Orsay Micro-Electronics groups Associated : 2nd annual meeting P

Orsay Micro-Electronics groups Associated : 2nd annual meeting P
Orsay Micro-Electronics groups Associated : 2nd annual meeting P. Barrillon, S. Blin, S. Callier, S. Conforti, F. Dulucq, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, N. Seguin-Moreau, D. Thienpont + Xiongbo Ian from IHEP Beijing

Microelectronics at in2p3
Large force of microelectronics experienced engineers (~50) Expertise in detectors, chip design and test Experience in designing and building large particle physics detectors (trackers, calorimeters…) Common Cadence tools charge of national coordination Actions : Building blocks (SiGe, 130nm) Networking poles 2 july 09 C. de La Taille - OMEGA administration council

C. de La Taille - OMEGA administration council
Motivation for poles Continuous increase of chip complexity (SoC, 3D…) Importance of critical mass Daily contacts and discussions between designers Sharing of well proven blocks Cross fertilization of different projects Creation of poles at in2p3 OMEGA at Orsay Strasbourg Dipole Lyon-Clermont 2 july 09 C. de La Taille - OMEGA administration council

Orsay Micro-Electronics Groups Associated
A strong team of 12 ASIC designers… = 20% of in2p3 designers = 60% of department research engineers A team with critical mass : pole created in 2007 = OMEGA Expertise in low noise, low power, high level of integration ASICs 2 designers/ project 2 projects/designer Regular design meetings …Within an electronics dept. of 50 Support for tests, measurements, PCBs… A steady production A strong on-going R&D Building blocks SiGe 0.35µm SiPM MAROC 2 HARDROC SKIROC SPIROC 2 july 09 C. de La Taille - OMEGA administration council

Orsay micro-electronics team
9 research engineers (1 IR0, 2 IR1, 6 IR2) 1 phD student (ANR PMm2) thesis sept 2010 (Selma) 1 CDD engineer (ANR vitesse) (Damien) 1 visitor from China IHEP Beijing (Xiongbo) 2 july 09 C. de La Taille - OMEGA administration council

Recent chips Several chips developped for ATLAS LAr, OPERA, LHCb, CALICE in BiCMOS 0.8µm and installed on experiments Turn to Silicon Germanium 0.35 µm BiCMOS technology in 2005 Readout for MaPMT and ILC calorimeters Very high level of integration : System on Chip (SoC) Start of 3D integrated 130nm electronics for sLHC pixels MAROC2 HARDROC1 SKIROC1 SPIROC1 MAROC3 HARDROC2 SPIROC2 OMEGAPIX PARISROC1 2 july 09 C. de La Taille - OMEGA administration council

MAROC : 64 ch MAPMT chip for ATLAS lumi
Complete front-end chip for 64 channels multi-anode photomultipliers Auto-trigger on 1/3 p.e. at 10 MHz, 12 bit charge output SiGe 0.35 µm, 12 mm2, Pd = 350mW Bonded on a compact PCB (PMF) for minimal space occupancy Hold signal 64 inputs Variable Slow Shaper ns S&H Multiplexed Analog charge output S&H 64 Wilkinson 12 bit ADC Photons Multiplexed Digital charge output Variable Gain Preamp. Bipolar Fast Shaper PM 64 channels PMF Unipolar Fast Shaper 80 MHz encoder Gain correction 64*6bits 64 trigger outputs (to FPGA) 3 discris thresholds (3*12 bits) 3 DACs 12 bits LUCID P. Barrillon, S. Blin, F. Dulucq, G. Martin 2 july 09 C. de La Taille - OMEGA administration council

Active board pictures MAROC2 chip bounded at CERN 64 ch PMT MAROC side Lattice side P. Barrillon, S. Blin, D. Cuisy, M. Gaspard, B. Lavigne 2 july 09 C. de La Taille - OMEGA administration council

MAROC Efficiency curves
2 july 09 C. de La Taille - OMEGA administration council

MAROC status 1000 chips MAROC2 produced in 2007 300 to equip ALFA 500 to equip Double Chooz 200 packaged in PQFP240 for various users 25 chips MAROC3 fabricated in 2008 ATLAS/LUCID application (Bologna) Lower power dissipation Proposed adaptation to JEM/EUSO Photon counting + radiation hardening for space environment Many external users Hodoscope Menphyno (APC), PET (ISS Roma, Pisa, Valencia), Astrophysics : Air showers (EHWA Korea), 2 july 09 C. de La Taille - OMEGA administration council

JEM-EUSO proposal [S. Dagoret CSLAL]
Auger South JEM-EUSO Field Of view 30° x 30° 60°x 60° Collection surface : Ø (m) 3.5 2.5 # channels FD 24 x 440 = 10560 channels of MAPMT Je montre ici que les deux types de détecteurs de fluorescence des deux observatoires. La surface de collection dans les deux cas est voisine : Tous les deux ont une caméra constituée d’une matrice de photo multiplicateurs. Pour Auger il y a un miroir et la caméra est placée au point focal. Pour JEM-EUSO n’a pas de miroir en raison du mouvement permanent de l’ISS. Il y a un facteur 30 dans le nombre de canaux. JEM-EUSO appartient aux détecteurs du future génération avec toujours plus de canaux dans un volume toujours plus compact. Durée 30’’/5’ X 30 2 july 09 C. de La Taille - OMEGA administration council

LAL ASIC proposed contribution
ASIC Function: Analog part: Photoelectron counting (implemented LAL) Time Over Threshold (JAXA/Riken) Digital part (LAL): Digitization, Memory, Send data to FPGA for triggering Other: PMT gain control (PMT protection) with APC Activities electronic tests qualification absolute and relative calibration with APC database Crucial points Power consumption < 1mW/canal trigger data flow ~ 384 bits / 2.5 μs Nous souhaitons participer à la construction du détecteur. Nous avons choisi d’être au cœur du détecteur mais aussi des données, des critères de physique et des contraintes technologiques. Il s’agit de réaliser l’ASIC de Front-End. Il réalise le comptage de photons. Prendre le relai de la saturation du comptage à grand flux de photons, nous collaborons avec Riken et la Jaxa pour un circuit Time Over Threshold. Comme la contrainte essentielle est la consommation limitée par canal, la digitisation doit être réalisée au sein même du chip. Nous aurons à réaliser les activités suivantes : Ce chip sera qualifié spatialement. Il faudra aller jusqu’à la production de ASICs pour 2 modèles. Nous réaliserons les tests avec la C4I/Mind. Nous travaillons en coordination parfaite avec l’autre laboratoire français l’APC sur la calibration de l’électronique et de la photométrie (PM+ASIC). Nous envisageons de réaliser une base de données pour la construction de l’électronique de la surface focale. Durée : 1’30’’/16’ 30’’ 2 july 09 C. de La Taille - OMEGA administration council

Cost estimate The full detector ~ 150 million $-100 million € JAPAN ~ 70 million$ - 50 million € US(NASA) ~ 36 million $ - 26 million € France(CNES) ~3.5 million € (asked to CNES) (~3.5 % full detector) Of which LAL electronic contribution up to 700 k€ : Details of The ASIC project Ici je donne les couts estimés du détecteur hors salaires: Au total environ 100 millions d’euros, Le Japon, pays Leader paye 50 millions d’euros. Les US contribuent à hauteur de 25 millions d’euros, La contribution de l’Europe est en cours de définition. La contribution française soutenue par le CNES contribue à hauteur de 3.4 millions d’euros dont 700 k euros pour la contribution du LAL à l’électronique Front-End. Je donne sur ce transparents le détails des couts du projet au LAL. Pour mémoire Auger Sud: 50 millions d’euros: 30% fluorescence : 15 millions $ 70% SD : 35 millions $ ( 1 cuve = 20 k$ : 1600 x 20 k = 32 M) Durée : 30’’/18’ 2 july 09 C. de La Taille - OMEGA administration council

ILC front-end ASICs : the ROC chips
SPIROC Analog HCAL (SiPM) 36 ch. 32mm² June 07 Technological prototypes : full scale modules (~2m) EUDET EU funding (06-09) ECAL, AHCAL, DHCAL B=5T HARDROC Digital HCAL (RPC, µmegas or GEMs) 64 ch. 16mm² Sept 06 SKIROC ECAL (Si PIN diode) 36 ch. 20mm² Nov 06 2 july 09 C. de La Taille - OMEGA administration council

HaRDROC : ILC DHCAL readout
Hadronic Rpc Detector Read Out Chip 64 inputs, preamp + shaper+ 3 discris + memory + Full power pulsing Chip embedded in detector First DAQ tests in beam oct 08 1m2 RPC [IPNL] S. Callier, F. Dulucq, G. Martin, N. Seguin 2 july 09 C. de La Taille - OMEGA administration council

Trigger efficiency measurements
30 fC 10 fC Pedestal Dac unit Channel number 1pC 100 fC piedestal Low gain : DAC Unit ≈ 3 fC High gain : DAC Unit ≈ 1 fC NO decoupling cap. Daisy chain readout. FSB0, 100K, 100fF, G=144 2 july 09 C. de La Taille - OMEGA administration council

Power pulsing Total power on : 100 mW Total power off : 10 µW Power dissipation 1.5 mW/ch continuous 25 µs awake time 7.5 µW/ch with 0.5% duty cycle 10 µW/ch = 24h operation of full slab with 2 AAA batteries ! Trigger 25 µs PWR ON PA 5.46mA DAC 0.84mA 3 FSB 12.3mA BG 1.2mA SS 9.3mA vddd 0.67mA 3 Discris 7.3mA vddd2 0.4mA (=0 if 40MHz OFF) TOTAL 38mA 2 july 09 C. de La Taille - OMEGA administration council

HaRDROC status 240 chips HARDROC1 produced in june 2007 to equip 4-chip and 24-chip RPC and Micromegas detectors Package PQFP240 Not completely power-pulsed 400 chips HARDROC2 produced in june 2008 to equip 24-chip RPC and Micromegas for square meter 3 thresholds ( pC) Power pulsed to <10 µW/ch Package TQFP160 Essential for CALICE readout + DAQ2 validation Full production run : end 2009-beg 2010 After validation on detector External requests : medical imaging (IMNC), X-ray spectro (CSNSM), hodoscope (Obs Pce) TQFP: t=1.4 mm 2 july 09 C. de La Taille - OMEGA administration council

SPIROC : SiPM readout SPIROC : Silicon Photomul. Integrated Readout Chip 36 channels Charge measurement Time measurement Autotrigger on MIP or spe Sparsified readout compatible with EUDET 2nd generation DAQ Chips daisy-chained Pulsed power -> 25 µW/ch Fabricated in june 07 First SiPM readout ASIC S. Callier, F. Dulucq, J. Fleury, G. Martin, L. Raux 2 july 09 C. de La Taille - OMEGA administration council

SPIROC main features Internal input 8-bit DAC (0-5V) for individual SiPM gain adjustment Energy measurement : 14 bits 2 gains (1-10) + 12 bit ADC 1 pe  2000 pe Variable shaping time from 50ns to 100ns pe/noise ratio : 11 Auto-trigger on 1/3 pe (50fC) pe/noise ratio on trigger channel : 24 Fast shaper : ~10ns Auto-Trigger on ½ pe Time measurement : 12-bit Bunch Crossing ID 12 bit TDC step~100 ps Analog memory for time and charge measurement : depth = 16 Low consumption : ~25 µW per channel (in power pulsing mode) Individually addressable calibration injection capacitance Embedded bandgap for voltage references Embedded 10 bit DAC for trigger threshold and gain selection Multiplexed analog output for physics prototype DAQ 4k internal memory and Daisy chain readout 2 july 09 C. de La Taille - OMEGA administration council

Acquisition Channel 0 Conversion ADC + readout Ecriture RAM Channel 1
ValidHoldAnalogb 16 RazRangN Chipsat 16 ReadMesureb 16 Acquisition NoTrig gain Trigger discri Output Wilkinson ADC Discri output ExtSigmaTM (OR36) StartAcqt SlowClock Hit channel register 16 x 36 x 1 bits TM (Discri trigger) 36 BCID 16 x 8 bits Channel 0 gain Trigger discri Output Wilkinson ADC Discri output Conversion ADC + Ecriture RAM StartConvDAQb 36 ValGain (low gain or high Gain) TransmitOn readout RamFull OutSerie 36 EndReadOut EndRamp (Discri ADC Wilkinson) StartReadOut FlagTDC Rstb Channel 1 Clk40MHz ..… ADC ramp Startrampb (wilkinson ramp) RAM OR36 … StartRampTDC TDC ramp ChipID Chip ID register 8 bits 8 ValDimGray DAQ ASIC ValDimGray 12 bits 12 2 july 09 C. de La Taille - OMEGA administration council

HBU0 status [CALICE AHCAL @DESY]
©M. Reinecke (DESY) 2 setups available SPIROC1 Connectors: Signal Power SPIROC2 DIF FPGA CALIB USB / DAQ Flexleads 2 july 09 C. de La Taille - OMEGA administration council

Performance High gain channel linearity Linearity better than 1%
©W.Shen (Heidelberg) ©Beni (DESY) High gain channel linearity Linearity better than 1% pedestal Qinj=50fC 2 july 09 C. de La Taille - OMEGA administration council

SPIROC status 200 chips SPIROC1 produced in nov 2006 Package PQFP240 Good analog performance Bug in ADC ramp : no digital data out 50 chips SPIROC2 produced in june 2008 to equip AHCAL and ECAL EUDET modules EUDET milestone Package TQFP208 Difficult slow control loading Measurements slowly coming in Collab LAL, DESY, Heidelberg Full production run : end 2009 After validation on detectors External requests : astrophysics PEBS (Aachen), medical imaging (Roma, Pisa, Valencia, Siemens, GEMS), nuclear physics (IPNO), Vulcanology (Napoli) ©W. Karpinski (Aachen) 2 july 09 C. de La Taille - OMEGA administration council

SKIROC for W-Si ECAL Silicon Kalorimeter Integrated Read Out Chip (Nov 06) 36 channels with 15 bits Preamp + bi-gain shaper + autotrigger + analog memory + Wilkinson ADC Digital part outside in a FPGA for lack of time and increased flexibility Technology SiGe 0.35µm AMS. Chip received may 07 1 MIP in SKIROC S. Callier, M. Cohen-Solal, F. Dulucq, J. Fleury, N. Seguin 2 july 09 C. de La Taille - OMEGA administration council

Front-end board for ECAL
No component  All features embedded in ASIC PCB – FRONT PCB – BACK An ASU (Active Sensor Unit) S. Callier, D. Cuisy VFE ASIC bonded in a PCB ASIC buried in the PCB ASU stitching : zero thickness connection 2 july 09 C. de La Taille - OMEGA administration council

Summary of ILC chips 2nd prototypes of HARDROC (DHCAL) and SPIROC (AHCAL+ECAL) submitted in june 08 DAQ part being validated with HaRDROC Power pulsing tests essential now at system level Front-end boards first prototypes coming in Difficulties with ECAL boards DAQ interface (DIF boards) prototyped One engineering run with all 3 chips (ECAL, DHCAL and AHCAL) beg 2010 : can be used as « production run » Tests are very complex and lagging behind Still need to validate noise, autotrigger, ADC, power pulsing with detector. 2 july 09 C. de La Taille - OMEGA administration council

PARiSROC for PMm2 “PMm2” (2006 – 2009), funded by the ANR : LAL, IPNO, LAPP, Photonis Replace large PMTs (20”) by groups of smaller ones (12”) central 16ch ASIC (PaRISROC) 12 bit charge + 12 bit time water-tight, common High Voltage Only one wire out (DATA + VCC) Target low cost Application : large water Cerenkov neutrino External requests : Neutrino (DUSEL, LENA) Joël Pouthas IPN Orsay S. Conforti, F. Dulucq, M. El Berni, G. Martin, I. Xiongbo 2 july 09 C. de La Taille - OMEGA administration council

PARISROC1 performance 2 july 09 C. de La Taille - OMEGA administration council

PARISROC1 performance ©B Genolini (IPNO) Threshold = 220 DAC channels 0.3 pe 1 pe ©B Genolini (IPNO) 2 july 09 C. de La Taille - OMEGA administration council

3D technology Increasing integration density, mixing technologies Wafer thinning to <50 µm Minimization of interconnects Large industrial market Processors, image sensors… ©A. Klumpp (IZM) No side connections Without intervention in IC fabrication Wafer to wafer, Chip to Wafer 2 july 09 C. de La Taille - OMEGA administration council

Tezzaron 3D process Complete back end of line (BEOL) processing by adding Cu metal layers and top Cu metal (0.8 um) Front End of line (FEOL) : Chartered 130 nm CMOS (eq. IBM) Via first process : via diameter = 2 µm 6 um Cu ©B Patti (Tezzaron) 2 july 09 C. de La Taille - OMEGA administration council

Tezzaron 3D process Example: bonding identical wafers Cu for wafer bond to 3rd layer Face to back 12um Face to face CuCu bond Thin second wafer to about 12um to expose super via. Add metallization to back of 2nd wafer for bump bond or wire bond. OR Add Cu to back of 2nd wafer to bond 2nd wafer to 3rd wafer Flip 3rd wafer Bond 3nd wafer to 2rd wafer. Thin 3rd wafer to expose super via. Add final passivation and metal for pads Flip 2nd wafer on top of first wafer. Bond second wafer to first wafer using Cu-Cu thermo-compression bond. 2 july 09 C. de La Taille - OMEGA administration council

Fermilab 3D multiproject run [R. Yarema]
Fermilab is planning a dedicated 3D multi project run using Tezzaron for HEP. There will be 2 layers of electronics fabricated in the Chartered 0.13 um process, using only one set of masks. (Useful reticule size x 26 mm) The wafers will be bonded face to face. For devices without integrated sensors, bond pads will be fabricated for bump bonding to sensors to be done later at Ziptronix as shown below. Pixel sensors BTEV pixel ROIC wafer 2 july 09 C. de La Taille - OMEGA administration council

Example of 3D chip at FNAL
V1P1 3tier test chip FNAL 22 um 2 july 09 C. de La Taille - OMEGA administration council

OMEGAPIX: 3D ATLAS pixels at SLHC
Analog tier : preamplifier + shaper + discriminator + DAC to fix the threshold Digital tier: one 24 DFlipflop register OMEGAPIX includes 1536 channels divided in 24 columns and 64 ch/col. G. Martin, D. Thienpont F. Wicek, I. Guo (LPNHE) 2 july 09 C. de La Taille - OMEGA administration council

Conclusion MAROC, HaRDROC, SKIROC, SPIROC… SoC : System on chip (ADC, TDC, DAQ…) High synergy between chips Production in 2010 in a dedicated run ILC main customer Many external requests Long and difficult measurements… Diversification 3D electronics 130nm Spatial applications 2 july 09 C. de La Taille - OMEGA administration council

Chip submissions in June 2008 : Hardroc2, Parisroc1, Spiroc2 Nov 2008 : test structures for ATLAS calo upgrade March 2009 : Omegapix (Chartered 3D 130nm) June 2009 : Hardroc2b September 2009 : Parisroc2, Spiroc0 Beg 2010 : Omegapix2 Beg 2010 : Production run SiGe CALICE 2 july 09 C. de La Taille - OMEGA administration council

Engineering run Reticle size : 20x20 mm2 65 reticles/Wafer Arrangement to be finalized 10 HR3 3 SP3 1 SK2 Will be launched as soon as measurements are complete ! Exp. Beg. 2010 SKIROC2 SPIROC3 HR3 2 july 09 C. de La Taille - OMEGA administration council

Collaboration  Commitments
ATLAS luminometry: roman pots readout MAROC2 for MultiAnode PMT [S. Blin] CALICE/EUDET ILC calorimeters readout ASICs HaRDROC for RPC DHCAL (ANR 2007) [N. Seguin] SKIROC for SiW ECAL (EUDET ) [J. Fleury] SPIROC for SiPM AHCAL (and japanese ECAL) (EUDET) [L. Raux] Full production beg 2010 Coordination of FP6 EUDET JRA3 (with S. Sefkow DESY) PMM2 : ANR large area photodectors PARISROC [G. Martin] ATLAS 3D tracker R&D OMEGAPIX [G. Martin] 2 july 09 C. de La Taille - OMEGA administration council

Collaboration  External contracts
European contract EUDET ( ) R&D for detectors at the ILC. Calorimetry : design of chips for ECAL, AHCAL and DHCAL. 36 ppm engineer + 130k€ chip foundries ANR PMm2 ( ) [LAL, IPNO, LAPP] R&D for large arrays of photomultipliers (“square meter PM”). ANR DHCAL ( ) [IPNL, LAL, LAPP, LLR] R&D for a cubic meter digital hadron calorimeter at the ILC. 140k€ chip foundry for 5000 chips ANR vitesse ( ) [LAL, CPPM, LPNHE] 3D electronics for trackers. R&D for ATLAS at SLHC. 36 ppm engineer k€ chip foundries 2 july 09 C. de La Taille - OMEGA administration council

Collaboration  International Joint Labs
Japan : FJPPL ( ) Collaboration with KEK group (M Tanaka) on ASIC R&D for megaton-like experiment linked to PMm². China : FCPPL (2007-) Collaboration with IHEP (Beijing). One Chinese visitor for 6 months (1/2/08 31/7/08) on photomultiplier readout design. Collaboration on Parisroc and Building blocks. One Chinese PhD student (1/9/081/9/09). Korea : FKPPL (2007-) Collaboration with EHWA (Seoul). R&D on PCBs for CALICE ECAL 2 july 09 C. de La Taille - OMEGA administration council

Collaborations ILC Si-W ECAL ( ) with LLR & LPCClermont ILC RPC-Fe DHCAL (2006-) with LLR, IPNL & LAPP ILC Scintillator (SiPM)-Fe AHCAL (2003-) with DESY ILC Scintillator (SiPM)-W ECAL(2005-) with KEK ATLAS luminometer ALFA ( ) with CERN ATLAS luminometer LUCID ( ) with Bologna ATLAS tracker (2007-) with CPPM, Bonn, Munich & LBL Double Chooz ( ) with NEVIS lab PMm² ( ) with IPNO & LAPP SuperNemo Front-end (2008-) with LPC Caen SymbolX (2008-) with APC North Auger ( ) with IPNO Medical imaging with MaPMT (2007-) with ISS Roma Medical imaging PET with MsiPM (2007-) with INFN Pisa Medical imaging with MaPMT ( ) with IMNC Medical imaging with MaPMT (2008-) with CSNSM PEBs : Balloon experiment with SiPM (2008-) with Aachen Generic detector R&D (2007-) Space telescope for EECR measurement (2006-) with EHWA Korea FJPPL (2006-) with KEK FCPPL (2007-) with IHEP Beijing FKPPL (2008-) with EHWA 2 july 09 C. de La Taille - OMEGA administration council

Manpower  Position in Omega - 2008
% ANR EU IN2P3 TOTAL PMm² DHCAL VITESSE 2008 EUDET 2006 LSST SuperNemo ATLAS Lumi ANR+EU GRAND Pierre Barrillon 30 70 100 Sylvie Blin 50 Stéphane Callier Selma Conforti Frederic Dulucq Julien Fleury Christophe de La Taille 15 25 10 Gisèle Martin 20 Ludovic Raux Nathalie Seguin Vanessa Tocut 60 90 Wei Wei TOTAL FTE 2.25 1.25 0.8 4.2 0.7 1.45 8.6 2.8 11.4 2 july 09 C. de La Taille - OMEGA administration council

% ANR EU IN2P3 TOTAL PMm² DHCAL VITESSE 2008 EUDET 2006 Others JEM-EUSO ATLAS Lumi ANR+EU GRAND Pierre Barrillon 10 20 70 100 Sylvie Blin Stéphane Callier 90 Selma Conforti Frederic Dulucq 40 Julien Fleury 30 Christophe de La Taille Gisèle Martin Ludovic Raux Nathalie Seguin Damien Thienpont Xiongbo Yan 60 TOTAL FTE 2.6 1.1 1.8 3.5 .3 .6 1.4 9 2.3 11.3 2 july 09 C. de La Taille - OMEGA administration council

% ANR EU IN2P3 TOTAL PMm² DHCAL VITESSE 2008 EUDET 2006 Others JEM-EUSO ATLAS Lumi ANR+EU GRAND Pierre Barrillon 10 70 20 100 Sylvie Blin Stéphane Callier Selma Conforti Frederic Dulucq 40 30 80 Julien Fleury Christophe de La Taille 90 Gisèle Martin Ludovic Raux Nathalie Seguin Damien Thienpont CDD JEM EUSO TOTAL FTE 2 .9 1.8 3.5 .2 2.7 .4 8.2 11.7 2 july 09 C. de La Taille - OMEGA administration council

Communication  talks in conferences
PIXEL’08 Fermilab sept 2008 Invited Talk – microelectronics for SiPM readout, J. Fleury TWEPP ’08, Naxos Sept 2008 Talk – Spiroc : front-end ASIC for SiPM reaodut, J. Fleury Talk – PMF, front-end board for ATLAS luminometry, C. de La taille Poster – Skiroc a front-end ASIC for ILC SiW ECAL, J. Fleury Poster – Parisroc : digital part of PM readout, F. Dulucq Poster – PMm2 ASIC Parisroc, G. Martin-Chassard IEEE – Nuclear Science Symposium, Dresden Oct 2008 Talk – Spiroc : a front-end chip to readout SiPM, L. Raux Talk - PMF, front-end board for ATLAS luminometry, P. Barrillon TIPP’09, Tskuba march 2009 Talk – Parisroc for large neutrino detectors, G. Martin-Chassard FEE’09 Montauk may 2009 Invited talk – Hardroc and Spiroc, N. Seguin-Moreau Invited talk – Parisroc, C. de La Taille 2 july 09 C. de La Taille - OMEGA administration council

Communication  Web site
Provide up-to-date datasheets, application notes, firmware, etc. 2 july 09 C. de La Taille - OMEGA administration council

Teaching • Gisèle Martin Chassard Supelec, analogue microelectronics, labs, 20h • Nathalie Seguin-Moreau Master MIP, analogue electronics, lectures and training, ups, 9h • Ludovic Raux ENSTA, digital electronics, training, 24h • Christophe de La Taille Supelec, analogue electronics, lectures, training and labs, 40h Ecole calorimétrie Beijing 2009 Ecole Joliot Curie 2008 • Stephane Callier ESIEE, RF&HF measurement, labs, 16h EFREI, mixed microelectronics, lectures and training, 30h ENSTA, digital electronics, training, 24 2 july 09 C. de La Taille - OMEGA administration council

Pole follow-up by LAL Commitee appointed by G. Wormser M. Jaffre, P. Matricon, N. Seguin-Moreau, L. Serin (chair), C. de La Taille + direction ex-officio (F. Couchot) Report given to G. Wormser beg. May Presented to Conseil du Laboratoire LAL (15/5) Possible implications on LAL Electronics organization ->new extended commitee to tackle the issue (nov 09) Main conclusions : more support and communication needed from LAL’s direction Less hierarchical layers More support for tests Infrastructure and maintenance priority 2 july 09 C. de La Taille - OMEGA administration council

Summary Strengths Good international visibility Organization of TWEPP conference Good collaboration with CSNSM, IPNO & LLR (+others) Good results to ANR calls Additionnal manpower CDD 3D (Damien), CDD JEM EUSO Weaknesses Complex tests, understaffed Positionning inside LAL 2 july 09 C. de La Taille - OMEGA administration council

Questions & Comments 2 july 09 C. de La Taille - OMEGA administration council

Annexes Cost of ASICS Testboards Collaboration details 2 july 09 C. de La Taille - OMEGA administration council

Multi Project Run vs Dedicated Run
HARDROC2: will be submitted in june 08 (MPW run) MPW: 1k€/mm2 => Hardroc= 25 k€ 25 dies delivered in September 08, to be packaged About 300 dies available (no guaranty): 100 euros/die + packaging Price : 25 k€ € * nb_chips Engineering run: Wafer 8’’ Available area= mm2 1 reticle=20x20 mm2=400 mm2 => 65 reticles/wafer 16 chips (25 mm2) / reticle => 1000 Hardroc/wafer Cost : 150 k€ (masks) + 5k€/wafer - Price : 150 k€ + 5 € * nb_chips valuable for more than 1250 chips 2 july 09 C. de La Taille - OMEGA administration council

TEST BOARD MAROC (COB) 64ch PM socket USB port GPIB port Control Altera You can see the test board with chip on board The oscillation problem have been almost solved by chip on board There are no longer oscillations at gain lower than 2 2 july 09 C. de La Taille - OMEGA administration council

Collaboration  Requests
MAROC2/3 ATLAS LUCID detector (Bologna) Double Chooz (Nevis USA) PET imaging with PMT64 (ISS Roma) Medical imaging with SiPM matrixes (INFN Pisa) KEK (1 TB) Air shower imaging (EHWA Seoul) Memphyno (APC) (5TB) Russia (100 pc) Valencia (1 TB) HaRDROC Medical imaging Trecam (IMNC Orsay) Xray satellite (CSNSM Orsay) Pic du midi (200) SPIROC PEB (Aachen) (spiroc0) (?) Medical Roma Medical Pisa Mediacal Valencia MEdical (GE) PET (Siemens) Vulkano Napoli CLAS12 (IPNO) PARISROC SNEMO : chip transfer to CAEN IHEP Beijing (1 TB) DUSEL (U Wisonsin ) LENA ( LAPP : chip transfer to LAPP 2 july 09 C. de La Taille - OMEGA administration council

Orsay Micro-Electronics groups Associated : 2nd annual meeting P

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