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Your Technology Experts…2017

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1 Your Technology Experts…2017
Streamline is UL approved for Lead Free Materials Your Technology Experts…2017

2 Your Full Service, Time Sensitive, Printed Circuit Board Solution
Located in the Heart of Silicon Valley, Streamline Circuits is your premier PCB manufacture of leading edge Technology and Innovation. We offer full service solutions for Rigid PCB’s, Flex PCB’s and Rigid-Flex PCB’s in both Ultra Quick Turn options along with Standard Production lead times. You will find that Streamline holds the necessary certifications to insure the highest standards of workmanship while supporting your companies specifications. TeleCom Mil / Aerospace DataCom Medical Industrial

3 Streamline Circuit Corp’s Facility
Manufacturing all levels of technology Time sensitive prototyping through production The facility was established in 1982 New management team installed September 2003 75,000 sq. ft. PCB manufacturing facility Complete manufacturing process under one roof 1 mile from the San Jose Airport Delivery convenience for out of state customers Located in Silicon Valley Short car ride away for pick up & deliveries Financially secure in current market conditions Low cost infrastructure Located in Silicon Valley

4 Management and their Experience
Chuck Dimick –CEO / Founder Over 38 years of experience in PCB manufacturing.  Former CEO of Dynamic Details Inc. and founder of the company's predecessor, Dynamic Circuits Inc. (1991) Greg Halvorson – President / Founder Over 34 years of experience in PCB manufacturing. Former VP of Operations of Dynamic Details Inc. and Dynamic Circuits Inc. Tom Doslak – Sr. Vice President of Sales & Marketing / Founder Over 26 years of industry experience. Former Director of Sales for Braztek Intl. and Western Regional Sales Manager for Dynamic Details Inc. Michael Graves - Vice President of Operations Over 30 years industry experience in both production and prototype manufacturing. Former VP of Operations for Pacific Circuits, and DDI. He also has experience as Quality Manager of a major PCB fabricator. Lorraine Hook – Director of Quality Over 47 years of industry experience. Former Director of Quality for many successful companies including DCI and DDI. She has held dual positions as Corp. Quality Systems Manager. Mike Trammel – Director of Engineering Over 28 years of industry experience. Former Director of Engineering for DDI and Dynavision. 12 years of Materials Application Engineering and R&D experience.

5 Management and their Experience Cont.
JR Ramirez – Production Manager / Founder Over 36 years of industry experience. Former Production Manager for both Dynamic Details Inc. and Dynamic Circuits Inc. Louis Oliveira – Pre-Production Engineering Manager Over 29 years of CAM “Computer Aided Manufacturing” experience to Streamline Circuits. Previously was Pre-Production Engineering at Dynamic Details. Held various key positions at Davila International Circuits. Phil Ramon – Pre-Production Engineering Supervisor Over 36 years of experience in the PCB industry. Previously worked for 16 years on the management team for South Bay Circuits, more than 9 years as Pre-Production Engineering Manager and 10 years at CTS Printex. 

6 Customer Service Support
Customer Service (24 hours - 7 days a week) Sales, Engineering, Manufacturing and Quality Dedicated customer service readily available-our support group’s located onsite in the facility Quick response to all requests such as: Job status Delivery pull-in Quantity Increases Engineering design modification Inside Sales Customer Support

7 Proactive Engineering Services
Manufacturing Capabilities Prototype though volume All time sensitive builds DFM (Design for Manufacturability) DFM Software (reviews in 10 minutes) Net list compare to customer data Custom Verification programs Looking for customer design error In plan Smart data Collection System Controlled Impedance Verification Stack up assistance Copper distribution Material verification Cam Valor Stations 4 Laser Direct Imaging units (18 Micron)

8 Controlled Impedance Verification
DFM Scan & Report Stack up assistance Copper distribution Material verification Sub Panel /Array Support Go to Pre-Production

9 Automated Optical Inspection Fusion 22 (25 Micron)
Quality Reassurance Net list compare prior to MFG Matching Net list to Gerber data Front End DRC (design rule check) Searching for customer design mistakes AOI Automated Optical Inspection Verifying inner & outer layers, and SUBs X-Ray Verification After Lam (Inspecta), After Drilling Cross Section Verification Hole Integrity True-Chem Software Controlled Impedance Testing TDR test of panel coupons 100% Net List Test On All Product Eliminator Tester & flying probe Coordinate Measurement Machine First articles, 100% measurement verification In house Mil & deliverable Lab Automated Optical Inspection Fusion 22 (25 Micron)

10 On Time Delivery Assurance
100% In-house manufacturing from start to finish Control delivery & customer flexibility In-process quality verification system No out sourcing delivery delays Employee Training program Performance evaluation every 6 months In-house Chemical Laboratory Cross Sections Chemical analysis Mil spec verification Vacuum Lamination press 20 Chambers 10 flying Probe Testers

11 Continuous Improvement Programs
Working daily on: Research and Development Pre-Engineering Programs Improvement Process Program Department Performance Reviews Preventative maintenance program Employee Training Program Planned Capital expense program 48,000 holes per minute 7 Micro Via laser Total Management meetings

12 A Full PCB Solution Multilayer Rigid / Rigid- Flex / Flex
1 to 70 Layers Plus 28:1 High Aspect Ratio 3.23 Mils Hole to Copper Buried / Blind Vias 9 Sequential Laminations 13+ Stacked Vias 1 Mil Trace & Space Cavity Constructions 6 oz. + Copper Thickness Copper Filled Micro Vias +/- 5% Controlled Impedance Tol. AS9100 Rev. C / ISO 9001 / ISO 13485 Mil-Spec / ITAR RoHS & Halogen Free Materials IPC 6012 Rigid / 6013 Flex / 6015 MCM / 6016 HDI / 6018 High Frequency 3 Mil Mechanical Drills 24” x 30” Oversize Panel 2 Mil Laser Drill Vias Up to 345 Mils Board Thickness Via Under Pad (Conductive & Non- Conductive Filled) 75+ Materials (Hybrid Constructions) Certifications

13 Engineering walk through
PCB TECHNOLOGY ROADMAP Standard Manufacturing Advanced Manufacturing Emerging Technology Engineering walk through .003” +/-.001” .0038” +/-.001” .002” +/ ” .001” +/-.0005” .0005” +/ ” Line Width 1. Line and Space Line Space Tolerance Drill Size .008” +.010” 28:1 .004” +.008” 20:1 .003” +.006” 20:1 .003” +.002” 28:1 2. Drilled Via Size Pad Diam Aspect Ratio Up to 36 Up to .187” <16”X22” 36 to 48 Up to .300” <19”X22” 48 to 60 Up to .350” <22X28 >.350 Layer Count 3. Misc. Attributes Thickness Board Size FR4 Polyimide PTFE HC (Rogers) Interposer Substates UTR’s Next Generation HSD Advanced Interposers Nano Foils Alternative Resin Systems Change drill to current – mat page 4. Laminate Materials Rigid Flex Rigid Flex FR4 Stiffeners EMI Shield Conductive Bond Ply Thin Flex UL Approved High Speed Flex High Reliability Flex Data Security UL Multilayers Flex *UTR = Ultra Thin Rigid 13 13

14 TECHNOLOGY ROAD MAP CONTINUED
Emerging Technology Standard Manufacturing Advanced Manufacturing Engineering Walk through Via Size .004” +.005” .6:1 .003” +.004” 1:1 .002” +.004” 2:1 .001” +.003” 3:1 5. Micro Via Size Pad Dam Aspect Ratio HASL Entek Imm Silver ENIG ENEPIG LF HASL Eless Au Sel Solder Imm tin Solder Bump TBD 6. Surface Finishes +/-.003” .006” +/-.002” .003” +/-.001” .002” Tangency Registration 7. LDI Soldermask Min opening Min hole .012” 8:1 .010” 12:1 .008” 18:1 <.008 20:1 8. Conductive and Non-Conductive Via Fill Aspect Ratio 14 14

15 Certifications Nadcap ISO 9001:2000
IPC 6012,13,15,16,18 Class 3 DA and DS ITAR AS9100 Rev C Mil-Spec 31032

16 Total Quality Management
Q-Pulse Total Quality Management Quality Assurance Systems Q-Pulse Quality System NCMR’s and Corrective Actions Audits Training Equipment Calibrations BACK

17 Streamline’s Capital Expenditures
Use advanced equipment technologies to manufacture today's printed circuit board requirements The future in PCB manufacturing is about technology and automation Hire and Train equipment operators High percentage engineering personnel and staff Laser Direct Imaging Nuvogo LDI (18 Micro) Cuposit & Electroless Line DES Inner Layer Strip-line

18 Streamline’s Toolkit Tomorrows Printed Circuit Technology 18
Best in Class Pre-engineering Tools Personnel Advanced Materials Material Prep Laser Direct Imaging Best in Class DES State of the Art Lamination Technologies and Registration Systems Best in Class Drilling Laser Drill Technology Electroless Plating State of the Art AOI, Testing 18

19 IPC Manufacturing Class & Industries

20 Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex
8 Layer Rigid Flex Micro via 6 Layer Rigid Flex with Cavity

21 Registration and Micro Via’s
PCB Equipment Needed for the Future Pre Production Engineering LDI Image Processing Develop Etch Strip Registration and Micro Via’s Laser Drilling Electroless Technology Solder Mask Silkscreen Test Product Integrity Quality Verification Streamline is UL approved for Lead Free Materials Off-Shore Solution Test Cases Flex / Rigid-Flex Back

22 Flex / Rigid-Flex

23 Rigid-Flex Examples 10 Layer Micro via BGA 6 Layer Rigid Flex
8 Layer Rigid Flex Micro via 6 Layer Rigid Flex with Cavity

24 Flex Capabilities Standard Advanced Layer Count 1L to 6L 8L to 10L
Maximum Panel Size 10”x16” (250x406mm) 10”x35” (250x889mm) Min. Line/Space (H & ⅓ oz) 0.004" (0.10mm) 0.003" (0.076mm) Outline Tolerance +/-.004” (0.10mm) +/-.002” (0.05mm) by laser Stiffener Types PI, FR4+PSA PI, FR4, Steel, Alum Polyimide Thickness 0.5, 1 mil (12.5, 25um) 2, 3, 4 mils (50, 75, 100um) Base Copper Thickness 0.5, 1 oz (17.5, 35um) ¼ to 2 oz (9 to 70um) HDI Microvias Yes Adhesiveless Materials Flexible Soldermask White Coverlay RA Copper

25 Base Material Flex and Rigid Flex
Other Material Flex and Flex-Rigid Name Manufacture Material Name Conductive Silver Ink DuPont CB028 Flex LPI Solder Mask Taiyo PSR-9000FXT, PSR-900 Rogers RFLEX 8080 Liquid Coverlay Kapton/Polyimide Stiffener DuPont Pyralux, FR, Pyralux FR4 Stiffener Isola FR406, FR408, 370 Grace GA-170LL Polyimide Stiffener Arlon N Aluminum Stiffener Pressure Sensitive Adhesive 3M MP, F9469PC, F9460PC Strain Relief (Epoxy) Emerson &Cuming Eccobond 45 Clear, Black IPC Manufacturer Material Name 4202/1 DuPont Pyralux FR 4203/1 DuPont Pyralux FR 4203/18 DuPont Pyralux FR, Pyralux 4204/1 DuPont Pyralux FR, Pyralux 4204/11 DuPont Pyralux AP 4101/21 Isola FR406, FR408, 370 4101/24 Isola FR406, FR408, 370 Arlon PrePreg 49N 4101B/124 Arlon PrePreg 51N 4101/26 Isola FR406, FR408, 370 Isola Prepreg FR406N Grace GA-170LL 4101/41 Arlon 35N Isola Prepreg P26 4101/42 Arlon PrePreg 38N 4101/99 Isola 370HR Note: Other materials available and have been manufactured, but non standard on per customer request.

26 Off-Shore Solution

27 One Stop PCB Solution 3 million square feet manufacturing Space
QTA days ( based on technology) Local Team Support ( US and China) 24 hours 7 days a week technical support Focused Facilities based on Technology & Quantities

28 Complete Tooling Package
“Build Exact”

29 Integration-Domestic/Offshore
“Build Exact”

30 Time To Market “Build Exact”
The following slides show several examples of timelines using SmartArt graphics. Include a timeline for the project, clearly marking milestones, important dates, and highlight where the project is now. “Build Exact”

31 Intellectual Property
The implementation of strict protection for intellectual property of customers, other than the traditional encryption and decryption. We provide rigorous authorization and detailed access logs to our employees, in order to control the exchange information. Move Customers' Logo off and destroy the unusable boards completely. ……

32 Go to Slide 1 BACK Beijing KaiserstraBe, Germany EUROPE N. AMERICA
ASIA Oregon Utah California Chongqing Shanghai Florida Texas Shenzhen, Guangdong Zhuhai AFRICA Hangzhou S. AMERICA OCEANIA Headquarter Plants Go to Slide 1 Offices BACK

33 PCB Capabilities Standard Advanced Maximum Layer Count 36L 40L
Maximum Panel Size 21”x24” (533x610mm) 24”x42” (610x1067mm) Maximum Finished Thickness 0.126" (3.2mm) 0.256" (6.5mm) Minimum Finished Thickness 0.006" (0.15mm) 0.004" (0.10mm) Minimum Core Thickness 0.002” (50um) .0015” (38um) Trace/Space (H oz) 0.003” .0025” Maximum Aspect Ratio 14:1 25:1 Minimum Mechanical Drill 0.008" (0.20mm) Minimum Laser Drill 0.003" (0.076mm) Min. Soldermask Dam 0.003" (76um) 0.0025" (64um) Max. Base Copper Thickness 5 oz (75um) 6 oz (210um) Impedance Control +/- 8% +/- 5%

34 Technology Development
Filled Buried Vias Continual development of new Technologies, Processes, and Materials Low Dk/Df, Low CTE, CAF resistant, and Halogen Free FR-4 High Aspect Ratio Plating (25:1 and 30:1) Advanced plating and photo lithography processes Advanced tooling systems for registration High Technology Radio Frequency (RF) PCB’s Metal Backed and Thermal Management PCB’s Solid Copper Plating for Through Vias Deep Blind Vias and Deep Stacked Microvias Embedded Capacitance & Resistance (2015) Embedded Heater Circuits (2015) Stacked Microvias

35 Manufacturing Capabilities
STANDARD ADVANCED Single-Side Flexible Panel Size 12"x18" 18"x24" 20"x26" 24"x36" Double-Side Flexible Panel Size 12"x18" 18"x24" and Up Mulilayer Flexible Panel Size Layer Count 3 to 12 13+ RIGID FLEX PANEL SIZE 2 to 28 28+ Multiple Lamination Copper Foil Weights Internal/External 1/4 to 2 ounce Up to 3 ounce Kapton Polyimide Stiffener .001" to .007" .008" and Up FR4 Stiffener .003" to .062" .063" and Up Polyimide Rigid Stiffener Lines, spaces & pad diameters Internal Line Width .0035" .001" Internal Spacing External Line Width External Spacing SMT Pitch .010" Controlled Impedance 10% 5% Via hole Finish STANDARD ADVANCED Laser Micro Vias .004" .002" Blind/buried Vias Laser Pads Minimum Drilled Hole Size .012" .0079" Drilled Hole to Copper .008" .007" Castellation Yes Finish surface Tin Lead Plating Thickness .0003" to .0005" Less .0005" Tin Nickel Plating Thickness 150 Micro Inches 250 Micro Inches Low Stress Nickel 100 Micro Inches Gold Plating Thickness 30 Micro Inches As Specified Electroless Nickel/Immersion Gold Immersion Gold Immersion Silver Entek 106A HT HASL TOLERANCES Plated Hole Tolerances (+/-) .001" Non-Plated Hole Tolerances (+/-) Fabrication Tolerance (+/-) .005" .003" Vision Rout (+/-) Laser Rout (+/-)

36 Our products are used in
Communication Infrastructure IT Terminal Industrial Equipment Other Products: Consumer/ Office Facilities/ Military/ Vehicle/ Our products are used in Automobile electronic

37 Product Mix Complete PCB Solutions

38 Certifications F1 F2 F3 F4 F5 F6 Plant ISO9001 TS16949 ISO14001
QC080000 OHSAS18001 GJB9001 TL9000 AS9100 ISO27001 F1 Certified F2 F3 F4 F5 On-going F6

39 Materials Material Type Supplier Product Tg (°C) High-Tg FR-4
ShengYi S1000-2 175 ITEQ IT180A ISOLA 370HR Mid-Tg FR-4 S1000 150 Low-Tg FR-4 S1141 140 IT-140TC NanYa NY1140 Halogen-Free FR-4 S1155 130 S1165 170 High Speed
 Low Loss Materials FR408, FR408HR, IS420, IS620, GETEK Nelco N , -13EP/SI, N Panasonic Megtron4, Megtron6 Rogers RO3003, RO3006, RO3010, RO4003C, RO4350B Arlon / Taconic PTFE (RF35, TLX, TLY) Aluminum Yugu YGA Series Flex Polyimide SY/Taiflex/Panasonic ½, 1 mil, 2 mil PI Rigid Polyimide Ventec VT901 250 Additional Materials are available.

40 Zeta Certified Revolutionary ZETA® Material
Sunshine is a ZETA® Certified Fabricator Glass-free Polyimide Film, 13/25 um [0.5/1 mil] Low Dk ( ) and low Df ( ) Ideal for HDI and High Speed Applications High peel strength after multiple lam cycles Lead-free compatible and Halogen free High dielectric strength Eliminates Pad Cratering Copper B-Stage Epoxy C-Stage Polyimide Zeta® Cap Zeta® Bond SE Zeta® Lam Graphics provided by Integral Technology

41 Product Showcase High Speed Board 10 Layer HDI N4000-13EP
119x112mm [4.7”x4.4”] Thickness 1.6mm [.062”] Construction 1+8+1 Aspect Ratio 10:1 Via-in-Pad (VIPPO) Min L/S .10 mm [.004”] Drill/Pad .006”/.016” ENIG Finish Application: GPS Receiver, Satellite Positioning System

42 Product Showcase Telecom Linecard 16 Layer HDI 370HR
376x272mm [14.8”x10.7”] Thickness 2.21mm [.087”] Construction Aspect Ratio 11:1 Via-in-Pad (VIPPO) Min L/S .10mm [.004”] Drill/Pad .008”/.018” Controlled impedance ENIG Finish Application: Data Server, Communications

43 Product Showcase High Layer Count Board 30 Layers S1000-2 (Hi-Tg FR4)
7.0” x 7.0” Thickness 3.81mm [.150”] 25:1 Aspect Ratio with 25 um [1.0 mils] plating required in vias Smallest drill .006” on .012” pads Via-in-Pad (VIPPO) with maximum dimple 12.5 um [0.5 mils] Full body nickel/gold Minimum line/space .10 mm [4 mils] BGA mounting device positional accuracy requirement Fabrication rout tolerance of +/ mm [.008”]

44 Product Showcase ATE Board 34 Layers S1000-2 (Hi-Tg FR4)
368x368mm (14.5”x14.5”) Thickness 4.6mm (.180”) 18:1 Aspect Ratio Blind vias from L32-34 Via-in-Pad (VIPPO) Internal Cu: 1 & 2 oz Minimum L/S 4 mils Drill/Pad .010”/.016” Over 20 impedance controlled lines (SE/Diff) Countersink holes For semiconductor testing

45 Product Showcase Rigid-Flex 14 Layer HDI Rigid-Flex
Construction: 14R – 2F – 14R Min L/S: .10 mm [4 mils] Thickness: 1.6 mm [.062”] Application: Medical 8 Layer Rigid-Flex Construction: 3R – 2F – 3R Min L/S: .13 mm [5 mils] Thickness: 1.0 mm [.040”] Application: Industrial

46 Product Showcase RF (Radio Frequency) Layer Count: 2L to 10L boards
Mat’l Options: Rogers (4350B, 3010, 4003C), Taconic (RF35, TLX, TLY) Hybrid Option: RO4350B + FR4 Finishes: ENIG, Thick Wire Bondable Gold, Flash Gold Special Process: Selective plating and etching Applications: Radio Trans-receivers, Antennas, Power Amplifiers RF = Radio Frequency

47 Comprehensive Quality System Structure
Regular Reliability Test In Process Quality Control TQM Activities (Continuous Improvement) Outgoing Incoming Panel Control (Traceability) Quality Assurance

48 Implemented Routine Reliability Tests(1)
No Description Test Parameter Method Reference Frequency 1 Cross Section Microscope inspection IPC-TM per Lot 2 Solderability Preconditioning with 2X IR Reflow; Solder Pot Temp.:232±6 oC, 2-3 sec (Solder Dip) IPC-TM 3 Thermal Stress, PTH Temp 288±5 oC, Cycle Time: 10+1/-0 sec, Solder Float X5 Cycles; IPC-TM 4 Peel Strength 1oz copper foil, 25mm sample width, vertical 50 mm/min for min. 30 mm distance IPC-TM weekly 5 Dielectric Withstanding Voltage Finished PCB, /-0V, 150V/s, for 30+3/-0 sec IPC-TM 6 Liquid to Liquid Thermal Cycling -55 to 125oC, 15 min. dwell and ramp time, 200 cycles IPC-TM monthly 7 Tensile Strength & Elongation Plated thickness of 0.05 mm to 0.1 mm; gage length 50 mm; cross head speed 1.2 mm/min; chart speed 500 mm/min IPC-TM

49 Implemented Routine Reliability Tests(2)
No Description Test Parameter Method Reference Frequency 8 CAF Testing 65±2℃, 87+3/-2 %RH, 100V bias, 500 hrs IPC-TM monthly 9 Surface Finish Thickness Metal thickness on the pad at four corners and center of the board IPC-TM per Lot 10 Solvent Extracted Contamination (SEC) 75% v/v 2-propanol/water; run time: 30 minutes IPC-TM per day 11 IR Reflow Simulation Lead: sec; Lead free: sec J-STD-020 12 Soldermask Adhesion 3M Brand 600 ½” wide; min. 50 mm in length; perpendicular pulling Per IPC-TM 13 Interconnect Stress Test (IST)) Ambient temperature to 150 oC, min. 300 cycles IPC-TM 14 Material Stability Tg/∆Tg, CTE, T260. Sample is heated at a rate of 5oC/min until all desired transitions have been completed IPC-TM

50

51 State of the Art Facilities

52 Facilities Summary •25 years of PCB fabrication experience in China
•Strong financial backing •Market/Product focused factories •State of the art equipment and processes •QTA/NPI to volume production capabilities •No constraints on expansion •Dedicated research and development institute •Commitment to be the technology leader

53 Technology Process

54 Pre-Production Engineering
Services “In Plan” planning software Customer Specific Rules Based Automation Valor front end CAM (Unlimited Seats) Industry Standard for front end engineering Stack up consultations, Service Offered No Charge $ Insight Frontline DFM’s, Service Offered No Charge $ Tech Seminars /Webinars Material Science, Latest in Laminates and Pre Preg’s R&D, Building the Toughest to Gain the Knowledge When you need it, we will be ready! Quality Assurance

55 Hybrid Construction for low cost
(Meg 6 combined with low cost material for power layer)

56 High Speed Materials Website Page

57 DFM Report

58 Graphical DFM report BACK Go to Pre-Production

59 Imaging System

60 LDI (Laser Direct Imaging) Orbotech Paragon SM20

61 LDI Imaging Systems 100% Laser Direct Imaging (LDI)
Repeatable process, computer controlled 24/7 consistent imaging regardless of shift No film means lower tooling costs No repeating defects Consistent trace width Tighter impedance control (+/- 5 %) ¼ Mil Accuracy Min Line/.0005 Space Layer to layer registration within .0004” No film growth due to heat expansion BACK

62 SCHMID Precision DES Line (Develop – Etch – Strip)

63 Inner Layer Develop Etch Strip
January 2012 State of the art Schmid DES line Installed Computer controlled for consistent product Full automation removes human element 2 Micron variation over panel 1 mil core capability for substrate, HDI, and Rigid flex 4,000 Cores per day capacity based on current copper mix Tripled capacity upon installation Positions Streamline for future technologies BACK

64 ESI UV / CO2 Laser Drilling Systems
42,000 Holes Per Minute 2 tables (84,000 holes per minute with dual table deployment) High speed and volume throughput Removes RF stitching constraint Copper weights can be reduced/more waveforms Hole sizes are shrinking with increased density of collimator Recipe controlled Eliminates carbon burn on cutting edge Speed matched to existing DES line new 2013

65 Laser Drilling 7 Laser drills in house (7th has been purchased)
Daily processing 4-N-4 of means experience Higher stacks available .0014” Hole, .004” Pad advances technology window Aspect Ratio: 3:1 Positional Accuracy for Hole Location +/ ”

66 Via formation, Aspect Ratios and Stacked Vias for Increased Densities
BACK

67 Electroless Processing
Completely Automated Line installed January 2012 Industry leading 28:1 Aspect Ratio: allows for higher density designs Bar coded processing removes operator errors Dwell times established in planning for speed & efficiency, translating to consistent product Ultrasonic, knife edge agitation, vibration & thumper 36 stations, Oversized tanks (24”x 30” Panels) High volume throughput capability BACK

68 IPS Automatic Electroless Plating Line

69 Test Capabilities: 100% Flying probe testing (8 Systems)
Flexibility, no fixtures, less cost Allows for testing sub chapters before final book Everett Charles Eliminator for faster testing Every board 100% Net List Tested BACK

70 ATG Flying Probe Testing (8)
16 Head Test Units Soft Touch Capable Fine Pitch .19mm Centers to .003 Pitch ATG’s A7a (2) 8 advanced speed test heads Self-loading automation Automatic adjustment of the vacuum matrix Universal shuttle with tensioning function 4 wire measurement Micro short detection Label printer

71 Pluritec Inspecta X-ray Registration System

72 Internal Registration
In unison with “Xact Software” for scaling Internal Registration is one of the key attributes in being successful X-Ray allows verification in real time X-Sections Verify X-Ray

73 Xact Scaling Report

74 Non Conductive Filled Via Wrap Per IPC 6012 Class III
Electroless Wrap Smooth Copper Dendrites (Teeth)

75 Copper Fill Laser Vias & Through Hole Solid Copper Vias
Thermal Via Farms for Thermal Management BACK

76 Chip Scale Packaging Chip Scale Packaging Requires Streamlines Equipment Sets for Success-100% LDI

77 LSMDP Laser Solder Mask Defined Pad Using the LDI’s
Precise Imaging to .0005” clearance Allows reduced solder mask clearance sizes May reduce layer count Maximize geometry Using laser solder mask defined pad (LSMDP) You can define a “Pad” on top of a pad

78 LSMDP (Laser Solder Mask Defined Pad)

79 Ink Jet Silkscreen Orbotech Sprint-8TM

80 “Now Engineers can actually read to debug!”
Ink Jet Silkscreen “Now Engineers can actually read to debug!” Ultra Fine Crisp Lines, Down to 3 mil Serialization on the fly, BAR Code & QR codes Applied over partially cured mask providing for the mask and legend to be cure simultaneously to reduce cycle time Combination inkjet and laser technology Dry's the ink as it’s applied BACK

81 Quality Verification Verify Expected Results 2 X-Section labs on site
200 plus sections per day Wet processing lab onsite CMM For critical measurement reporting Two TDR’s for impedance verification Single ended & diff pairs (Separate testing for accuracy) Ionic contamination testing In process lamination X-ray verification XRF Gold thickness verification X-Ray

82 Total Quality Management
Q-Pulse Total Quality Management Quality Assurance Systems Q-Pulse Quality System NCMR’s and Corrective Actions Audits Training Equipment Calibrations Quality Certifications IPC Certified Trainers 6012, 13,15,18 ISO AS9100C ITAR MIL-P-55110 Mil-P In Process BACK

83 Future Investments New Schmid outer layer etcher
2 Orbotech AOI systems with .0005” (1/2 mil) capability New Electroless Gold line (Enepig) 2 Additional LDI systems New Photo plotter for button and silkscreen film Additional OEM Press Facility Growth Expansion BACK

84 Sample Case #1 Equipment Set: Highlights: LDI, DES 1/1 Trace Space
Laser, Inspecta, LDI LDI, Inspecta, LDI S/M LDI, Laser, Electroless LDI, DES, Inspecta Flying Probe Highlights: 1/1 Trace Space 4 N 4 Stacked Micro Vias .225 mm 1300 Pin BGA 1.6 Mil Via – 4 Mil Pad .020 Thick Sub Panel Test

85 Sample Case #2 Speed Test: 800ea 10 layers 2 Lamination cycles
Buried vias, 2-9 Laser Micro Blind 2-3, 8-9 Laser Micro Blind 1-2, with via in pad 3/3 trace and space 6.5 PTH to Copper Delivered in 4 Days

86 Sample Case #3 Extremely Thin 4 Layer Buried vias 2 -3
2 Lamination cycles Laser Micro Blind 1-2, 3-4 Finished thickness .0054 Equipment set BACK


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