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DAQ ELECTRONICS 18 March 2015MEG Collaboration Meeting, Tokyo Stefan Ritt.

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Presentation on theme: "DAQ ELECTRONICS 18 March 2015MEG Collaboration Meeting, Tokyo Stefan Ritt."— Presentation transcript:

1 DAQ ELECTRONICS 18 March 2015MEG Collaboration Meeting, Tokyo Stefan Ritt

2 Activities WD2 ADC Firmware – ADC readout did not work at 80 MHz – ADC readout finally works at 50 MHz – Final ADC LTM9010 runs with 2 lanes @ 50MHz WD2 8 MB flash memory access implemented – Upgrade FPGA firmware – MSCB parameters – DRS4 calibration Work on trigger firmware merging 18 March 2015MEG Collaboration Meeting, Tokyo

3 Activities 2 WD2 High voltage – Issue with voltage divider fixed – Issue with current measurement fixed – MSCB firmware for WD2 board written – Extension planned with temperature measurement Create Management Board – Firmware completed Over-temperature trip Stuck fan alarm Power cycle fore each individual board Firmware programming of WD2 Production of 4 crates + 4 CMB + 5 WDB 18 March 2015MEG Collaboration Meeting, Tokyo

4 Old HV schematics 18 March 2015MEG Collaboration Meeting, Tokyo High potential I parasitic

5 High impedance buffer 18 March 2015MEG Collaboration Meeting, Tokyo

6 Negative supply needed for opamp 18 March 2015MEG Collaboration Meeting, Tokyo

7 Current measurement 18 March 2015MEG Collaboration Meeting, Tokyo Current (  A)

8 Cockroft-Walton Spice Model 18 March 2015MEG Collaboration Meeting, Tokyo 1mA = 16 * 60 uA

9 CW Startup 18 March 2015MEG Collaboration Meeting, Tokyo

10 Function of Filter 18 March 2015MEG Collaboration Meeting, Tokyo 1 mV

11 Hardware modifications 18 March 2015MEG Collaboration Meeting, Tokyo Cockroft-Walton DC-DC converter Buffer

12 MSCB interface WD2 standalone board looks like a MSCB device (submaster+node) WD2 in crate will get MSCB commands through backplane Normal “msc” tool can be used Base voltage is set to channel with minimum voltage Settings > base + 5V are not accepted 18 March 2015MEG Collaboration Meeting, Tokyo

13 WD2 High Voltage 18 March 2015MEG Collaboration Meeting, Tokyo

14 WD2 High Voltage 18 March 2015MEG Collaboration Meeting, Tokyo

15 WD2 High Voltage 18 March 2015MEG Collaboration Meeting, Tokyo +/- 1mV

16 0-5 V Accuracy AD5590 18 March 2015MEG Collaboration Meeting, Tokyo

17 New DAC 18 March 2015MEG Collaboration Meeting, Tokyo Replace 16 channel AD5590 (ADC+DAC) with DAC 2 x LTC2656-12 ADC 1 x LTC2494

18 Noise from 5 V DC-DC converter 18 March 2015MEG Collaboration Meeting, Tokyo 160 mV

19 Firmware Upgrade 18 March 2015MEG Collaboration Meeting, Tokyo FPGA SPI Flash 8 MB SPI Flash 8 MB Boot logic User logic MSCB Core Ethernet Network JTAG Programmer JTAG Download: 12’ 40” (> 3h/crate) MSCB Download: 1’ 04” (17’ /crate)

20 Temperature Measurements

21 Temperature Sensor Extension 18 March 2015MEG Collaboration Meeting, Tokyo accuracy ±0.5 ∘ 3 CHF 1-16 sensors per WD2 board with only one coaxial cable accuracy ±0.5 ∘ 3 CHF 1-16 sensors per WD2 board with only one coaxial cable

22 Daisy Chaining DS28EA00 18 March 2015MEG Collaboration Meeting, Tokyo Connect PIOA of sensor to PIOB of next sensor (PCB?) Address sensor with PIOB=low Set PIOA of that sensor to high and disable sensor Address next sensor with PIOB=low → all sensors can be addressed sequentially

23 Temperature Sensor Extension 18 March 2015MEG Collaboration Meeting, Tokyo SiPM Temp. Sensor

24 Alternative Sensor Extension 18 March 2015MEG Collaboration Meeting, Tokyo SiPM Temp. Sensor Single sensor current loop (analog: 1  A / K) AD592

25 Schedule Update 18 March 2015MEG Collaboration Meeting, Tokyo Crate ready middle Nov.

26 Schedule Firmware takes much longer than anticipated – More complex (Processor, Ethernet, ADC interface) – Some things go faster, others slower – Another engineer is involved – Full hardware can only be tested when firmware is ready – Full crate ready for beam time ? 18 March 2015MEG Collaboration Meeting, Tokyo

27 Schedule options Absolutely important to have a good number of channels ready for beam time How to speed up / fallback plan – Move trigger firmware integration to a later point (have just a “wired or” for the beam time, don’t need TCB) – If DCB won’t fully work, just pass raw packets to Ethernet in DCB (no DCB CPU needed) – If SERDES won’t work until beam time, use Ethernet of individual boards for readout + “Aliko trigger” – only showstopper left: noise on WD boards 18 March 2015MEG Collaboration Meeting, Tokyo

28 18 March 2015MEG Collaboration Meeting, Tokyo Had a good start with the crate … Let’s cross fingers that we continue like that!


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