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On the way to multidimensional Inspection and Test The paradigm change of electrical test by ESA © GOEPEL electronic 2013 Exlusive presentation for UK.

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Presentation on theme: "On the way to multidimensional Inspection and Test The paradigm change of electrical test by ESA © GOEPEL electronic 2013 Exlusive presentation for UK."— Presentation transcript:

1 On the way to multidimensional Inspection and Test The paradigm change of electrical test by ESA © GOEPEL electronic 2013 Exlusive presentation for UK Tech Days in Duxford, March 14th Presenter: Thomas Wenzel (t.wenzel@goepel.com)

2 1234 March 201322 1 2 3 The trend to multidimensions Embedded System Access View on Product Technologies Presentation Contents 4Summary and conclusions 1234 UK Tech Days

3 1234 March 201333 Inspections entering the third dimension UK Tech Days 3D Solder Paste Inspection (SPI) 3D Automated Optical Inspection (AOI) 3D Automated X-Ray Inspection (AXI) 1

4 1234 March 201344 Motivation background (1) UK Tech Days Maximizing fault coverage Evolution to true measurement systems Target of 100% Inspection 1

5 1234 March 201355 Motivation background (2) UK Tech Days Detection of new failure phenomens Continuous packaging innovations Compliance to IPC Std. like IPC-A610 1

6 1234 March 201366 The evolution to 3D Inspection enables a new generation of manufacturing process sensors But what about new dimensions for test ? UK Tech Days 1

7 1234 March 201377 2Embedded System Access 2 UK Tech Days

8 1234 8 Classification of Access strategies March 2013 Embedded System Access (ESA) JTAG/Boundary Scan Processor Emulation Test Chip Embedded Instruments Embedded Diagnostics Test In-System Programming Core Assisted Programming Intrusive Board Access (IBA) In-Circuit-Test Manufacturing Defects Analyser Flying Probe Test In-Circuit-Emulation Probe based T&M Instruments Native Connector Access (NCA) Functional Test Performance Test Hot Mock Up Test System Bus Emulation Monitoring Run-In Test Unit Under Test UK Tech Days 2

9 1234 9 Test Problem #1: ACCESS Intrusive Access In-Circuit Test Intrusive Access Flying Prober Native Connector Access Paradigm change decade Embedded System Access Access Quality 199x198x200x202x201x PTH/LSISMT/VLSIBGA/ULSICSP/WSI March 2013 UK Tech Days 2

10 1234 10 The paradigm change March 2013 UK Tech Days From intrusive nail access towards 2

11 1234 March 201311 New Philosophy : Embedded System Access UK Tech Days GOEPEL‘s new holistic product philosophy for embedded test and programming 2

12 1234 12 The ESA transformation process March 2013 From normal functional operation towards an embedded Tester UK Tech Days 2

13 1234 March 201313 Classification of embedded access standards Digital Test Analog Test Application Test of digital networks and circuits Test of analog components and network Description Advanced Digital TestTest of advanced digital network Standard Chip level Test Embedded Instruments Memory Access Test System Level Test Emulation Unattractive PLD Programming Emulation Embedded Core Test Control of embedded test instruments Static Component Interconnection Test Hierarchical embedded system level test Advanced two wire debug Interface Multi Level debug Interface (NEXUS) Unattractive Concurrent In-System-Programming In-System-Programming (ISP) IEEE P1687 IEEE 1581 S-JTAG (P) Unattractive IEEE 1532 IEEE-ISTO 5001 JESD 72 IEEE 1149.7 Selective Pin ToggleIntercon Test to passive components Chip level Test3D Chip Test IEEE P1838 IEEE 1500 IEEE P1149.8.1 IEEE 1149.6 IEEE 1149.4 IEEE 1149.1 UK Tech Days 2

14 1234 March 2013 Overview of ESA Technologies 14 Processor Emulation Test Boundary Scan Test System Level JTAG FPGA Assisted Test Embedded Diagnostics Test FPGA Assisted Programming Core Assisted Programming In System Programming 14 UK Tech Days 2

15 1234 March 201315 ESA enables multidimensional ackquisition and test of electrical, logical, functional thermal and other parameters direct in the design The chip, board and unit embedded instruments can see what the silicon can see UK Tech Days 2

16 1234 March 201316 3View on Product Technologies 3 UK Tech Days

17 1234 March 201317 The two fundamental Technologies Technology to control Chip Embedded Instruments and FPGA Embedded Instruments (Soft IP) Universal Frequency Measurement RAM Access Test Standard Flash Programming Boot Flash Programming Bit Error Rate Test (BERT) Voltage and Temperature UK Tech Days 3 Technology for transforming the µP via the Debug Port into a native test and programming instrument ARM core based MCU Renesas MCU Infineon MCU Texas Instruments MCU/DSP Freescale MCU Intel Processors (comming soon)

18 1234 18 Processor Emulation Test On-Chip Resources JTAG TAP µP Core Embedded Flash Complex Bus I/F Legacy Bus I/F Legacy I/O Ports System Bus I/F External Bus Devices Flash Components SRAM / DRAM Peripheral I/O Ports Peripheral Bus I/F Aux Resources VarioTAP Control System Access by the native processor debug Interface Conversion of the µP core into an JTAG remote controlled ATE Use of the design embedded tester with real time speed No operating system and booting needed No special Flash image need to be programmed Considerations 3 March 2013 UK Tech Days

19 1234 Overview of ChipVORX applications March 201319 Clock Line ChipVORX IP‘s for FPGA assisted test and FPGA assisted programming are soft cores downloaded and controlled via JTAG TAP Universal Frequency Measurement IP RAM Access Test IP Bit Error Rate Test IP Flash Programming IP FPGA TAP Clock Generator Gbit I/O Device Gbit Link Flash Device Adress/ Data / Ctrl. RAM Device IP = Intellectual Property UK Tech Days 3

20 1234 March 201320 BERT application UK Tech Days Based on own FPGA IP developments Support for Peer to Peer (single lane) and Loop back applications Support for automated production test (Script command controlled) Support for interactive eye measurements (no synthesis necessary) 3

21 1234 March 201321 4Summary and conclusions 4 UK Tech Days

22 1234 22 UK Tech Days Summary New ESA Technologies… Are the next generation test and programming strategies for complex boards Enabling higher test coverage at lower cost by design integrated test electronics Can be used throughout the entire design hierarchy and the entire product life cycle March 2013 4

23 1234 23 UK Tech Days Conclusion New ESA Technologies… Are complementary to 3D inspec- tion to improve process monitoring by physical and electrical sensors Can be excellent combined with other intrusive or functional test strategies to maximize coverage Will become dominant longer term due to increased design complexity and continuous new Standards. March 2013 4

24 1234 24 Thank you for your attention. Any Questions? For further information please use the following contact information Website www.goepel.comwww.goepel.com Emailt.wenzel@goepel.com UK Tech Days


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