1. Contacts:-
For enquiries, please contact the following members:
Consortium Chairman/
Microwave Circuit Design
Dr. Chew Siou Teck
Tel:
Antenna Design
Dr. Ooi Ban Leong
Tel:
Foundry Service
Wong Chee Khuen Stephen
Tel:
Photonics Packaging Design
Dr. Ong Ling Chuen Michael
a-star.edu.sg
Tel :
SUBSTRATE AND MICRO-PACKAGING RESEARCH FOR INDUSTRY AND MILITARY APPLICATIONS CONSORTIUM (SPRIMA)
The Substrate and Micro-Packaging Research for Industry and Military Applications (SPRIMA) Consortium was formed in January 2003 to develop design and manufacturing capability in Low Temperature Co-Fired Ceramic (LTCC) technology. By leveraging on the strengths of four institutes: DSO National Laboratories (DSO), National University of Singapore (NUS), Institute for Infocomm Research (I2R) and Singapore Institute of Manufacturing Technology (SIMTech), this consortium will develop dual-use technologies in wireless communication and broadband digital electronics. This is a strategic research project jointly funded by A*STAR (Agency for Science, technology and Research) and DSTA (Defence Science and Technology Agency).
This consortium has accumulated significantly rich intellectual properties in design and fabrication in the areas of antennas, high speed digital, photonics and microwave interconnects and circuits. SPrima is keen and ready to engage in prototyping services for commercial applications. It is also keen to collaborate with strategic partners for future research and development.
LTCC DESIGN, FABRICATION AND BROADBAND CHARACTERISATION
DESIGN
High-Speed Signal Integrity Analysis
Power Distribution Modelling and Simulation
Embedded Passives Modelling and Simulation
Virtual Prototyping
FABRICATION
High-density flip chip substrate
High-Density Multi-Layer Interconnection
Integration of Embedded Passives
CHARACTERISATION
20 GHz Multi-Port Frequency Domain Analysis
10 Gb/s Eye Diagram Analysis
APPLICATIONS
Optical Networking
High-Performance Computing
Broadband Data Communications
Power distribution resonance analysis
10 Gb/s performance validation

2. LTCC Low Loss Vertical Interconnect & Millimetre-wave Package
IMPLEMENTATION OF OPTO – Tx/Rx on LTCC MODULES
LTCC Low Loss Vertical Interconnect & Millimetre-wave Package
Fibre
Fibre Stopper
DESIGN
Design
Microstrip to stripline transitions
Coplanar Waveguide to stripline transitions
Millimetre-wave package design
LTCC MCMs for Radio-over-Fibre (RoF) application
Flip-chipped bare-die Vertical Cavity Surface Emitting Lasers (VCSEL) and detectors
Design of individual transmitter and receiver subsystem
Characterisation of IC chips and opto-electro components in LTCC
125m
50m
PD/VCSEL
Characterization
LNA/Driver
Fibre alignment in LTCC
APPLICATIONS
Back-to-back microstrip to stripline transition
Frequency : multi-band up to 40GHz
Insertion loss: <-1dB
Return loss: <-20dB
Opto-electro modules for communication applications
RF modules for wireless applications
Fibres
Fibres
LTCC Rx
LTCC Rx
LTCC Tx
LTCC Tx
Filters
Filters
Caption
Caption PA PA
LNA
LNA
LTCC ANTENNA DESIGN
PCB/LTCC motherboard
PCB/LTCC motherboard
Opto-electro modules in LTCC
Ultra-Broadband Antenna and Array Design
Multi-Band Antenna Design
Fractal Antenna Design
Triple-band antenna design for GSM and IEEE b WLAN applications
Transient fields characteristic in LTCC aperture coupled antenna due to Gaussian pulse excitation
Novel multi-band photonic-band-gap antenna design for GSM and IEEE b WLAN applications
Back-to-back CPW to stripline vertical transition
Frequency: DC - 40GHz
Insertion loss: < -0.6dB
Return loss: < -15dB
Back-to-back millimeter-wave package
Frequency: DC - 40GHz
Insertion loss: < -0.7dB
Return loss: < -15dB
Wide-band array antenna design for IEEE
WLAN and LMDS applications
Fabricated LTCC balun network
Applications
Miniaturized T/R module
MMIC integration