience
Higher stacks available
.0014” Hole, .004” Pad advances technology window
Aspect Ratio: 3:1
Positional Accuracy for Hole Location +/ ”

66. Via formation, Aspect Ratios and Stacked Vias for Increased Densities
BACK

67. Electroless Processing
Completely Automated Line installed January 2012
Industry leading 28:1 Aspect Ratio: allows for higher density designs
Bar coded processing removes operator errors
Dwell times established in planning for speed & efficiency, translating to consistent product
Ultrasonic, knife edge agitation, vibration & thumper
36 stations, Oversized tanks (24”x 30” Panels)
High volume throughput capability
BACK

68. IPS Automatic Electroless Plating Line

69. Test Capabilities: 100% Flying probe testing (8 Systems)
Flexibility, no fixtures, less cost
Allows for testing sub chapters before final book
Everett Charles Eliminator for faster testing
Every board 100% Net List Tested
BACK

70. ATG Flying Probe Testing (8)
16 Head Test Units
Soft Touch Capable
Fine Pitch .19mm Centers to .003 Pitch
ATG’s A7a (2)
8 advanced speed test heads
Self-loading automation
Automatic adjustment of the vacuum matrix
Universal shuttle with tensioning function
4 wire measurement
Micro short detection
Label printer

71. Pluritec Inspecta X-ray Registration System

72. Internal Registration
In unison with “Xact Software” for scaling
Internal Registration is one of the key attributes in being successful
X-Ray allows verification in real time
X-Sections Verify X-Ray

73. Xact Scaling Report

74. Non Conductive Filled Via Wrap Per IPC 6012 Class III
Electroless
Wrap
Smooth
Copper
Dendrites
(Teeth)

75. Copper Fill Laser Vias & Through Hole Solid Copper Vias
Thermal Via Farms for Thermal Management
BACK

76. Chip Scale Packaging
Chip Scale Packaging Requires Streamlines Equipment Sets for Success-100% LDI

77. LSMDP Laser Solder Mask Defined Pad Using the LDI’s
Precise Imaging to .0005” clearance
Allows reduced solder mask clearance sizes
May reduce layer count
Maximize geometry
Using laser solder mask defined pad (LSMDP)
You can define a “Pad” on top of a pad

78. LSMDP (Laser Solder Mask Defined Pad)

79. Ink Jet Silkscreen Orbotech Sprint-8TM

80. “Now Engineers can actually read to debug!”
Ink Jet Silkscreen
“Now Engineers can actually read to debug!”
Ultra Fine Crisp Lines, Down to 3 mil
Serialization on the fly, BAR Code & QR codes
Applied over partially cured mask providing for the mask and legend to be cure simultaneously to reduce cycle time
Combination inkjet and laser technology
Dry's the ink as it’s applied
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81. Quality Verification Verify Expected Results 2 X-Section labs on site
200 plus sections per day
Wet processing lab onsite
CMM For critical measurement reporting
Two TDR’s for impedance verification
Single ended & diff pairs (Separate testing for accuracy)
Ionic contamination testing
In process lamination X-ray verification
XRF Gold thickness verification X-Ray

82. Total Quality Management
Q-Pulse
Total Quality Management
Quality Assurance Systems
Q-Pulse Quality System
NCMR’s and Corrective Actions
Audits
Training
Equipment Calibrations
Quality Certifications
IPC Certified Trainers 6012, 13,15,18
ISO AS9100C ITAR MIL-P-55110
Mil-P In Process
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83. Future Investments New Schmid outer layer etcher
2 Orbotech AOI systems with .0005” (1/2 mil) capability
New Electroless Gold line (Enepig)
2 Additional LDI systems
New Photo plotter for button and silkscreen film
Additional OEM Press
Facility Growth Expansion
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84. Sample Case #1 Equipment Set: Highlights: LDI, DES 1/1 Trace Space
Laser, Inspecta, LDI
LDI, Inspecta, LDI S/M
LDI, Laser, Electroless
LDI, DES, Inspecta
Flying Probe
Highlights:
1/1 Trace Space
4 N 4 Stacked Micro Vias
.225 mm 1300 Pin BGA
1.6 Mil Via – 4 Mil Pad
.020 Thick
Sub Panel Test

85. Sample Case #2 Speed Test: 800ea 10 layers 2 Lamination cycles
Buried vias, 2-9
Laser Micro Blind 2-3, 8-9
Laser Micro Blind 1-2, with via in pad
3/3 trace and space
6.5 PTH to Copper
Delivered in 4 Days

86. Sample Case #3 Extremely Thin 4 Layer Buried vias 2 -3
2 Lamination cycles
Laser Micro Blind 1-2, 3-4
Finished thickness .0054
Equipment set
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