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Atlas SemiConductor Tracker final integration and commissioning Andrée Robichaud-Véronneau Université de Genève on behalf of the Atlas SCT collaboration.

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Presentation on theme: "Atlas SemiConductor Tracker final integration and commissioning Andrée Robichaud-Véronneau Université de Genève on behalf of the Atlas SCT collaboration."— Presentation transcript:

1 Atlas SemiConductor Tracker final integration and commissioning Andrée Robichaud-Véronneau Université de Genève on behalf of the Atlas SCT collaboration

2 Outline ● The Atlas and SCT detectors ● Detector integration and commissioning on surface ● DAQ & DCS ● Noise studies ● Cosmics data ● Detector commissioning underground ● DAQ & DCS ● Noise studies ● Conclusions and Outlook RD07 – Firenze, Italia 2

3 A Toroidal Lhc ApparatuS ● The Atlas Detector is divided into several subdetectors ● Out of them, 2 systems are using silicon sensors technologies: ● SCT ● Pixels RD07 – Firenze, Italia 3

4 The Inner Detector Tracking in Atlas TRT: 96 modules + 28 wheels Straw tubes SCT: 4 layers + 18 disks Si strips Pixels: 3 layers + 6 disks Si pixels Covers from R=5 cm up to R=1.2 m and sits inside a 2 T magnetic field provided by a superconducting solenoid. RD07 – Firenze, Italia 4

5 A factual tour... 61 m 2 of Si resulting in 6.2 million readout channels Barrel : 2112 double-sided modules (1 type), coverage |  |<1.1-1.4 End-Cap : 1976 double-sided modules (4 types), coverage 1.1-1.4<|  |<2.5 Operation temperature : -7 o C (on the Si sensor) Radiation hardness : 2x10 14 1-MeV neutron equivalent · cm -2 (10 years LHC) Low material budget Modules : double-sided, with optical communication (CLK/COM)  Power consumption : 5.6 W/module (10 W after 10 years of LHC) RD07 – Firenze, Italia 5 The SemiConductor Tracker

6 RD07 – Firenze, Italia 6 1. 4 p-on-n sensors (285 mm thick) from Hamamatsu, strip length = 12 cm pitch = 80 mm 2. Maximum bias voltage = 500 V 3. 12 binary ABCD readout chips (6 on each side, radiation hard DMILL technology) on Cu/Polyimide flexible circuit hybrid 4. Stereo angle = 40 mrad 5. Be central TPG (thermal pyrolithic graphite) baseboard for sensor cooling and mechanical base 6. Connector for power and data The End-Cap modules are similar except for geometry (4 types of wedge-shaped modules depending on position) The barrel module

7 RD07 – Firenze, Italia 7 Barrel Assembly ● Modules assembled into Barrel in Oxford ● Mounted by a Robot on 4 carbon fiber lightweight barrels ● Cu/Ni cooling pipe running along the modules (70 mm wall thickness using C 3 F 8 as coolant ● Modules serviced by Kapton/Al low-mass tapes (LMT) for power

8 RD07 – Firenze, Italia 8 Reception testing Single barrel tests after reception at CERN Dec 2004-July 2005 Were tested: ● Cooling uniformity + stability ● DAQ & DCS operations ● Noise performance ● Signal response Results: Module condition unchanged compared to module production

9 RD07 – Firenze, Italia 9 Individual barrels received at CERN and assembled into one SCT Barrel 4-barrel Assembly

10 RD07 – Firenze, Italia 10 ID barrel integration

11 RD07 – Firenze, Italia 11 ID combined tests

12 RD07 – Firenze, Italia 12 DAQ/DCS

13 RD07 – Firenze, Italia 13 Barrel Noise Results

14 RD07 – Firenze, Italia 14 EC reception tests

15 RD07 – Firenze, Italia 15 EC C Combined testing

16 RD07 – Firenze, Italia 16 EC C Results

17 RD07 – Firenze, Italia 17 ID integration

18 RD07 – Firenze, Italia 18 ID integration

19 RD07 – Firenze, Italia 19 ID integration

20 RD07 – Firenze, Italia 20 ID integration in ATLAS

21 RD07 – Firenze, Italia 21 ID integration

22 RD07 – Firenze, Italia 22 ID integration

23 RD07 – Firenze, Italia 23 ID integration

24 RD07 – Firenze, Italia 24 Noise occupancy

25 RD07 – Firenze, Italia 25 Conclusion and Outlook


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